超临界法回收印刷线路板影响因素及尾气处理研究
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摘要
科技的进步和社会的发展给人们的生活方式提供了便利,同时也带来了一系列的环境问题。在大量废弃的电子电器产品中,印刷线路板作为其中的典型代表,成为国内外众多研究机构的研究对象。
论文在总结现有废弃印刷线路板回收方法及对其综合回收性能进行可拓评价的基础上,对具有绿色环保性能的基于超临界流体技术的废印刷线路板回收方法进行了研究,并对实验影响参数和实验尾气开展了深入的研究。
选取实验影响因素为温度、混合溶剂和铜箔层数进行正交实验,数据分析表明:温度对超临界法回收印刷线路板实验的影响最显著,铜箔层数的影响次之,混合溶剂最小。另外,论文还对诸如印刷线路板样本尺寸的大小、类别和板上孔数等因素进行了实验分析,结果显示:无论尺寸大小,板型为FR-4和板上孔数少的印刷线路板样本,有利于超临界法对印刷线路板的再资源化回收。
超临界法对印刷线路处理后排放出来的尾气,如果直接排入大气中,不仅会对环境造成负面影响,而且会提高实验运行成本。论文通过对收集到的尾气样本的检测结果进行分析,了解到尾气中的主要杂质成分。在此基础上提出从分子角度筛分的方法对尾气进行净化,并完善了尾气回收设备的循环利用方案,使设备中的流体闭环运行,降低了流体的成本和提高了设备的环境友好性。
Technology's advantage and social development provide our life style convenient; meanwhile, it also comes with series of environmental problems. In the large of discarding electronic products, printed wiring board, as one of typical representation, has been studied by numerous domestic and overseas' research institutions.
On the basis of current discarding printed wiring boards' recycling methods and these methods' synthesis performance extension assessment, the method of printed wiring boards' recovery with supercritical fluid technology which is friendly to environment has been studied, and then experimental factors and tail gas have been researched in depth.
Selecting temperature, mixing solvent, copper layers' number as factors to organize orthogonal experiment, it indicates that temperature is the most remarkable factor to the printed wiring boards' recovery with supercritical fluid, copper layers' number is next remarkable, while the mixing solvent is least remarkable. Otherwise, printed wiring boards' size, type, holes' number and so on are been analyzed. It shows that no matter what size, the conditions which are FR-4 type and fewer holes on board are propitious to printed wiring boards' recovery with supercritical fluid.
After experiment, the tail gas vented to atmosphere directly is not only negative to environment, but also increase recovery cost. The main impurity's composition is gotten after tail gas samples' test and analysis. So, we can bring forward a method to clean impurity by molecular griddling, which gets tail gas processing equipment's cycle-using project perfect, also makes the supercritical fluid run in closed loop, decreases supercritical fluid's cost, and brings the whole printed wring boards recycling equipment's environmental performance friendlier.
论文在总结现有废弃印刷线路板回收方法及对其综合回收性能进行可拓评价的基础上,对具有绿色环保性能的基于超临界流体技术的废印刷线路板回收方法进行了研究,并对实验影响参数和实验尾气开展了深入的研究。
选取实验影响因素为温度、混合溶剂和铜箔层数进行正交实验,数据分析表明:温度对超临界法回收印刷线路板实验的影响最显著,铜箔层数的影响次之,混合溶剂最小。另外,论文还对诸如印刷线路板样本尺寸的大小、类别和板上孔数等因素进行了实验分析,结果显示:无论尺寸大小,板型为FR-4和板上孔数少的印刷线路板样本,有利于超临界法对印刷线路板的再资源化回收。
超临界法对印刷线路处理后排放出来的尾气,如果直接排入大气中,不仅会对环境造成负面影响,而且会提高实验运行成本。论文通过对收集到的尾气样本的检测结果进行分析,了解到尾气中的主要杂质成分。在此基础上提出从分子角度筛分的方法对尾气进行净化,并完善了尾气回收设备的循环利用方案,使设备中的流体闭环运行,降低了流体的成本和提高了设备的环境友好性。
Technology's advantage and social development provide our life style convenient; meanwhile, it also comes with series of environmental problems. In the large of discarding electronic products, printed wiring board, as one of typical representation, has been studied by numerous domestic and overseas' research institutions.
