用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
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摘要
随着电子产品的功能日趋精致,IC封装的接脚数越来越多,IC尺寸越来越小,利用传统表面封装技术渐渐无法满足这些要求,球栅阵列封装(BGA)成为新的IC封装技术主流,出现了满足各类功能需要的BGA封装芯片。封装技术的发展给半导体封装设备带来了新的挑战,在BGA芯片需求不断增长的情况下,市场迫切需要开发一种新的满足BGA封装要求的自动化封装设备。
目前,我国研究BGA封装设备才刚刚起步,基于计算机控制的BGA封装植球设备的研究尚未见报道。本文研究了一种低成本、高效率的BGA全自动植球机。论文的主要内容包括:
1.全面详细论述了半导体BGA封装技术和发展概况,提出了BGA全自动植球机的研制要求。
2.设计了STAR-04Z BGA全自动植球机的总体方案,研究了真空吸引法植球技术的原理和BGA全自动植球机的系统组成,进行了产品样机的结构设计,同时论述了影响植球质量的关键问题。论述了参数化设计思想在BGA植球机CAD设计过程中的运用。
3.提出了一种由通用硬件和软件组成的基于BGA全自动植球机图像检测和精确定位系统的体系结构模型。
分析和讨论结果表明,所设计STAR-04Z BGA全自动植球机的总体方案和产品样机能够满足市场的功能需求。为国内今后开展集成电路BGA封装技术和设备的研究打下了良好的基础。
Along with the growing functions of electronic product, the pin numbers if IC packaging is growing fast while the size reduced obviously. The traditional packaging method can't fill the need of new requirements, so Ball Grid Array (BGA) becomes the leading method of IC packaging. New packaging technology brings forward new challenge for semiconductor packaging device. The demands of BGA chips grows quickly, so that the market has a bad need of new automatic BGA packaging device.For the moment,the study of BGA packaging device is just begin. This machine will fill up the blankness and its technology performance reaches an advanced level in the BGA automatic packaging field in domestic.This paper studies a low cost, but high efficiency, automated ball attachment workcell. The followings have been achieced in this paper:a) Analyzes the survey of semiconductor package technology overseas and domestic, and put forward the need of development of equipment platform of Ball Attachment Workcell For Ball Grid Array Semiconductor Packages.b) Designs a whole scheme of STAR-04Z automated ball attachment workcell. Study the theory of vacuum sucking method for ball attachment technology and the system composement of the BGA automated ball attachment workcell.Farther more, finish the structure design of the model machine. At the same time, this paper relates the crucial problems which affect the quality of ball attachment and discusses the application of parameter design theory in the design process of BGA ball attachment.c) Put forwards a structure model for image inspection and accurate orientation of the BGA automated ball attachment workcell ,which composes of currency hardware&software.Analysis and discussion indicates that the whole scheme and the model machine we designed are able to meet the need of the market. Our study makes an important beginning for BGA packaging technology ang equipments in China.
目前,我国研究BGA封装设备才刚刚起步,基于计算机控制的BGA封装植球设备的研究尚未见报道。本文研究了一种低成本、高效率的BGA全自动植球机。论文的主要内容包括:
1.全面详细论述了半导体BGA封装技术和发展概况,提出了BGA全自动植球机的研制要求。
2.设计了STAR-04Z BGA全自动植球机的总体方案,研究了真空吸引法植球技术的原理和BGA全自动植球机的系统组成,进行了产品样机的结构设计,同时论述了影响植球质量的关键问题。论述了参数化设计思想在BGA植球机CAD设计过程中的运用。
3.提出了一种由通用硬件和软件组成的基于BGA全自动植球机图像检测和精确定位系统的体系结构模型。
分析和讨论结果表明,所设计STAR-04Z BGA全自动植球机的总体方案和产品样机能够满足市场的功能需求。为国内今后开展集成电路BGA封装技术和设备的研究打下了良好的基础。
Along with the growing functions of electronic product, the pin numbers if IC packaging is growing fast while the size reduced obviously. The traditional packaging method can't fill the need of new requirements, so Ball Grid Array (BGA) becomes the leading method of IC packaging. New packaging technology brings forward new challenge for semiconductor packaging device. The demands of BGA chips grows quickly, so that the market has a bad need of new automatic BGA packaging device.For the moment,the study of BGA packaging device is just begin. This machine will fill up the blankness and its technology performance reaches an advanced level in the BGA automatic packaging field in domestic.This paper studies a low cost, but high efficiency, automated ball attachment workcell. The followings have been achieced in this paper:a) Analyzes the survey of semiconductor package technology overseas and domestic, and put forward the need of development of equipment platform of Ball Attachment Workcell For Ball Grid Array Semiconductor Packages.b) Designs a whole scheme of STAR-04Z automated ball attachment workcell. Study the theory of vacuum sucking method for ball attachment technology and the system composement of the BGA automated ball attachment workcell.Farther more, finish the structure design of the model machine. At the same time, this paper relates the crucial problems which affect the quality of ball attachment and discusses the application of parameter design theory in the design process of BGA ball attachment.c) Put forwards a structure model for image inspection and accurate orientation of the BGA automated ball attachment workcell ,which composes of currency hardware&software.Analysis and discussion indicates that the whole scheme and the model machine we designed are able to meet the need of the market. Our study makes an important beginning for BGA packaging technology ang equipments in China.
