多层壳体粘接装置设计与精度控制技术研究
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摘要
多层壳体组件是某产品中的关键零部件，它采用胶粘技术由各层壳体粘接而成。多层壳体组件具有尺寸精度高、形位公差要求严、粘接难度大等特点。现行多层壳体粘接工艺采用手工操作，虽能满足产品加工质量的要求，但存在产品质量不能稳定保证、可靠性较差、固化监控手段落后等缺点。本文对多层壳体零部件的工艺特点及现行粘接工艺进行深入分析，围绕多层壳体粘接装置设计及精度控制技术展开研究，具体内容如下：
首先，简要叙述了粘接的基本原理、粘接工艺的一般过程，重点介绍配胶、涂胶、晾置、固化等工艺过程，分析影响粘接质量的因素及提高粘接质量的控制技术。对曲面多层壳体零部件的特点进行分析，并采用有限元方法分析多层壳体在真空压力作用下的变形情况。详细介绍了多层壳体现行手工粘接的工艺过程，分析粘接过程的特点及手工操作存在的问题。
其次，为提高多层壳体粘接质量，实现固化过程的实时监测，本文根据多层壳体粘接的功能需求，设计了两套粘接装置总体方案。经对比，提出利用T4280双柱坐标镗床作为研制粘接装置的工作平台，进行多层壳体粘接装置的总体设计。分析了粘接装置的结构特点及工作原理，并对组成该装置的支撑承重机构、外层壳体吸具、旋转机构、内层壳体吸具、传感器定位机构等机械机构和测试系统进行设计。
第三，多层壳体粘接计算机监测系统由光栅传感器、光栅数显表、多串口数据采集卡、计算机等组成，介绍了光栅传感器、数显表及数据采集卡的
四川大学工程硕士论文摘要
相关技术指标。针对多层壳体粘接装置测量与固化过程中的实时监测的技术
需求，制定程序流程图，在WindowS 2000环境下用VC十十6.0编制了数据采集、
处理程序。计算机数据采集采用异步串行通信方式，在WindowS2000中使用
win32 API函数实现对RS232串口的访问，其过程为打开串口、设置串口、数
据读写、关闭串口等。数据处理与误差判断采用三点定圆法实现多层壳体粘
接时的精确定位，并实现固化过程的实时监测。
最后，以T4280双柱坐标幢床作为整个粘接装置的实验平台，制定了详
细的装置安装技术要求、粘接技术规范以及粘接前的各项准备工作细则。设
计并加工了多层壳体模拟实验件，进行多层壳体粘接过程的定位、装夹、均
匀布胶、位置监测等多种功能的分系统试验及集成演示试验。对实验过程中
存在的密封、传感器定位、粘接壳体间位置的校正、数据采集与处理程序及
传感器精度稳定性等问题作了详细分析，并提出了相应的改进方案。
In certain productions, multilayer shells assembly is the key components. Multilayer shells are bonded by stickiness technology. Multiplayer shells assembly have characteristic, which are high dimension precision, strict form and position tolerance, difficult bond technology and etc. At present, the bond technology for multilayer shells is operated by hand, which can be satisfied with production quality request. But there were some disadvantages that are instability production quality, poor reliability and behindhand solidify monitor method. In this dissertation, the present bond technology and the technology feature of multilayer shells are analyzed in particular. The research is deployed about multilayer shells bond device design and precision control technology. The main contents of this dissertation can be described as follows.
Firstly, the bond basic principle and the common course of bond technology are briefly recounted. The technology course of preparing adhesives, gelatinize, dry by airing and solidify are particularly introduced. The factors, which influence bond quality, and the control technology's, which can improve bond quality, are analyzed. The characteristic of multilayer shells assembly is analyzed. At the action of vacuum press, multilayer shells distortion is analyzed with finite element method. Multilayer shells bond technology course, which can be operated by hand, is particularly introduced. The characteristic of bond course, the excellence and disadvantage of handwork operation are analyzed.
Secondly, in order to improve multilayer shells bond quality and realize real time monitor in solidify course, two overall bond device projects are designed which based on the bond function requirement of multilayer shells. By contrast, multilayer shells bond device is designed which the T4280 twin columns coordinate boring lathe is used as the bond device labor flat roof. The structure characteristic and working principle are analyzed. The mechanical system, which is made up of support bearing machine, outer-layer shells inspiratory machine, rotary machine, inner-layer shells inspiratory machine, sensor orientation machine and etc, are particularly designed.