On the basis of current discarding printed wiring boards' recycling methods and these methods' synthesis performance extension assessment, the method of printed wiring boards' recovery with supercritical fluid technology which is friendly to environment has been studied, and then experimental factors and tail gas have been researched in depth.
Selecting temperature, mixing solvent, copper layers' number as factors to organize orthogonal experiment, it indicates that temperature is the most remarkable factor to the printed wiring boards' recovery with supercritical fluid, copper layers' number is next remarkable, while the mixing solvent is least remarkable. Otherwise, printed wiring boards' size, type, holes' number and so on are been analyzed. It shows that no matter what size, the conditions which are FR-4 type and fewer holes on board are propitious to printed wiring boards' recovery with supercritical fluid.
After experiment, the tail gas vented to atmosphere directly is not only negative to environment, but also increase recovery cost. The main impurity's composition is gotten after tail gas samples' test and analysis. So, we can bring forward a method to clean impurity by molecular griddling, which gets tail gas processing equipment's cycle-using project perfect, also makes the supercritical fluid run in closed loop, decreases supercritical fluid's cost, and brings the whole printed wring boards recycling equipment's environmental performance friendlier.
引文
[1]中华人民共和国国家标准.印制电路术语[s].GB/T2036-1994.北京:中国标准出版社,1995
[2]温雪峰,李金惠,朱芬芬等.我国废弃线路板的物理处理技术评述[J].矿冶,2005,14(3):58-63
[3]曾峰,侯亚宁,曾凡雨.印刷电路板(PCB)设计与制作[M].北京:电子工业出版社,2002
[4]段迎晟.印刷电路板行业研究报告[EB/OL].http://www.p5w.net/newfortune/fxs/baogao/dz/200709/P020070930498926406208.pdf
[5]印刷电路板制造业废弃物资源化案例汇编,经济部工业局(台湾),1996
[6]温雪峰.物理法回收废弃电路板中金属富集体的研究[D].博士学位论文,江苏:中国矿业大学,2004
[7]沈志刚.废印刷电路板回收处理技术进展[J].新材料产业,2006,10(12):43-46
[8]李克,高洪艳.电子垃圾:一边是危机,一边是商机[EB/OL].http://gz.cye.com.cn/news/zixun/20070411004037_2.htm
[9]刘青海,邓恩忠.电路板生产中废边料的处置方法[J].山东环境,1994,(5):22
[10]环保总局:中国一直是西方危险废物的转移受害者[EB/OL].http://www.xmnn.cn/xwzx/jsxw/200612/t20061212_80504.htm
[11]康新文.美国是电子垃圾最大制造国[EB/OL].http://www.hangzhou.com.cn/20020127/ca201476.htm
[12]刘小丽,杨建新,王如松.中国主要电子废物产生量估算[J].中国人口·资源与环境,2005,15(5):113-117