引文
[1] 杨元松,半导体产业的整合解决方案,电子工业专用设备,2004 Vol.33 No.8 P.15—17。
[2] 徐栎,面临新发展的半导体设备产业,半导体技术,2005.05。
[3] 芯片封装形式介绍,国外电子元器件,1998.12
[4] google搜索引擎
[5] 2002-2003 年中国半导体专用设备市场研究年度报告http://www.ccidconsulting.com/
[6] 于燮康,我国半导体产业链现状及发展新浪潮,半导体技术,2004.05
[7] 于燮康,自强不息、优先发展、努力做大做好半导体封装产业,电子工业专业设备,2003 Vol.32 No.6 P.4-7。
[8] 邹世昌 半导体芯片制造在信息产业中的地位与作用,电子技术2002 Vol.33 No.12
[9] 鲜飞,芯片封装技术的发展演变,电子工业专用设备,2004 Vol.33 No.4 P.9-11,76。
[10] 田民波,高密度封装进展之二—半导体封装技术的发展趋势,印路电路信息,2003 No.11P.3-7,19。
[11] 葛劢冲,微电子封装中芯片焊接技术及其设备的发展,电子工业专用设备,2000,第29卷第4期
[12] 况延香,朱颂春,SMT中的先进微电子封装技术概况,电子工艺技术,2004Vol.25 No.4 P.178-182。
[13] 鲜飞,BGA技术成为现代组装技术的主流,印路电路信息,2004 No.7P.63-65
[14] 鲜飞 BGA技术与质量控制印路电路信息,2002 No.8 P.46-49.
[15] 胡志勇,BGA器件及其常见的形式,电子元件与材料,2004 Vol.23 No.5 P.35-38
[16] 刘劲松,郭俭.BGA/CSP封装技术的研究.哈尔滨工业大学学报.20003 No.5:602-604
[17] 夏链、韩江、方兴、赵韩,球栅阵列(BGA)半导体封装技术的研究,安徽制造业发展博士论坛论文集,合肥工业大学出版社,2004.11.
[18] Tam Kam Fai. Robotics Ball Attachment Workcell For Ball Grid Array Semiconductor Packages. A Thesis Submitted To The Hong Kong Polytechnic University For The Degree of Master of Science, In Dec. 2000.
[19] SIA(半导体工业协会):ITRS (Intainational Technology Roadmap for semiconductors) [Z].2001, San Jose, CA, USA.
[20] John Lau, C. P. Wong John L. Prince and Wataru Nakayama "Electronic Packaging Design, Materials, Process, and Reliability" p1, p6-p7.
[21] John H. Lau and S. W. Ricky Lee "Chip Scale Package" p3-p4.
[22] [22]Scott D. McGill, Vanguard Automation, Inc. "BGA Component Considerations And A Method For Ball Attachment", 1998
[23] TechSearch International, Inc. "1996 BGA Development Update Scott D. McGill, Vanguard Automation, Inc. "BGA Component Considerations And A Method For Ball Attachment", 1998Service"
[24] 刘正伟,BGA再流焊技术,电讯技术,2004 Vol.44 No.01 P.132-134。
[25] 王景华,浅谈BGA的返修,印路电路信息,2002 No.8 P.49-52。
[26] 黄幼秦,BGA封装技术及其返修工艺,电子产品世界,2001 No.21 P.61-62,73
[27] 胡志勇,球栅阵列器件及其清洗,清洗技术,2004 Vol.2 No.1 P.15-19
[28] http://aem.sjtu.edu.cn/cn/Research/LaserBumping.php, 上海交大,先进电子制造中心
[29] 夏链、韩江、方兴、赵韩,球栅阵列(BGA)半导体封装技术的研究,安徽制造业发展博士论坛论文集,合肥工业大学出版社,2004.11.