Thirdly, the test and monitor system of multilayer shells is made up of grating sensors, grating numeral display instruments, multi-serial ports data collect card and computer and etc. The correlative technology of grating sensors, numeral display instruments and data collect card are introduced. Based on the multilayer shells device test and the real time monitor technology request in solidify course, the program flow chart is instituted. The data collect and disposal program are designed with VC++6.0 in Windows2000 environment. Computer data collect use asynchronous serial ports to communicate. The Win32 API functions are used to access RS232 serial ports in Windows2000. Accessing course has open serial ports, setting serial ports, data read and write, close serial ports. Data disposal and tolerance estimation use three points to confirm a circle to realize the accurate orientation for multilayer shells and the real time monitor at solidify course when they are bonded.
Lastly, the T4280 twin columns coordinate boring lathe is used as experimentation flat roof for whole bond device. The detailed device installing technology request, bond technology criterion and each preparing work detailed rules before bond are established. The simulation experimentation workpieces of multilayer shell were designed and machined. At multilayer shells bond course, the different system experimentations and integration demo experimentation are operated which are made up of orientation, install and clamp, equality gelatinize, location monitor and etc. In experimentation course, the existent questions are
particularly analyzed which are airproof, sensor orientation, bond location emendation of multilayer shells, data collect and disposal program, sensor reliability and etc. The better projects are brought forward for questions.
首先，简要叙述了粘接的基本原理、粘接工艺的一般过程，重点介绍配胶、涂胶、晾置、固化等工艺过程，分析影响粘接质量的因素及提高粘接质量的控制技术。对曲面多层壳体零部件的特点进行分析，并采用有限元方法分析多层壳体在真空压力作用下的变形情况。详细介绍了多层壳体现行手工粘接的工艺过程，分析粘接过程的特点及手工操作存在的问题。
其次，为提高多层壳体粘接质量，实现固化过程的实时监测，本文根据多层壳体粘接的功能需求，设计了两套粘接装置总体方案。经对比，提出利用T4280双柱坐标镗床作为研制粘接装置的工作平台，进行多层壳体粘接装置的总体设计。分析了粘接装置的结构特点及工作原理，并对组成该装置的支撑承重机构、外层壳体吸具、旋转机构、内层壳体吸具、传感器定位机构等机械机构和测试系统进行设计。
第三，多层壳体粘接计算机监测系统由光栅传感器、光栅数显表、多串口数据采集卡、计算机等组成，介绍了光栅传感器、数显表及数据采集卡的
四川大学工程硕士论文摘要
相关技术指标。针对多层壳体粘接装置测量与固化过程中的实时监测的技术
需求，制定程序流程图，在WindowS 2000环境下用VC十十6.0编制了数据采集、
处理程序。计算机数据采集采用异步串行通信方式，在WindowS2000中使用
win32 API函数实现对RS232串口的访问，其过程为打开串口、设置串口、数
据读写、关闭串口等。数据处理与误差判断采用三点定圆法实现多层壳体粘
接时的精确定位，并实现固化过程的实时监测。
最后，以T4280双柱坐标幢床作为整个粘接装置的实验平台，制定了详
细的装置安装技术要求、粘接技术规范以及粘接前的各项准备工作细则。设
计并加工了多层壳体模拟实验件，进行多层壳体粘接过程的定位、装夹、均
匀布胶、位置监测等多种功能的分系统试验及集成演示试验。对实验过程中
存在的密封、传感器定位、粘接壳体间位置的校正、数据采集与处理程序及
传感器精度稳定性等问题作了详细分析，并提出了相应的改进方案。
In certain productions, multilayer shells assembly is the key components. Multilayer shells are bonded by stickiness technology. Multiplayer shells assembly have characteristic, which are high dimension precision, strict form and position tolerance, difficult bond technology and etc. At present, the bond technology for multilayer shells is operated by hand, which can be satisfied with production quality request. But there were some disadvantages that are instability production quality, poor reliability and behindhand solidify monitor method. In this dissertation, the present bond technology and the technology feature of multilayer shells are analyzed in particular. The research is deployed about multilayer shells bond device design and precision control technology. The main contents of this dissertation can be described as follows.
Firstly, the bond basic principle and the common course of bond technology are briefly recounted. The technology course of preparing adhesives, gelatinize, dry by airing and solidify are particularly introduced. The factors, which influence bond quality, and the control technology's, which can improve bond quality, are analyzed. The characteristic of multilayer shells assembly is analyzed. At the action of vacuum press, multilayer shells distortion is analyzed with finite element method. Multilayer shells bond technology course, which can be operated by hand, is particularly introduced. The characteristic of bond course, the excellence and disadvantage of handwork operation are analyzed.