[13]环境保护法律法规和标准汇编[EB/OL].http://www.hbj.hd.gov.cn/huanbao biaozhun/epb-law.htm
[14]董卫果,路迈西,田文杰等.废旧印刷电路板资源化处理技术概述[J].中国科技论文在线,2007:1-13
[15]Ehner Theo.Integrated recycling of non-ferrous metals at Boliden ltd [J].IEEE international symposium on electronic & the environment,1998:42-47
[16]Nourreddine Menad,BoBjorkman,Shunli Zhang,et al.Thermodynamic conditions for the formation of diox in during the recycling of nonferrous metals from electric and electronic scrap[J].EPD Congress,1998:657-673
[17]Nourreddine Menad,Bo Bjorkman Eric G Allain.Combustion of plastics contained in electric and electronic scrapResources[J].Conservation and Recycling,1998,(24):65-85
[18]Klaus Gockmann.Recycling of copper[J].CIM Bulletin,1992,85(3):150-156
[19]Jens Brobech Legarth,Leo Alting,Gian Luca Baldo.Sustainability issues in circuit board recycling[J].IEEE,1995:126-131
[20]B Reimer,M S Sodhi,W A Knight.Optimizing electronics end-of-life disposal costs[J].IEEE,2000:342-347
[21]胡连荣.很多元件用黄金加工制造电子垃圾也能淘出金矿[EB/OL].http://tech.sina.com.cn/it/e/2002-03-04/104913.shtml
[22]潘君齐.基于超临界流体技术的印刷线路板再资源化工艺与方法研究[D].博士学位论文,安徽:合肥工业大学,2006
[23]Shunli Zhang,et al.Mechanical separation-oriented characterization of electronic scrap Resources[J].Conservation and Recycling,1997,21:247-269
[24]辜信实.印制电路用覆铜箔层压板[M].北京:化学工业出版社,2002,2
[25]Yokopamas,IjiM.Recycling of printed wiring board waste[J].Proceedings of 1993 IEEE / Tsukuba.International Work shop in Advanced Robotics.IEEE,1993:55-58
[26]Klaus Feldmann.Herbert Scheller.Disassembly of electronic products.Proceedings of the 1994 IEEE international symposium on electronics and environment,IEEE,1994:81-86
[27]杨红斌.电子废弃物的处理回收技术[J].中国环境科学学会学术年会优秀论文集,2006:2906-2910
[28]白庆中,王珲,韩洁等.世界废弃印刷电路板的机械处理技术现状[J].环境污染治理技术与设备,2001,2(1):84-89
[29]柴晓兰,曹亦俊,王春彦等.机械处理废弃印刷线路板[J].中国资源综合利用,2003,(2):23-26
[30]Melchioree M,Jakob R.Electronic Scrap Recycling[J].Microelectronics Journal,IEEE,1996,28(8-10):ⅹⅹⅱ-ⅹⅹⅳ
[31]Yokopamas,IjiM.Recycling of printed wiring board waste[J].Proceedings of 1993 IEEE / Tsukuba.International Work shop in Advanced Robotics.IEEE,1993:55-58
[32]翁维聪.印刷线路板废料再利用技术与处理设备介绍[J].台湾环保产业双月刊,2003,12(22):9-11
[33]吴宏富.首条年处理万吨级废旧线路板生产线通过鉴定[N].中国资源综合 利用,2005,1(1):1-2
[34]彭晓成,郑正,周培国等.电子废弃物的污染与防治现状[J].中国环境科学学会学术年会优秀论文集,2006:2911-2914
