镁/铝异种金属低温钎焊工艺及性能研究
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摘要
镁及镁合金具有比强度高、导热导电性好、减振性好、易切削加工、易回收利用等一系列优点,在汽车、电子、航空领域中有极其重要的应用价值和广阔的应用前景。铝合金同样具有比强度高、导热导电性好、易切削加工以及耐腐蚀性强等特点,在各行业得到广泛的应用。由于镁合金和铝合金应用的广泛性和交叉性,镁／铝异种金属的连接就显得非常必要。采用传统的熔化焊以及固相焊连接镁／铝异种金属,极易在接头中形成脆性Mg-Al系金属间化合物,恶化接头组织性能。钎焊能够有效地连接异种金属,尤其是低温钎焊,它能够在相对较低的温度下实现连接,最大限度地避免有害组织的出现,优化接头组织性能。
本文采用Sn-xZn系、Sn-30Zn-xCe系钎料对镁合金(AZ31B)／铝合金(6061)异种金属进行低温钎焊。通过试验研究,对适合镁／铝低温钎焊的钎料合金进行设计,并研究不同工艺参数和不同钎料成分对Mg/Al接头的组织演变过程以及力学性能的影响机制。
研究表明,当采用Sn-30Zn钎料在钎焊温度为330℃、保温时间为5s、预加载荷为2MPa、加热速率为115℃/min的参数下进行Mg/Al异种金属低温钎焊时,接头能够获得最好的组织及性能。接头钎缝区靠近镁合金母材侧主要是一层很薄的Mg2Sn化合物过渡层以及弥散分布的Al-Sn-Zn固溶体；钎缝中心区主要是Sn-Zn组织以及弥散分布的块状Mg2Sn金属间化合物和弥散分布的Al-Sn-Zn固溶体；而在钎缝靠近铝合金母材侧主要是一层很薄的Al-Sn-Zn固溶体过渡层。Al-Sn-Zn固溶体的形成并且弥散分布于Mg/Sn-30Zn/Al接头中能够有效地降低接头的脆性,进而使得钎焊接头能够获得较高的力学性能。然而,钎缝区中部的块状Mg2Sn金属间化合物由于其尺寸较大,最终导致该处成为接头的薄弱区域,接头在此处发生断裂。在此基础上,采用稀土Ce对Sn-30Zn钎料进行合金化,进一步优化接头组织性能。研究表明,相比于Sn-30Zn钎料而言,Sn-30Zn钎料中适量的Ce的添加有利于Mg/Al钎焊接头钎缝区中Mg2Sn金属间化合物的减少和Al-Sn-Zn固溶体的增加,该组织的转变有利于增强接头的力学性能。然而,过量的Ce的介入,将会在接头中产生Ce-Sn、Ce-Zn等金属间化合物。
本文经一系列的参数以及钎料成分优化,Sn-30Zn-0.05Ce钎料被认为是最适合Mg/Al异种金属低温钎焊的填充焊料。Mg/Sn-30Zn-0.05Ce/Al接头能够提供较高的剪切强度77.48MPa。
Magnesium and its alloys are extensively applied in automotive, electronics and aerospace industries, due to their outstanding physical and mechanical properties such as high strength-to-weight ratio, excellent electrical and thermal conductivity, high damping capacity, ease of machinability and a large recycling potential. Aluminium and its alloys have a series of advantages including high strength-to-weight ratio, excellent electrical and thermal conductivity, ease of machinability and high corrosion resistance, which shows a wide application prospects. It is necessary to bond Mg and Al to form complex structure because of the universal and intersecting application of Mg and Al alloys. Unfortunately, traditional fusion welding processes and solid-state joining processes are normally not suitable for joining of Mg and Al alloys due to the formation of Mg-Al intermetallic compounds, which seriously deteriorates the performance of Mg/Al joint. Brazing, especially low temperature brazing, is considered as a proper method for joining dissimilar metals, because it can achieve a reliable join in the relatively low temperature and maximize to avoid the formation of detrimental structure, and subsequently the microstructure and mechanical property of the joint are optimized.
