磨削蓝宝石基片的软磨料砂轮的研制及性能研究
|
摘要
单晶蓝宝石具有一系列优良的性能,莫式硬度高达9,在军事和民用领域具有广泛的用途。由于其硬度大,传统的平整化加工方法(研磨+抛光)存在加工效率低、难以实现自动化、污染环境等缺点,因此,国内外专家学者一直致力于如何实现单晶蓝宝石基片的高效、无损伤表面的超精密加工技术的研究。其中,采用固结磨料的超精密磨削技术是目前研究的热点,并已取得了显著的成果,但传统的金刚石砂轮磨削不可避免的会在单晶蓝宝石基片表面产生损伤,还需要后续的化学机械抛光去除损伤层,反而降低了基片的加工效率。
针对上述问题,为了高效无损地加工单晶蓝宝石基片,本文提出了采用软磨料砂轮磨削单晶蓝宝石的加工方法,利用砂轮磨料、添加剂和单晶蓝宝石之间的固相化学反应和软磨料的机械摩擦作用实现单晶蓝宝石基片超光滑、低损伤磨削加工。根据单晶蓝宝石的物理化学性质,本文设计制造了超精密磨削单晶蓝宝石基片的软磨料砂轮,设计两个软磨料砂轮的组织成分,进行磨具的压制和软磨料砂轮的制造,并通过磨削修整试验,验证了两个软磨料砂轮的实用性;进行了磨料和单晶蓝宝石之间的固相化学模拟试验,模拟磨削过程中的固相化学反应,试验表明,MgO和Fe_2O_3磨料都可以与单晶蓝宝石发生固相化学反应,为软磨料磨削机理提供理论依据;进行了软磨料砂轮磨削蓝宝石基片的磨削性能试验,结果表明,使用软磨料砂轮可以实现对单晶蓝宝石的超精密加工,软磨料砂轮加工蓝宝石有比金刚石砂轮更优的加工性能,软磨料砂轮加工后的蓝宝石表面质量可达表面粗糙度Ra1.365nm,且软磨料砂轮可以实现更小的表面材料去除率,实现无损伤磨削;最后进行角度抛光试验,通过对单晶蓝宝石基片进行切割、粘片、研磨、抛光、腐蚀一系列流程,验证了软磨料砂轮磨削后的单晶蓝宝石基片是亚表面无损伤的单晶蓝宝石基片。
Single crystal sapphire has a range of excellent performance, its Moh's scale of hardness is up to 9, and has broad uses in the field of military and civilian. Because of its hardness, the formation of the traditional processing methods (grinding and polishing) have shortcomings as follows: low processing efficiency, difficult to automate and pollution environmental, therefore, domestic and foreign experts and scholars have been committed to how to achieve high efficiency and no damage surface of ultra-precision processing technology research on single crystal sapphire substrates. Among them, ultra-precision grinding technology using bonded abrasive is a hot research current, and has achieved remarkable results, but inevitably the traditional diamond wheel grinding will damage the surface of sapphire substrates, so it needs the follow-up of the chemical-mechanical polishing to remove the damage layer, thus reduced the substrate processing efficiency.
To solve the above issues, in order to efficiently process single crystal sapphire in non-destructive manner, this paper presents a processing method using soft abrasive grinding wheel grinding single crystal sapphire, using solid-state reaction between grinding wheel abrasive, additives and single crystal sapphire and the soft abrasive's mechanical friction to achieve ultra-smooth sapphire substrate, low-damage grinding. According to the physical and chemical properties of single crystal sapphire, this paper design and manufacture soft abrasive grinding wheel for ultra-precision grinding sapphire substrates, design the composition of two soft abrasive grinding wheel, carry out the conduct of repression and soft abrasive grinding wheel manufacturing, and through the grinding and dressing test, the practicability of the two soft abrasive grinding wheel is verified; carried out solid-phase chemistry simulation between the abrasive and single crystal sapphire to simulate the probably solid phase chemical reactions in grinding process, tests showed that, MgO and Fe_2O_3 abrasive can occur solid state reaction with single crystal sapphire, thus provides theoretical basis of soft-abrasive grinding mechanism; conduct a soft abrasive grinding wheel grinding sapphire substrate performance, test results show that the use of soft abrasive grinding wheel can achieve ultra-precision machining on the single crystal sapphire, the processing performance of soft abrasive wheel is better than diamond grinding wheel on grinding sapphire, after processing of soft abrasive wheel the sapphire surface quality the surface roughness is up to Ra 1.365nm, and the soft-abrasive grinding wheels can achieve smaller surface materials removal, realize damage-free grinding; at the end of the paper, angle polishing tests is carried out, by series processes of cutting, sticking film, grinding, polishing, corrosion the single-crystal sapphire substrate, verify the single-crystal sapphire after grinding of soft-abrasive grinding wheel is a non-destructive sub-surface, single-crystal sapphire substrates.