[35]Precious metals:electrowinning[EB/OL].http://www.adherent-tech.com/process_roducts.htm.1999,11
[36]雷兆武,刘茉,杨高英等.电子废弃物资源化技术现状[J].中国环境管理干部学院学报,2006,16(4):83-92
[37]杨玉芬,盖国胜,徐盛明等.废印刷线路板中稀贵金属的回收现状[J].稀有金属,2004,28(4):716-719
[38]任彦斌,夏志东,雷永平等.废弃印刷电路板回收处理技术简析[J].有色金属再生与利用,2004(8):10-12
[39]佚名.废印刷电路板及边料资源化技术[EB/OL].http://www.pcbtech.net/article/base/0H049D2007/4968.html
[40]MIHAI BREBU,THALLADA BHASKAR,KAZUYA MURAI,et al.Thermal Degradation of PE and PS Mixed with ABS-Br and Debromination of Pyrolysis Oil by Fe- and Ca-based Catalysts[J].Polymer Degradation and Stability,2004,84:459-467
[41]孙路石,陆继东,王世杰.废弃印刷线路板的热解机理及产物分析[J].燃料化学学报,2002,30(3):285-288
[42]洪大剑.废印刷电路板的回收处理技术[J].云南化工,2006,33(1):31-34
[43]佚名.等离子体处理危险废物技术[EB/OL].http://www.eedu.org.cn/Article/es/enwr/Envirtech/solidinfo/200605/8335.html
[44]张宏.国内第一台“电子垃圾分解炉”研制成功[N].中国广播网,2004,2
[45]甘舸,陈烈强,蔡明招等.线路板废渣的真空热解动力学[J].华南理工大学学报(自然科学版),2006,34(3):20-33
[46]佚名.废印刷电路板及边料资源化化技术[EB/OL].http://www.pcbtech.net/article/base/0H049D2007/4968.html
[47]约瑟夫哈约利克.电池、组装印刷电路板和电子器件的回收处理方法[P].中国专利:CN1034094,1989,7
[48]叶晓江.电子废弃物回收利用良方.环境导报,1997,(4):33-33
[49]续京.超临界水与环境保护[J].化工装备技术,2006,27(4):63-66
[50]Hongchao Zhang,Xi Ouyang.A Binary Solvent Process for Printed Circuit Board Recycling[J].Annals of the CIRP,2006,55(1):211-217
[51]H.Brandl,R.Bosshard,M.Wegmann.Computer-munching microbes:metal leaching from electronic scrap by bacteria and fungi [J].Hydrometallurgy,2001,59:319-326
[52]何涛,胡红旗,刘红波等.超临界流体技术发展及应用概述[J].江苏化工,2002,30(6):5-11
[53]漆新华,庄源益.超临界流体技术在环境科学中的应用[M].北京:科学出版社,2005
[54]尹卫萍,陈素兰.超临界流体萃取技术及其应用[J].江苏地质,2002,26(3):150-153
[55]肖建平,范崇政.超临界流体技术研究进展[J].化学进展,2001,13(2):94-101
[56]毛煜,杨峰.超临界流体技术应用进展[J].化学研究与应用,2001,13(2):111-116
[57]Laintz,K.E.,Wai,C.M.,Yonker,C.R.,Smith,R.D.Extraction of metal ions from liquid and solid materials by supercritical carbon dioxide [J].The Journal of Analytical Chemistry,1992,64(22):28-32
[58]S.Watanabe,K.Komura,S.Nagaya,H.Morita,et al.Development of Cross-Linked Polymer Material Recycling Technology by Supercritical Water [C].Proceedings of the 7th Intemational Conference on Properties and Applications of Dielectric Materials.Nagoya,2003:595-598
[59]陈青,刘志敏.超临界流体色谱的研究进展[J].分析化学,2004,32(8):1104-1109