[30] 冯晓国,张景和,张承嘉,等.IC封装设备划片机的研制.仪器仪表学报,2003第四期增刊50-52.
[31] 罗磊,王石刚,蔡建国.表面贴装关键技术综述.组合机床及自动化,2003 No.02:70-72.
[32] 贾松良.微电子封装业和微电子封装设备.电子工业专用设备,20003 No.5:7-11
[33] John H. Lau "Ball Grid Array Technology", McGraw-Hill, First Edition, Chapl.
[34] "Engineering Plastic Products", DSM Engineering Plastic Products, 1997.
[35] 朱继满,郭立泉,马莒圭,“理想”绝缘金属基板在BGA封装中的应用,稀有金属材料与工程,2004 Vol.33 No.4 P.432-435
[36] Peter Kopacek, Gernot kronreif and Robert Probst, "A modular control system for flexible robotized manufacturing cells", Robotica (1999) volume 17, p.23-32.
[37] Dean A. Shafer, PE, "Successful Assembly Automation-a development and implementation guide", p148-p149.
[38] 缪德建,连杆模具造型的参数化设计及制造,南京理工大学硕士学位文.
[39] 方兴,夏链,韩江,基于Pro/E的渐开线齿轮参数化设计系统的开发,合肥工业大学学报,2004 Vol.27 No.8.
[40] 夏链,方兴,韩江,赵韩,螺旋转子的三维数学建模及CAD/CAM技术研究,农 业机械学报,2005年第8期.
[41] 林清安.Pro/Engineer 2000i~2零件设计高级篇[M].潘爱民,王国印,译.北京:清华大学出版社,2001
[42] http://www.gongkong.com/sort/vision/中国工控网机器视觉
[43] 郭峰,曹其新,等.基于视觉伺服的倒立摆实验台的研究.机械设计与研究,2003 No.4:62-64.
[44] 雷源忠,丁汉,雒建斌.计算机制造中的重要科学技术问题.机械工程学报,2002 No.11:1-6
[45] 王延风,何惠阳,等.全自动金丝球焊机的CAD/CAE设计研究.光学精密工程,2002,10(5):466-470.
[46] 杨云龙,刘金荣.全自动划片机自动识别对准技术的研究.电子工业专用设备,2004 No.3:46-48.
[47] 计算机数字图像处理技术[M].北京:清华大学出版社,2000.
[48] 丁汉,熊有伦,芯片封装的高加速度运动系统的精确定位和操纵,中国科学院《技术科学论坛》学术报告会论文集
[2] 徐栎,面临新发展的半导体设备产业,半导体技术,2005.05。
[3] 芯片封装形式介绍,国外电子元器件,1998.12
[4] google搜索引擎
[5] 2002-2003 年中国半导体专用设备市场研究年度报告http://www.ccidconsulting.com/
[6] 于燮康,我国半导体产业链现状及发展新浪潮,半导体技术,2004.05
[7] 于燮康,自强不息、优先发展、努力做大做好半导体封装产业,电子工业专业设备,2003 Vol.32 No.6 P.4-7。
[8] 邹世昌 半导体芯片制造在信息产业中的地位与作用,电子技术2002 Vol.33 No.12
[9] 鲜飞,芯片封装技术的发展演变,电子工业专用设备,2004 Vol.33 No.4 P.9-11,76。
[10] 田民波,高密度封装进展之二—半导体封装技术的发展趋势,印路电路信息,2003 No.11P.3-7,19。
[11] 葛劢冲,微电子封装中芯片焊接技术及其设备的发展,电子工业专用设备,2000,第29卷第4期
[12] 况延香,朱颂春,SMT中的先进微电子封装技术概况,电子工艺技术,2004Vol.25 No.4 P.178-182。
[13] 鲜飞,BGA技术成为现代组装技术的主流,印路电路信息,2004 No.7P.63-65
[14] 鲜飞 BGA技术与质量控制印路电路信息,2002 No.8 P.46-49.
[15] 胡志勇,BGA器件及其常见的形式,电子元件与材料,2004 Vol.23 No.5 P.35-38
[16] 刘劲松,郭俭.BGA/CSP封装技术的研究.哈尔滨工业大学学报.20003 No.5:602-604
[17] 夏链、韩江、方兴、赵韩,球栅阵列(BGA)半导体封装技术的研究,安徽制造业发展博士论坛论文集,合肥工业大学出版社,2004.11.