针对上述问题,为了高效无损地加工单晶蓝宝石基片,本文提出了采用软磨料砂轮磨削单晶蓝宝石的加工方法,利用砂轮磨料、添加剂和单晶蓝宝石之间的固相化学反应和软磨料的机械摩擦作用实现单晶蓝宝石基片超光滑、低损伤磨削加工。根据单晶蓝宝石的物理化学性质,本文设计制造了超精密磨削单晶蓝宝石基片的软磨料砂轮,设计两个软磨料砂轮的组织成分,进行磨具的压制和软磨料砂轮的制造,并通过磨削修整试验,验证了两个软磨料砂轮的实用性;进行了磨料和单晶蓝宝石之间的固相化学模拟试验,模拟磨削过程中的固相化学反应,试验表明,MgO和Fe_2O_3磨料都可以与单晶蓝宝石发生固相化学反应,为软磨料磨削机理提供理论依据;进行了软磨料砂轮磨削蓝宝石基片的磨削性能试验,结果表明,使用软磨料砂轮可以实现对单晶蓝宝石的超精密加工,软磨料砂轮加工蓝宝石有比金刚石砂轮更优的加工性能,软磨料砂轮加工后的蓝宝石表面质量可达表面粗糙度Ra1.365nm,且软磨料砂轮可以实现更小的表面材料去除率,实现无损伤磨削;最后进行角度抛光试验,通过对单晶蓝宝石基片进行切割、粘片、研磨、抛光、腐蚀一系列流程,验证了软磨料砂轮磨削后的单晶蓝宝石基片是亚表面无损伤的单晶蓝宝石基片。
Single crystal sapphire has a range of excellent performance, its Moh's scale of hardness is up to 9, and has broad uses in the field of military and civilian. Because of its hardness, the formation of the traditional processing methods (grinding and polishing) have shortcomings as follows: low processing efficiency, difficult to automate and pollution environmental, therefore, domestic and foreign experts and scholars have been committed to how to achieve high efficiency and no damage surface of ultra-precision processing technology research on single crystal sapphire substrates. Among them, ultra-precision grinding technology using bonded abrasive is a hot research current, and has achieved remarkable results, but inevitably the traditional diamond wheel grinding will damage the surface of sapphire substrates, so it needs the follow-up of the chemical-mechanical polishing to remove the damage layer, thus reduced the substrate processing efficiency.
To solve the above issues, in order to efficiently process single crystal sapphire in non-destructive manner, this paper presents a processing method using soft abrasive grinding wheel grinding single crystal sapphire, using solid-state reaction between grinding wheel abrasive, additives and single crystal sapphire and the soft abrasive's mechanical friction to achieve ultra-smooth sapphire substrate, low-damage grinding. According to the physical and chemical properties of single crystal sapphire, this paper design and manufacture soft abrasive grinding wheel for ultra-precision grinding sapphire substrates, design the composition of two soft abrasive grinding wheel, carry out the conduct of repression and soft abrasive grinding wheel manufacturing, and through the grinding and dressing test, the practicability of the two soft abrasive grinding wheel is verified; carried out solid-phase chemistry simulation between the abrasive and single crystal sapphire to simulate the probably solid phase chemical reactions in grinding process, tests showed that, MgO and Fe_2O_3 abrasive can occur solid state reaction with single crystal sapphire, thus provides theoretical basis of soft-abrasive grinding mechanism; conduct a soft abrasive grinding wheel grinding sapphire substrate performance, test results show that the use of soft abrasive grinding wheel can achieve ultra-precision machining on the single crystal sapphire, the processing performance of soft abrasive wheel is better than diamond grinding wheel on grinding sapphire, after processing of soft abrasive wheel the sapphire surface quality the surface roughness is up to Ra 1.365nm, and the soft-abrasive grinding wheels can achieve smaller surface materials removal, realize damage-free grinding; at the end of the paper, angle polishing tests is carried out, by series processes of cutting, sticking film, grinding, polishing, corrosion the single-crystal sapphire substrate, verify the single-crystal sapphire after grinding of soft-abrasive grinding wheel is a non-destructive sub-surface, single-crystal sapphire substrates.