[60]蔡建国,邓修,潘家祯.超临界流体萃取技术和设备及应用[J].化工设备与防腐蚀,2000,2:17-20
[61]潘见,张文成,谢慧明.超临界CO_2萃取结晶银杏内醋关键工艺参数研究[J].食品科学,2004,25(3):132-134
[62]朱自强.超临界流体技术-原理和应用[M].北京:化学工业出版社,2000
[63]漆新华,庄源益.超临界流体技术在环境科学中的应用[M].北京:科学出版社,2005
[64]孙路石,陆继东,王世杰等.印刷线路板废弃物的热解及其产物分析[J].燃料化学学报,2002,30(3):285-288
[65]段晨龙,赵跃民,温雪峰等.废弃电路板破碎中热解气体的研究[J].中国矿业大学学报,2005,34(6):730-734
[66]Hongtao Wang,Maya Hirahara,Motonobu Goto,et al.Extraction of flame retardants from electronic printed circuit board by supercritical carbon dioxide [J].The Journal of Supercritical Fluids,2004,29(3):251-256
[67]Abdel mnim Altwaiq,Marion Wolf,Rudi van Eldik.Extraction of brominated flame retardants from polymeric waste material using different solvents and supercritical carbon dioxide[J].Analytica Chimica Acta,2003,491(1): 111-123
[68]潘志彦,王泉源,胡自伟等.超临界流体技术在废旧塑料解聚中的应用[J].环境污染治理技术与设备,2003,8(4):51-54
[69]王汉夫,孙辉,郑玉斌等.PET在超临界甲醇和乙醇中的降解[J].吉林大学自然科学学报,2000,38(4):79-82
[70]曹维良,张敬畅,李勇.超临界流体技术在PET解聚中的应用[J].北京化工大学学报,1999,26(4):73-74
[71]张妍,孟令辉,黄玉东.超临界流体技术在塑料分解回收中的应用[J].河南化工,2002,9:1-3
[72]Tadafumi A.,Osamu S.,Latuhilo M,et al.Recovery of terephthalic acid by decomposition of PET in supercritical water[J].Kagaku Kogaku Ronbushu,1997,(23):505-511
[73]何爱军.材料力学测试原理及基本实验[M].北京:北方工业大学出版社,2001
[74]丛浦珠,苏克曼.质谱分析(分析化学手册)[M].北京:科学出版社,2000
[75]季欧,李玉柱.质谱分析法(下册)[M].北京:原子能出版社,1988
[76]F·W·麦克拉弗蒂.质谱解析(第三版)[M].美国,1987
[77]练振琼,王正富.有机质谱解析[M].北京:化学工业出版社,1990
[78]刘志峰,胡张喜,孔祥明等.基于超临界流体的印刷线路板资源化方法研究[J].环境工程学报,2007,12(1):114-119
[79]银建中,原华山,李志义等.超临界流体萃取固体物料的动力学模型[J].化学工业与工程技术,2001,5(22):14-19
[80]刘毅,银建中,刘润杰.超临界流体萃取的固态物料动力学模型研究进展[J].化工装备技术,2005,26(3):26-31
[81]胡张喜.基于超临界流体技术的印刷线路板回收实验及机理研究[D].硕士学位论文,安徽:合肥工业大学,2007
[82]巫协森.回收废弃印刷电路板的方法[P].中国专利:200610002019.5,2007,8
[831陈诚.覆铜箔层压板尺寸胀缩变化剖析[J].印制电路信息,2003,(11):27-29
[84]刘瑾.PCB制造过程中基材胀缩之形成机理及其控制[D].硕士学位论文,上海:华东理工大学,2005
[85]王湛,周狲.膜分离技术基础[M].北京:北京:化工出版社,2006
[86]陈勇,王从厚,吴鸣.气体膜技术与应用[M].北京:化学工业出版社,2004
[87]任建新.膜分离技术及其应用[M].北京:化学工业出版社,2003
[2]温雪峰,李金惠,朱芬芬等.我国废弃线路板的物理处理技术评述[J].矿冶,2005,14(3):58-63
[3]曾峰,侯亚宁,曾凡雨.印刷电路板(PCB)设计与制作[M].北京:电子工业出版社,2002
[4]段迎晟.印刷电路板行业研究报告[EB/OL].http://www.p5w.net/newfortune/fxs/baogao/dz/200709/P020070930498926406208.pdf
[5]印刷电路板制造业废弃物资源化案例汇编,经济部工业局(台湾),1996
[6]温雪峰.物理法回收废弃电路板中金属富集体的研究[D].博士学位论文,江苏:中国矿业大学,2004
[7]沈志刚.废印刷电路板回收处理技术进展[J].新材料产业,2006,10(12):43-46