Secondly, in order to improve multilayer shells bond quality and realize real time monitor in solidify course, two overall bond device projects are designed which based on the bond function requirement of multilayer shells. By contrast, multilayer shells bond device is designed which the T4280 twin columns coordinate boring lathe is used as the bond device labor flat roof. The structure characteristic and working principle are analyzed. The mechanical system, which is made up of support bearing machine, outer-layer shells inspiratory machine, rotary machine, inner-layer shells inspiratory machine, sensor orientation machine and etc, are particularly designed.
Thirdly, the test and monitor system of multilayer shells is made up of grating sensors, grating numeral display instruments, multi-serial ports data collect card and computer and etc. The correlative technology of grating sensors, numeral display instruments and data collect card are introduced. Based on the multilayer shells device test and the real time monitor technology request in solidify course, the program flow chart is instituted. The data collect and disposal program are designed with VC++6.0 in Windows2000 environment. Computer data collect use asynchronous serial ports to communicate. The Win32 API functions are used to access RS232 serial ports in Windows2000. Accessing course has open serial ports, setting serial ports, data read and write, close serial ports. Data disposal and tolerance estimation use three points to confirm a circle to realize the accurate orientation for multilayer shells and the real time monitor at solidify course when they are bonded.
Lastly, the T4280 twin columns coordinate boring lathe is used as experimentation flat roof for whole bond device. The detailed device installing technology request, bond technology criterion and each preparing work detailed rules before bond are established. The simulation experimentation workpieces of multilayer shell were designed and machined. At multilayer shells bond course, the different system experimentations and integration demo experimentation are operated which are made up of orientation, install and clamp, equality gelatinize, location monitor and etc. In experimentation course, the existent questions are
particularly analyzed which are airproof, sensor orientation, bond location emendation of multilayer shells, data collect and disposal program, sensor reliability and etc. The better projects are brought forward for questions.
引文
【1】岳晓斌、孔金星．多层壳体粘接装置结构设计及实验研究．中国工程物理研究院机械工程 2003年学术年会．2003．10；
【2】孔金星、岳晓斌．曲面多层壳体粘接精度控制技术研究及粘接装置设计．中国工程物理研究院机械工程 2002年学术年会．2002．10；
【3】孔金星、岳晓斌．曲面多层壳体粘接精度控制技术研究．工具技术．2003．6；
【4】翟海潮，李应伯，林新松等．粘接与表面粘涂技术．北京：化学工业出版社．1997．8；
【5】李子东．实用胶粘技术．北京：新时代出版社．1992．5；
【6】周雍鑫等．胶粘剂、粘接技术实用问答．北京：机械工业出版社．2001．1；