引文
[1]Zhu H-L.Chemical mechanical polishing of sapphire[D].New Jersey:New Brunswick Rutgers,the State University of New Jersey,2002.
[2]赵之雯,牛新环,檀柏梅等.蓝宝石衬底材料CMP抛光工艺研究[J].微纳电子技术,2006,(1):16-19.
[3]许历生,古振瑭,黄姿瑞等.钻石轮磨及机械化学抛光复合制程应用与蓝宝石晶圆薄化加工[J].机械工业杂志,2003,(254):107-113.
[4]周海.蓝宝石镜面加工工艺的研究[J].盐城工学院学报,2000,(1):21-25.
[5]姜学文.超精研抛技术[M].北京:国防工业出版社,1988.
[6]杨晓利.UHB-LEDS的市场和技术需求[J].光机电信息.2008,1:30-33.
[7]杨力.先进光学制造技术[M].北京:科学出版社,2001.
[8]袁哲俊,王先逵.精密和超精密加工技术[M].北京:机械工业出版社,1999.
[9]汪建民.陶瓷技术手册[M],经济部技术处,1983.
[10]http://www.chinabaike.com/article/316/hx/2007/20071109628367.html
[11]许厉生,古振瑭,陈昭彰等.蓝宝石基片薄化加工[J].机械工程杂志,2004,254:107-115.
[12]张向东,赵海法,江晓平等.白宝石(Al_2O_3)晶体基片用抛光液的研制及加工工艺[J].人工晶体学报,2003,32(4):405-407.
[13]Park Hyong joon,Chan Helen M.A novel process for the generation of pristine sapphire surfaces[J].Thin Solid Films,2002,422(1-2):135-140.
[14]周兆忠,袁巨龙,文东辉.蓝宝石衬底的超光滑表面加工进展[J].航空精密制造技术,2009,45(3):8-13
[15]Chao-Chang A.Chen,Li-Sheng Shu,Shah-Rong Lee.Mechano-chemical polishing of silicon wafers,Journal of Materials ProcessingTechnology,2003,Vol 140 pp.373-378.
[16]王彦松.单晶α相气化铝基片基板平坦化加工研究[D]:(硕士学位论文).台湾科技大学机械工程研究所,2003.
[17]Hassan Zahouani,Rough surfaces and elasto-plastic contacts[J],Editions scientifiques et medicales Elsevier SAS,2001,PP.709-715.
[18]Z.P.Zagorski.Solid state radiation chemistry features important in basic research and applications[J].Radiation physics and application,1999,56:559-565.
[19]D.Guha,S.K.Roy Chowdhuri.The effect of surface roughness on the temperature at the contact between sliding bodies[J].Wear,1995,pp.63-73.
[20]K.Suzuki.Development of a new mechano-chemical polishing method with a polishing film for ceramic round bars[J].Annals of CIRP,1992,Vol.41:pp.339-342.
[21]Anthony R,West.Solid state chemistry and itsapplications[J],状元出版社,1985,4.
[22]N.Yasunuga.Effect of Solid State Reaction on Wear of Sapphire Sliding on Steel[J],Journal of JSPE,1978,44:pp.65-71.
[23]Henry W.Gutsche,Jerry W.Moogy.Polishing of sapphire with colloidal;silica[J]Journal of the Electrochem Society of Solid-State Science and technology,1978,pp 136-138.
[24]马振国,刘玉岭,武亚红等.蓝宝石衬底nm级CMP技术研究[J].微纳电子技术.2008,45(1):51-53
[25]王娟,刘玉岭,檀柏梅等.蓝宝石衬底片的精密加工[J].微电子学.2006,36(1):47-48
[26]程国良.超精密磨削蓝宝石基片的软磨料砂轮磨削性能[D]:(硕士学位论文).大连:大连理工大学,2008.
[27]李树荣.蓝宝石基片化学机械抛光液的研制[D]:(硕士学位论文).大连:大连理工大学机械工程学院,2008.
[28]王军.单晶蓝宝石基片精密研磨工艺研究[D]:(硕士学位论文).大连:大连理工大学机械工程学院,2008.