[8]李克,高洪艳.电子垃圾:一边是危机,一边是商机[EB/OL].http://gz.cye.com.cn/news/zixun/20070411004037_2.htm
[9]刘青海,邓恩忠.电路板生产中废边料的处置方法[J].山东环境,1994,(5):22
[10]环保总局:中国一直是西方危险废物的转移受害者[EB/OL].http://www.xmnn.cn/xwzx/jsxw/200612/t20061212_80504.htm
[11]康新文.美国是电子垃圾最大制造国[EB/OL].http://www.hangzhou.com.cn/20020127/ca201476.htm
[12]刘小丽,杨建新,王如松.中国主要电子废物产生量估算[J].中国人口·资源与环境,2005,15(5):113-117
[13]环境保护法律法规和标准汇编[EB/OL].http://www.hbj.hd.gov.cn/huanbao biaozhun/epb-law.htm
[14]董卫果,路迈西,田文杰等.废旧印刷电路板资源化处理技术概述[J].中国科技论文在线,2007:1-13
[15]Ehner Theo.Integrated recycling of non-ferrous metals at Boliden ltd [J].IEEE international symposium on electronic & the environment,1998:42-47
[16]Nourreddine Menad,BoBjorkman,Shunli Zhang,et al.Thermodynamic conditions for the formation of diox in during the recycling of nonferrous metals from electric and electronic scrap[J].EPD Congress,1998:657-673
[17]Nourreddine Menad,Bo Bjorkman Eric G Allain.Combustion of plastics contained in electric and electronic scrapResources[J].Conservation and Recycling,1998,(24):65-85
[18]Klaus Gockmann.Recycling of copper[J].CIM Bulletin,1992,85(3):150-156
[19]Jens Brobech Legarth,Leo Alting,Gian Luca Baldo.Sustainability issues in circuit board recycling[J].IEEE,1995:126-131
[20]B Reimer,M S Sodhi,W A Knight.Optimizing electronics end-of-life disposal costs[J].IEEE,2000:342-347
[21]胡连荣.很多元件用黄金加工制造电子垃圾也能淘出金矿[EB/OL].http://tech.sina.com.cn/it/e/2002-03-04/104913.shtml
[22]潘君齐.基于超临界流体技术的印刷线路板再资源化工艺与方法研究[D].博士学位论文,安徽:合肥工业大学,2006
[23]Shunli Zhang,et al.Mechanical separation-oriented characterization of electronic scrap Resources[J].Conservation and Recycling,1997,21:247-269
[24]辜信实.印制电路用覆铜箔层压板[M].北京:化学工业出版社,2002,2
[25]Yokopamas,IjiM.Recycling of printed wiring board waste[J].Proceedings of 1993 IEEE / Tsukuba.International Work shop in Advanced Robotics.IEEE,1993:55-58
[26]Klaus Feldmann.Herbert Scheller.Disassembly of electronic products.Proceedings of the 1994 IEEE international symposium on electronics and environment,IEEE,1994:81-86
[27]杨红斌.电子废弃物的处理回收技术[J].中国环境科学学会学术年会优秀论文集,2006:2906-2910
[28]白庆中,王珲,韩洁等.世界废弃印刷电路板的机械处理技术现状[J].环境污染治理技术与设备,2001,2(1):84-89
[29]柴晓兰,曹亦俊,王春彦等.机械处理废弃印刷线路板[J].中国资源综合利用,2003,(2):23-26
[30]Melchioree M,Jakob R.Electronic Scrap Recycling[J].Microelectronics Journal,IEEE,1996,28(8-10):ⅹⅹⅱ-ⅹⅹⅳ