In this article, AZ31B Mg alloy and6061Al alloy are joined by using low temperature brazing with Sn-xZn and Sn-30Zn-xCe solder alloys. The effect of technological parameter and solder composition on microstructure evolution and mechanical properties of the different brazed joints are investigated. By experimental study, an optimized solder alloy, which is the most favorable filler alloy for joining Mg/Al dissimilar metals, is obtained.
Results show that When the solder of Sn-30Zn is selected to join Mg/Al dissimilar metals, an optimized microstructure and mechanical property of the joint can be obtained with using the optimized brazing parameters. These parameters are brazing temperature of330℃, holding time of5s, operating pressure of2MPa and heating rate of about115℃/min. For Mg/Sn-30Zn/Al brazed joint, Mg2Sn IMC transition layer and dispersive distribution of Al-Sn-Zn solid solutions present in the brazing zone of Mg side, blocky Mg2Sn IMCs and Al-Sn-Zn solid solutions are both generated and dispersedly distributed in brazing zone, while Al-Sn-Zn solid solution transition layer is formed in the brazing zone of Al side. The Al-Sn-Zn solid solutions, forming and dispersing in the brazing zone of the Mg/Sn-30Zn/Al joint in the brazing process, reduce the embrittlement of the brazed joint, and thus the mechanical property is greatly improved. However, the coarse Mg2Sn IMCs form in the center of the brazing zone, which makes there to be the weak area, and the joint fails at this area. On this basis, Ce is added into Sn-30Zn solder alloy in order to further optimize the microstructure and mechanical property of the Mg/Al joint. Results show that comparing with the solder of Sn-30Zn, adding appropriate amount of Ce into Sn-30Zn solder is conducive to decreasing the amount of Mg2Sn intermetallic compounds and increasing the amount of Al-Sn-Zn solid solutions in the brazing zone of the brazed joint, which enhances the mechanical property of soldered joint. Unfortunately, the excessive content of Ce leads to the formation of some Ce-Zn and Ce-Sn intermetallic compounds in brazing zone and subsequently decreases the pull force of soldered joint.
After a series of technology parameters and solder compositions optimization, Sn-30Zn-0.05Ce solder is considered as the most favorable filler alloy for joining Mg/Al dissimilar metals in this article, and the Mg/Sn-30Zn-0.05Ce/Al joint can offer the highest average shear strength of77.48MPa.
本文采用Sn-xZn系、Sn-30Zn-xCe系钎料对镁合金(AZ31B)／铝合金(6061)异种金属进行低温钎焊。通过试验研究,对适合镁／铝低温钎焊的钎料合金进行设计,并研究不同工艺参数和不同钎料成分对Mg/Al接头的组织演变过程以及力学性能的影响机制。
研究表明,当采用Sn-30Zn钎料在钎焊温度为330℃、保温时间为5s、预加载荷为2MPa、加热速率为115℃/min的参数下进行Mg/Al异种金属低温钎焊时,接头能够获得最好的组织及性能。接头钎缝区靠近镁合金母材侧主要是一层很薄的Mg2Sn化合物过渡层以及弥散分布的Al-Sn-Zn固溶体；钎缝中心区主要是Sn-Zn组织以及弥散分布的块状Mg2Sn金属间化合物和弥散分布的Al-Sn-Zn固溶体；而在钎缝靠近铝合金母材侧主要是一层很薄的Al-Sn-Zn固溶体过渡层。Al-Sn-Zn固溶体的形成并且弥散分布于Mg/Sn-30Zn/Al接头中能够有效地降低接头的脆性,进而使得钎焊接头能够获得较高的力学性能。然而,钎缝区中部的块状Mg2Sn金属间化合物由于其尺寸较大,最终导致该处成为接头的薄弱区域,接头在此处发生断裂。在此基础上,采用稀土Ce对Sn-30Zn钎料进行合金化,进一步优化接头组织性能。研究表明,相比于Sn-30Zn钎料而言,Sn-30Zn钎料中适量的Ce的添加有利于Mg/Al钎焊接头钎缝区中Mg2Sn金属间化合物的减少和Al-Sn-Zn固溶体的增加,该组织的转变有利于增强接头的力学性能。然而,过量的Ce的介入,将会在接头中产生Ce-Sn、Ce-Zn等金属间化合物。
本文经一系列的参数以及钎料成分优化,Sn-30Zn-0.05Ce钎料被认为是最适合Mg/Al异种金属低温钎焊的填充焊料。Mg/Sn-30Zn-0.05Ce/Al接头能够提供较高的剪切强度77.48MPa。