[29]吴涛,刘世民,高祀建等.蓝宝石ELID超精密磨削表面质量与变质层的研究[J].国际材料科学与工程学术研讨会,2005:297-298.
[30]徐安民.蓝宝石晶片超光滑加工技术研究[D]:(硕士学位论文).苏州:苏州大学,2007.
[31]柯利峰,黎建明,苏小平等.热交换法生长蓝宝石晶体的位错研究[J].人工晶体学报.2009,38(3):626-627
[32]周海.蓝宝石加工工艺的研究[J].机械设计与制造工程,2000,29(1):49-50.
[33]华勇,李亚萍.磨料磨具导论[M].北京:中国标准出版社,2004.
[34]Pei-Lum Tso,Chieng-Chung Teng,A study of the total thickness variation in the grinding of ultra-precision substrates[J],Materials Processing Technology,2001,116:182-188.
[35]Tian Yebing,Kang Renke,Guo Oongming,Jin Zhuji.A study on kinematic trajectory in wafer rotation grinding[C],proceedings of the 6th International Conference on Frontiers of Design and Manufacturing(ICFDM).Xi'an,China,June 21-23,2004,Science Pressure and Science Pressure USA Inc:405-407.
[36]周海.超声波清洗在蓝宝石镜面加工中的应用[J].机械设计与制造工艺.1999,28(2):59-60
[37]周海,杭寅,姚绍峰.蓝宝石品片表面净化技术研究[J].电子机械工程.2005,21(6):42-45
[38]古振瑭,陈昭彰.干式化学机械抛光在单晶蓝宝石基片之平坦化加工研究[D]:(硕士学位论文).台湾:台湾科技大学,2005.
[39]田业冰.大尺寸硅片磨削平整化理论与工艺技术的研究:[博士学位论文].大连:大连理工大学机械工程学院,2007.
[40]朱洪涛,林滨,吴辉,等.陶瓷磨削机理及其对表面/亚表面损伤的影响[J].精密制造与自动化,2004,2:15-18.
[41]张银霞.单晶硅片超精密磨削加工表面层损伤的研究[D]:(博士学位论文).大连:大连理工大学,2006.
[42]郎艳菊.CZT晶体加工表面/亚表面损伤研究[D]:(硕士学位论文).大连:大连理工大学.2008.
[2]赵之雯,牛新环,檀柏梅等.蓝宝石衬底材料CMP抛光工艺研究[J].微纳电子技术,2006,(1):16-19.
[3]许历生,古振瑭,黄姿瑞等.钻石轮磨及机械化学抛光复合制程应用与蓝宝石晶圆薄化加工[J].机械工业杂志,2003,(254):107-113.
[4]周海.蓝宝石镜面加工工艺的研究[J].盐城工学院学报,2000,(1):21-25.
[5]姜学文.超精研抛技术[M].北京:国防工业出版社,1988.
[6]杨晓利.UHB-LEDS的市场和技术需求[J].光机电信息.2008,1:30-33.
[7]杨力.先进光学制造技术[M].北京:科学出版社,2001.
[8]袁哲俊,王先逵.精密和超精密加工技术[M].北京:机械工业出版社,1999.
[9]汪建民.陶瓷技术手册[M],经济部技术处,1983.
[10]http://www.chinabaike.com/article/316/hx/2007/20071109628367.html
[11]许厉生,古振瑭,陈昭彰等.蓝宝石基片薄化加工[J].机械工程杂志,2004,254:107-115.
[12]张向东,赵海法,江晓平等.白宝石(Al_2O_3)晶体基片用抛光液的研制及加工工艺[J].人工晶体学报,2003,32(4):405-407.
[13]Park Hyong joon,Chan Helen M.A novel process for the generation of pristine sapphire surfaces[J].Thin Solid Films,2002,422(1-2):135-140.
[14]周兆忠,袁巨龙,文东辉.蓝宝石衬底的超光滑表面加工进展[J].航空精密制造技术,2009,45(3):8-13
[15]Chao-Chang A.Chen,Li-Sheng Shu,Shah-Rong Lee.Mechano-chemical polishing of silicon wafers,Journal of Materials ProcessingTechnology,2003,Vol 140 pp.373-378.
[16]王彦松.单晶α相气化铝基片基板平坦化加工研究[D]:(硕士学位论文).台湾科技大学机械工程研究所,2003.