[31]Yokopamas,IjiM.Recycling of printed wiring board waste[J].Proceedings of 1993 IEEE / Tsukuba.International Work shop in Advanced Robotics.IEEE,1993:55-58
[32]翁维聪.印刷线路板废料再利用技术与处理设备介绍[J].台湾环保产业双月刊,2003,12(22):9-11
[33]吴宏富.首条年处理万吨级废旧线路板生产线通过鉴定[N].中国资源综合 利用,2005,1(1):1-2
[34]彭晓成,郑正,周培国等.电子废弃物的污染与防治现状[J].中国环境科学学会学术年会优秀论文集,2006:2911-2914
[35]Precious metals:electrowinning[EB/OL].http://www.adherent-tech.com/process_roducts.htm.1999,11
[36]雷兆武,刘茉,杨高英等.电子废弃物资源化技术现状[J].中国环境管理干部学院学报,2006,16(4):83-92
[37]杨玉芬,盖国胜,徐盛明等.废印刷线路板中稀贵金属的回收现状[J].稀有金属,2004,28(4):716-719
[38]任彦斌,夏志东,雷永平等.废弃印刷电路板回收处理技术简析[J].有色金属再生与利用,2004(8):10-12
[39]佚名.废印刷电路板及边料资源化技术[EB/OL].http://www.pcbtech.net/article/base/0H049D2007/4968.html
[40]MIHAI BREBU,THALLADA BHASKAR,KAZUYA MURAI,et al.Thermal Degradation of PE and PS Mixed with ABS-Br and Debromination of Pyrolysis Oil by Fe- and Ca-based Catalysts[J].Polymer Degradation and Stability,2004,84:459-467
[41]孙路石,陆继东,王世杰.废弃印刷线路板的热解机理及产物分析[J].燃料化学学报,2002,30(3):285-288
[42]洪大剑.废印刷电路板的回收处理技术[J].云南化工,2006,33(1):31-34
[43]佚名.等离子体处理危险废物技术[EB/OL].http://www.eedu.org.cn/Article/es/enwr/Envirtech/solidinfo/200605/8335.html
[44]张宏.国内第一台“电子垃圾分解炉”研制成功[N].中国广播网,2004,2
[45]甘舸,陈烈强,蔡明招等.线路板废渣的真空热解动力学[J].华南理工大学学报(自然科学版),2006,34(3):20-33
[46]佚名.废印刷电路板及边料资源化化技术[EB/OL].http://www.pcbtech.net/article/base/0H049D2007/4968.html
[47]约瑟夫哈约利克.电池、组装印刷电路板和电子器件的回收处理方法[P].中国专利:CN1034094,1989,7
[48]叶晓江.电子废弃物回收利用良方.环境导报,1997,(4):33-33
[49]续京.超临界水与环境保护[J].化工装备技术,2006,27(4):63-66
[50]Hongchao Zhang,Xi Ouyang.A Binary Solvent Process for Printed Circuit Board Recycling[J].Annals of the CIRP,2006,55(1):211-217
[51]H.Brandl,R.Bosshard,M.Wegmann.Computer-munching microbes:metal leaching from electronic scrap by bacteria and fungi [J].Hydrometallurgy,2001,59:319-326
[52]何涛,胡红旗,刘红波等.超临界流体技术发展及应用概述[J].江苏化工,2002,30(6):5-11
[53]漆新华,庄源益.超临界流体技术在环境科学中的应用[M].北京:科学出版社,2005
[54]尹卫萍,陈素兰.超临界流体萃取技术及其应用[J].江苏地质,2002,26(3):150-153
[55]肖建平,范崇政.超临界流体技术研究进展[J].化学进展,2001,13(2):94-101
[56]毛煜,杨峰.超临界流体技术应用进展[J].化学研究与应用,2001,13(2):111-116
[57]Laintz,K.E.,Wai,C.M.,Yonker,C.R.,Smith,R.D.Extraction of metal ions from liquid and solid materials by supercritical carbon dioxide [J].The Journal of Analytical Chemistry,1992,64(22):28-32