[18] Tam Kam Fai. Robotics Ball Attachment Workcell For Ball Grid Array Semiconductor Packages. A Thesis Submitted To The Hong Kong Polytechnic University For The Degree of Master of Science, In Dec. 2000.
[19] SIA(半导体工业协会):ITRS (Intainational Technology Roadmap for semiconductors) [Z].2001, San Jose, CA, USA.
[20] John Lau, C. P. Wong John L. Prince and Wataru Nakayama "Electronic Packaging Design, Materials, Process, and Reliability" p1, p6-p7.
[21] John H. Lau and S. W. Ricky Lee "Chip Scale Package" p3-p4.
[22] [22]Scott D. McGill, Vanguard Automation, Inc. "BGA Component Considerations And A Method For Ball Attachment", 1998
[23] TechSearch International, Inc. "1996 BGA Development Update Scott D. McGill, Vanguard Automation, Inc. "BGA Component Considerations And A Method For Ball Attachment", 1998Service"
[24] 刘正伟,BGA再流焊技术,电讯技术,2004 Vol.44 No.01 P.132-134。
[25] 王景华,浅谈BGA的返修,印路电路信息,2002 No.8 P.49-52。
[26] 黄幼秦,BGA封装技术及其返修工艺,电子产品世界,2001 No.21 P.61-62,73
[27] 胡志勇,球栅阵列器件及其清洗,清洗技术,2004 Vol.2 No.1 P.15-19
[28] http://aem.sjtu.edu.cn/cn/Research/LaserBumping.php, 上海交大,先进电子制造中心
[29] 夏链、韩江、方兴、赵韩,球栅阵列(BGA)半导体封装技术的研究,安徽制造业发展博士论坛论文集,合肥工业大学出版社,2004.11.
[30] 冯晓国,张景和,张承嘉,等.IC封装设备划片机的研制.仪器仪表学报,2003第四期增刊50-52.
[31] 罗磊,王石刚,蔡建国.表面贴装关键技术综述.组合机床及自动化,2003 No.02:70-72.
[32] 贾松良.微电子封装业和微电子封装设备.电子工业专用设备,20003 No.5:7-11
[33] John H. Lau "Ball Grid Array Technology", McGraw-Hill, First Edition, Chapl.
[34] "Engineering Plastic Products", DSM Engineering Plastic Products, 1997.
[35] 朱继满,郭立泉,马莒圭,“理想”绝缘金属基板在BGA封装中的应用,稀有金属材料与工程,2004 Vol.33 No.4 P.432-435
[36] Peter Kopacek, Gernot kronreif and Robert Probst, "A modular control system for flexible robotized manufacturing cells", Robotica (1999) volume 17, p.23-32.
[37] Dean A. Shafer, PE, "Successful Assembly Automation-a development and implementation guide", p148-p149.
[38] 缪德建,连杆模具造型的参数化设计及制造,南京理工大学硕士学位文.
[39] 方兴,夏链,韩江,基于Pro/E的渐开线齿轮参数化设计系统的开发,合肥工业大学学报,2004 Vol.27 No.8.
[40] 夏链,方兴,韩江,赵韩,螺旋转子的三维数学建模及CAD/CAM技术研究,农 业机械学报,2005年第8期.
[41] 林清安.Pro/Engineer 2000i~2零件设计高级篇[M].潘爱民,王国印,译.北京:清华大学出版社,2001
[42] http://www.gongkong.com/sort/vision/中国工控网机器视觉
[43] 郭峰,曹其新,等.基于视觉伺服的倒立摆实验台的研究.机械设计与研究,2003 No.4:62-64.
[44] 雷源忠,丁汉,雒建斌.计算机制造中的重要科学技术问题.机械工程学报,2002 No.11:1-6
[45] 王延风,何惠阳,等.全自动金丝球焊机的CAD/CAE设计研究.光学精密工程,2002,10(5):466-470.
[46] 杨云龙,刘金荣.全自动划片机自动识别对准技术的研究.电子工业专用设备,2004 No.3:46-48.
[47] 计算机数字图像处理技术[M].北京:清华大学出版社,2000.
[48] 丁汉,熊有伦,芯片封装的高加速度运动系统的精确定位和操纵,中国科学院《技术科学论坛》学术报告会论文集