[17]Hassan Zahouani,Rough surfaces and elasto-plastic contacts[J],Editions scientifiques et medicales Elsevier SAS,2001,PP.709-715.
[18]Z.P.Zagorski.Solid state radiation chemistry features important in basic research and applications[J].Radiation physics and application,1999,56:559-565.
[19]D.Guha,S.K.Roy Chowdhuri.The effect of surface roughness on the temperature at the contact between sliding bodies[J].Wear,1995,pp.63-73.
[20]K.Suzuki.Development of a new mechano-chemical polishing method with a polishing film for ceramic round bars[J].Annals of CIRP,1992,Vol.41:pp.339-342.
[21]Anthony R,West.Solid state chemistry and itsapplications[J],状元出版社,1985,4.
[22]N.Yasunuga.Effect of Solid State Reaction on Wear of Sapphire Sliding on Steel[J],Journal of JSPE,1978,44:pp.65-71.
[23]Henry W.Gutsche,Jerry W.Moogy.Polishing of sapphire with colloidal;silica[J]Journal of the Electrochem Society of Solid-State Science and technology,1978,pp 136-138.
[24]马振国,刘玉岭,武亚红等.蓝宝石衬底nm级CMP技术研究[J].微纳电子技术.2008,45(1):51-53
[25]王娟,刘玉岭,檀柏梅等.蓝宝石衬底片的精密加工[J].微电子学.2006,36(1):47-48
[26]程国良.超精密磨削蓝宝石基片的软磨料砂轮磨削性能[D]:(硕士学位论文).大连:大连理工大学,2008.
[27]李树荣.蓝宝石基片化学机械抛光液的研制[D]:(硕士学位论文).大连:大连理工大学机械工程学院,2008.
[28]王军.单晶蓝宝石基片精密研磨工艺研究[D]:(硕士学位论文).大连:大连理工大学机械工程学院,2008.
[29]吴涛,刘世民,高祀建等.蓝宝石ELID超精密磨削表面质量与变质层的研究[J].国际材料科学与工程学术研讨会,2005:297-298.
[30]徐安民.蓝宝石晶片超光滑加工技术研究[D]:(硕士学位论文).苏州:苏州大学,2007.
[31]柯利峰,黎建明,苏小平等.热交换法生长蓝宝石晶体的位错研究[J].人工晶体学报.2009,38(3):626-627
[32]周海.蓝宝石加工工艺的研究[J].机械设计与制造工程,2000,29(1):49-50.
[33]华勇,李亚萍.磨料磨具导论[M].北京:中国标准出版社,2004.
[34]Pei-Lum Tso,Chieng-Chung Teng,A study of the total thickness variation in the grinding of ultra-precision substrates[J],Materials Processing Technology,2001,116:182-188.
[35]Tian Yebing,Kang Renke,Guo Oongming,Jin Zhuji.A study on kinematic trajectory in wafer rotation grinding[C],proceedings of the 6th International Conference on Frontiers of Design and Manufacturing(ICFDM).Xi'an,China,June 21-23,2004,Science Pressure and Science Pressure USA Inc:405-407.
[36]周海.超声波清洗在蓝宝石镜面加工中的应用[J].机械设计与制造工艺.1999,28(2):59-60
[37]周海,杭寅,姚绍峰.蓝宝石品片表面净化技术研究[J].电子机械工程.2005,21(6):42-45
[38]古振瑭,陈昭彰.干式化学机械抛光在单晶蓝宝石基片之平坦化加工研究[D]:(硕士学位论文).台湾:台湾科技大学,2005.
[39]田业冰.大尺寸硅片磨削平整化理论与工艺技术的研究:[博士学位论文].大连:大连理工大学机械工程学院,2007.
[40]朱洪涛,林滨,吴辉,等.陶瓷磨削机理及其对表面/亚表面损伤的影响[J].精密制造与自动化,2004,2:15-18.
[41]张银霞.单晶硅片超精密磨削加工表面层损伤的研究[D]:(博士学位论文).大连:大连理工大学,2006.
[42]郎艳菊.CZT晶体加工表面/亚表面损伤研究[D]:(硕士学位论文).大连:大连理工大学.2008.
© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号 地址：北京市海淀区学院路29号 邮编：100083 电话：办公室：(+86 10)66554848；文献借阅、咨询服务、科技查新：66554700 |