[58]S.Watanabe,K.Komura,S.Nagaya,H.Morita,et al.Development of Cross-Linked Polymer Material Recycling Technology by Supercritical Water [C].Proceedings of the 7th Intemational Conference on Properties and Applications of Dielectric Materials.Nagoya,2003:595-598
[59]陈青,刘志敏.超临界流体色谱的研究进展[J].分析化学,2004,32(8):1104-1109
[60]蔡建国,邓修,潘家祯.超临界流体萃取技术和设备及应用[J].化工设备与防腐蚀,2000,2:17-20
[61]潘见,张文成,谢慧明.超临界CO_2萃取结晶银杏内醋关键工艺参数研究[J].食品科学,2004,25(3):132-134
[62]朱自强.超临界流体技术-原理和应用[M].北京:化学工业出版社,2000
[63]漆新华,庄源益.超临界流体技术在环境科学中的应用[M].北京:科学出版社,2005
[64]孙路石,陆继东,王世杰等.印刷线路板废弃物的热解及其产物分析[J].燃料化学学报,2002,30(3):285-288
[65]段晨龙,赵跃民,温雪峰等.废弃电路板破碎中热解气体的研究[J].中国矿业大学学报,2005,34(6):730-734
[66]Hongtao Wang,Maya Hirahara,Motonobu Goto,et al.Extraction of flame retardants from electronic printed circuit board by supercritical carbon dioxide [J].The Journal of Supercritical Fluids,2004,29(3):251-256
[67]Abdel mnim Altwaiq,Marion Wolf,Rudi van Eldik.Extraction of brominated flame retardants from polymeric waste material using different solvents and supercritical carbon dioxide[J].Analytica Chimica Acta,2003,491(1): 111-123
[68]潘志彦,王泉源,胡自伟等.超临界流体技术在废旧塑料解聚中的应用[J].环境污染治理技术与设备,2003,8(4):51-54
[69]王汉夫,孙辉,郑玉斌等.PET在超临界甲醇和乙醇中的降解[J].吉林大学自然科学学报,2000,38(4):79-82
[70]曹维良,张敬畅,李勇.超临界流体技术在PET解聚中的应用[J].北京化工大学学报,1999,26(4):73-74
[71]张妍,孟令辉,黄玉东.超临界流体技术在塑料分解回收中的应用[J].河南化工,2002,9:1-3
[72]Tadafumi A.,Osamu S.,Latuhilo M,et al.Recovery of terephthalic acid by decomposition of PET in supercritical water[J].Kagaku Kogaku Ronbushu,1997,(23):505-511
[73]何爱军.材料力学测试原理及基本实验[M].北京:北方工业大学出版社,2001
[74]丛浦珠,苏克曼.质谱分析(分析化学手册)[M].北京:科学出版社,2000
[75]季欧,李玉柱.质谱分析法(下册)[M].北京:原子能出版社,1988
[76]F·W·麦克拉弗蒂.质谱解析(第三版)[M].美国,1987
[77]练振琼,王正富.有机质谱解析[M].北京:化学工业出版社,1990
[78]刘志峰,胡张喜,孔祥明等.基于超临界流体的印刷线路板资源化方法研究[J].环境工程学报,2007,12(1):114-119
[79]银建中,原华山,李志义等.超临界流体萃取固体物料的动力学模型[J].化学工业与工程技术,2001,5(22):14-19
[80]刘毅,银建中,刘润杰.超临界流体萃取的固态物料动力学模型研究进展[J].化工装备技术,2005,26(3):26-31
[81]胡张喜.基于超临界流体技术的印刷线路板回收实验及机理研究[D].硕士学位论文,安徽:合肥工业大学,2007
[82]巫协森.回收废弃印刷电路板的方法[P].中国专利:200610002019.5,2007,8
[831陈诚.覆铜箔层压板尺寸胀缩变化剖析[J].印制电路信息,2003,(11):27-29
[84]刘瑾.PCB制造过程中基材胀缩之形成机理及其控制[D].硕士学位论文,上海:华东理工大学,2005
[85]王湛,周狲.膜分离技术基础[M].北京:北京:化工出版社,2006
[86]陈勇,王从厚,吴鸣.气体膜技术与应用[M].北京:化学工业出版社,2004
[87]任建新.膜分离技术及其应用[M].北京:化学工业出版社,2003