Magnesium and its alloys are extensively applied in automotive, electronics and aerospace industries, due to their outstanding physical and mechanical properties such as high strength-to-weight ratio, excellent electrical and thermal conductivity, high damping capacity, ease of machinability and a large recycling potential. Aluminium and its alloys have a series of advantages including high strength-to-weight ratio, excellent electrical and thermal conductivity, ease of machinability and high corrosion resistance, which shows a wide application prospects. It is necessary to bond Mg and Al to form complex structure because of the universal and intersecting application of Mg and Al alloys. Unfortunately, traditional fusion welding processes and solid-state joining processes are normally not suitable for joining of Mg and Al alloys due to the formation of Mg-Al intermetallic compounds, which seriously deteriorates the performance of Mg/Al joint. Brazing, especially low temperature brazing, is considered as a proper method for joining dissimilar metals, because it can achieve a reliable join in the relatively low temperature and maximize to avoid the formation of detrimental structure, and subsequently the microstructure and mechanical property of the joint are optimized.
In this article, AZ31B Mg alloy and6061Al alloy are joined by using low temperature brazing with Sn-xZn and Sn-30Zn-xCe solder alloys. The effect of technological parameter and solder composition on microstructure evolution and mechanical properties of the different brazed joints are investigated. By experimental study, an optimized solder alloy, which is the most favorable filler alloy for joining Mg/Al dissimilar metals, is obtained.
Results show that When the solder of Sn-30Zn is selected to join Mg/Al dissimilar metals, an optimized microstructure and mechanical property of the joint can be obtained with using the optimized brazing parameters. These parameters are brazing temperature of330℃, holding time of5s, operating pressure of2MPa and heating rate of about115℃/min. For Mg/Sn-30Zn/Al brazed joint, Mg2Sn IMC transition layer and dispersive distribution of Al-Sn-Zn solid solutions present in the brazing zone of Mg side, blocky Mg2Sn IMCs and Al-Sn-Zn solid solutions are both generated and dispersedly distributed in brazing zone, while Al-Sn-Zn solid solution transition layer is formed in the brazing zone of Al side. The Al-Sn-Zn solid solutions, forming and dispersing in the brazing zone of the Mg/Sn-30Zn/Al joint in the brazing process, reduce the embrittlement of the brazed joint, and thus the mechanical property is greatly improved. However, the coarse Mg2Sn IMCs form in the center of the brazing zone, which makes there to be the weak area, and the joint fails at this area. On this basis, Ce is added into Sn-30Zn solder alloy in order to further optimize the microstructure and mechanical property of the Mg/Al joint. Results show that comparing with the solder of Sn-30Zn, adding appropriate amount of Ce into Sn-30Zn solder is conducive to decreasing the amount of Mg2Sn intermetallic compounds and increasing the amount of Al-Sn-Zn solid solutions in the brazing zone of the brazed joint, which enhances the mechanical property of soldered joint. Unfortunately, the excessive content of Ce leads to the formation of some Ce-Zn and Ce-Sn intermetallic compounds in brazing zone and subsequently decreases the pull force of soldered joint.
After a series of technology parameters and solder compositions optimization, Sn-30Zn-0.05Ce solder is considered as the most favorable filler alloy for joining Mg/Al dissimilar metals in this article, and the Mg/Sn-30Zn-0.05Ce/Al joint can offer the highest average shear strength of77.48MPa.
引文
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