【7】柏柳青，黄绪桥等．先进无机材料粘接与联接研究的进展．湖北化工．1994．4；
【8】余云照．粘接技术的回顾与展望．粘接．1999．增刊；
【9】翁熙详．粘接理论研究的一些新进展．中国胶粘剂．1999．VOL18．NO．5；
【10】樊建军．粘接技术的应用．粘接．1995．VOL16．NO．3；
【11】胡亿沩．粘接技术应用实例五则．粘接．1997．VOL18．NO．4；
【12】尹华丽，王清和．界面粘接性能的影响因素．1998．VOL21．NO．3；
【13】沪村知之．粘接的界面化学．粘接．2002．23(1)；
【14】王宏．粘接工艺失效分析．黄金学报．2000．VOL2．NO．2；
【15】肖海文．胶接失效原因初探及对底胶工艺的再认识．粘接．1997．VOL18．NO．5；
【16】周定沛．内应力与粘接质量的稳定性．粘接．1996．VOL17．NO．6；
【17】郝平，盛贤君等．天线罩内廓几何参数测量系统的数据采集软件设计．中国工程物理研究院机械工程专项学术交流会论文集．2002．7；
【18】徐灏等．机械设计手册．北京：机械工业出版社．1992；
【19】李科杰．新编传感器技术手册．北京：国防工业出版社．2002．1；
【20】卢金鼎．机电一体化技术．中国轻工业出版社．1996；
【21】冯之敬．机电一体化技术手册(上下)．机械工业出版社．1999．7；
【22】王启义．中国机械设计大典．江西科学技术出版社．2002．1；
【23】鲍国华．光栅传感器检测电路的设计．仪表技术．1997．4；
【24】杨淑连，曾兆香．光栅传感器的研究．山东工程学院学报．1998．6；
【25】陈白宁，王生力．光栅传感器测量系统前通道配置与接口设计．沈阳工业学院学报．1997．3；
【26】戴红梅，胡人杰．用VC++多线程技术实现PC串口全双工通讯．电测与仪表．2000．11；
【27】周舒．基于Visual Studio的串口通信．电子科技大学学报．2000．12；
【28】王振宇，蔡良伟．Microsoft Windows环境下串口类的封装和模拟调试．微电子学与计算机．1997．6；
【29】梅杓春，许世民．Win95下利用串口进行的网络编程．计算机工程与应用．1998．7；
【30】王梅杰、刘云．串口数据采集系统在动态测试中的应用．华北水利水电学院学报．2001．3；
【31】李阜、陈小欧．Windows环境下的串口异步通信程序设计．电子技术应用．1997．2；
【32】程细军、谭民．VC编程中的串口通信技术．计算机应用．2001．9；
【33】徐衡平、戎蒙恬．VC++下通用串口通信类的多线程实现．计算机应用．2001．6；
【34】李岩，花国梁．精密测量技术．北京：中国计量出版社．2001．9；
【35】李世阳．形位误差检测．陕西科学技术出版社．1988；
【36】熊有伦．精密测量的数学方法．中国计量出版社．1989．5；
【37】汪恺．形位公差原理和应用．机械工业出版社．1991．12；
【2】孔金星、岳晓斌．曲面多层壳体粘接精度控制技术研究及粘接装置设计．中国工程物理研究院机械工程 2002年学术年会．2002．10；
【3】孔金星、岳晓斌．曲面多层壳体粘接精度控制技术研究．工具技术．2003．6；
【4】翟海潮，李应伯，林新松等．粘接与表面粘涂技术．北京：化学工业出版社．1997．8；
【5】李子东．实用胶粘技术．北京：新时代出版社．1992．5；
【6】周雍鑫等．胶粘剂、粘接技术实用问答．北京：机械工业出版社．2001．1；
【7】柏柳青，黄绪桥等．先进无机材料粘接与联接研究的进展．湖北化工．1994．4；
【8】余云照．粘接技术的回顾与展望．粘接．1999．增刊；
【9】翁熙详．粘接理论研究的一些新进展．中国胶粘剂．1999．VOL18．NO．5；
【10】樊建军．粘接技术的应用．粘接．1995．VOL16．NO．3；
【11】胡亿沩．粘接技术应用实例五则．粘接．1997．VOL18．NO．4；
【12】尹华丽，王清和．界面粘接性能的影响因素．1998．VOL21．NO．3；
【13】沪村知之．粘接的界面化学．粘接．2002．23(1)；
【14】王宏．粘接工艺失效分析．黄金学报．2000．VOL2．NO．2；
【15】肖海文．胶接失效原因初探及对底胶工艺的再认识．粘接．1997．VOL18．NO．5；
【16】周定沛．内应力与粘接质量的稳定性．粘接．1996．VOL17．NO．6；
【17】郝平，盛贤君等．天线罩内廓几何参数测量系统的数据采集软件设计．中国工程物理研究院机械工程专项学术交流会论文集．2002．7；
【18】徐灏等．机械设计手册．北京：机械工业出版社．1992；
【19】李科杰．新编传感器技术手册．北京：国防工业出版社．2002．1；
【20】卢金鼎．机电一体化技术．中国轻工业出版社．1996；
【21】冯之敬．机电一体化技术手册(上下)．机械工业出版社．1999．7；
【22】王启义．中国机械设计大典．江西科学技术出版社．2002．1；
【23】鲍国华．光栅传感器检测电路的设计．仪表技术．1997．4；
【24】杨淑连，曾兆香．光栅传感器的研究．山东工程学院学报．1998．6；
【25】陈白宁，王生力．光栅传感器测量系统前通道配置与接口设计．沈阳工业学院学报．1997．3；
【26】戴红梅，胡人杰．用VC++多线程技术实现PC串口全双工通讯．电测与仪表．2000．11；
【27】周舒．基于Visual Studio的串口通信．电子科技大学学报．2000．12；
【28】王振宇，蔡良伟．Microsoft Windows环境下串口类的封装和模拟调试．微电子学与计算机．1997．6；
【29】梅杓春，许世民．Win95下利用串口进行的网络编程．计算机工程与应用．1998．7；
【30】王梅杰、刘云．串口数据采集系统在动态测试中的应用．华北水利水电学院学报．2001．3；
【31】李阜、陈小欧．Windows环境下的串口异步通信程序设计．电子技术应用．1997．2；
【32】程细军、谭民．VC编程中的串口通信技术．计算机应用．2001．9；
【33】徐衡平、戎蒙恬．VC++下通用串口通信类的多线程实现．计算机应用．2001．6；
【34】李岩，花国梁．精密测量技术．北京：中国计量出版社．2001．9；
【35】李世阳．形位误差检测．陕西科学技术出版社．1988；
【36】熊有伦．精密测量的数学方法．中国计量出版社．1989．5；
【37】汪恺．形位公差原理和应用．机械工业出版社．1991．12；