陶瓷基片激光加工技术的实验研究
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摘要
陶瓷具有耐热性能高、硬度大、化学稳定性好等优异的机械、物理性能,在很多领域都有广泛的应用。由于陶瓷材料具有脆硬的特点,使用传统加工方法对其加工非常困难,加工表面容易产生破损,加工效率也不高。激光加工是最近出现的一种很有潜力的加工手段,具有很高材料去除效率。本文对影响激光陶瓷划片效果的技术进行了分析和实验研究,并以紫外激光划片为例,研究了速度、占空比、脉冲重复频率和离焦量等激光加工工艺参数对激光划片的影响。激光切割过程包括直接汽化材料和熔融材料的辅吹气体溅射两种方式,对陶瓷材料切割时,由于熔融态陶瓷有较强的黏附性,切割一般得不到很好的切边效果。本文提出在陶瓷下表面附薄层材料的方法来改善切边效果,并用实验验证了这种方法是可行的。
Outstanding mechanical and physical properties like high thermal resistance, high hardness and chemical stability have encouraged use of ceramics in several applications. The brittle and hard nature of these ceramics makes them difficult to machine using conventional techniques and damage caused to the surface while machining affects efficiency of components. Laser machining has recently emerged as a potential technique for attaining high material removal rates. In thesis, a qualitative analysis and experimental verification of the effect of certain factors in relation to ceramics scribing is conducted, and take ultraviolet laser scribing as an example to analyze the effect of those processing parameter to the ceramics scribing, such as velocity, duty ratio, repeat frequency and off-focus offset. Laser machining ceramics is carried out by either direct vaporisation or assist gas ejection of laser-melted materials. For ceramics materials, due to the high viscosity of the materials in the molten state, it is difficult to achieve a clean cut. In order to improve this situation, this paper presents a method of attaching thin slab to the lower surface, and verifies it as a possible method by experiment.
Outstanding mechanical and physical properties like high thermal resistance, high hardness and chemical stability have encouraged use of ceramics in several applications. The brittle and hard nature of these ceramics makes them difficult to machine using conventional techniques and damage caused to the surface while machining affects efficiency of components. Laser machining has recently emerged as a potential technique for attaining high material removal rates. In thesis, a qualitative analysis and experimental verification of the effect of certain factors in relation to ceramics scribing is conducted, and take ultraviolet laser scribing as an example to analyze the effect of those processing parameter to the ceramics scribing, such as velocity, duty ratio, repeat frequency and off-focus offset. Laser machining ceramics is carried out by either direct vaporisation or assist gas ejection of laser-melted materials. For ceramics materials, due to the high viscosity of the materials in the molten state, it is difficult to achieve a clean cut. In order to improve this situation, this paper presents a method of attaching thin slab to the lower surface, and verifies it as a possible method by experiment.
引文
[1]袁巨龙,袁哲俊.功能陶瓷的超精密加工技术[M].哈尔滨:哈尔滨工业大学出版社,2000.1-2.
[2]李家驹.陶瓷工艺学[M].北京:中国轻工业出版社,2001.1-3.
[3]李嘉,尹衍生,张金升,等.纳米陶瓷研究进展[N].济南大学学报(自然科学版),2002(1):96-99.
[4] J R Davis.ASM Materials Engineering Dictionary[J].ASM International,1992(14):54-58.
[5]周玉.陶瓷材料学[M].黑龙江:哈尔滨工业大学出版社,1995.
[6]邢世凯,吕世君,闻德生等.应用于汽车工业的特种陶瓷材料及其研究发展[J].中国陶瓷,2003,39(4):35-38.
[7]李素平,封鉴秋,包华等.氧化错陶瓷机械密封环的研制[J].河南建材,2005,14(5):14-15.
[8]潘际銮.我国机械工程学科的发展与未来展望[N].机械工程学报,1993,9(5):3-11.
[9]曲远方.功能陶瓷材料[M].北京:化学工业出版社,2003.3-4.
[10]曲远方.功能陶瓷材料[M].北京:化学工业出版社,2003.1-2.
[11]曲远方.功能陶瓷材料[M].北京:化学工业出版社,2003.296-297.
[12]蔡作乾,王琏.陶瓷材料辞典[M].北京:化学工业出版社,319-326.
[13]江东亮.精细陶瓷材料[M].北京:中国物资出版社,2000,62-64.
[14]石功奇.王健.丁培道.陶瓷基片材料的研究现状[J].功能材料,1993,24(2):176-180.
[15]黎春阳,任瑞铭,董洪亮.Al2O3基陶瓷基片的制备及其性能[N].大连交通大学学报,29(3),54-57.
[16]倪文.矿物材料导论[M].北京:科学出版社,1999.
[17]刘永红.非导电超硬材料电加工新技术及其机理探索研究[D].哈尔滨工业大学学院, 2000.
[18]李企芳.难加工材料的加工技术[M].北京:北京科学技术出版社,1992,9-10.
[19] Cao fengguo.A Study of Polishing conductive - Ceramics with A Complex Technology of Spark Ultrasonic[J]. Proceeding of International Symposium for Electro-Machining ( ISEM),1989(9): 742-751.
[20]汲丛平.Al_2O_3陶瓷的激光铣削试验研究[D].大连理工大学,2006.
[21]I Puertas, C J Luis. A revision of the app lication of the electrical discharge machining process to the manufacture of conductive ceramics[J].RevMetMadrid,2002,38(5):358-372.
[22]胡传炘,夏志东.特种加工手册[M].北京:北京工业大学出版社,2001,224-230.
[23]胡传炘,夏志东.特种加工手册[M].北京:北京工业大学出版社,2001,121-136.
[24]童幸生,袁耀华.工程陶瓷零件的磨削加工[N].三峡大学学报,2001,23(2):165-168.
[25]铁瑛,赵波,张波等.工程陶瓷材料精密磨削加工技术的新发展[N].焦作工学院学报,2003,22(3):217-220.
[26]张永康.激光加工技术[M].北京:化学工业出版社.2004,14-15.
[27]唐元冀.激光切割在工业上应用的现状[J],激光与光电子学进展,2002,39(1):53-56.
[28]李洪峰,李嘉,温雨.陶瓷材料电火花加工技术及研究进展[N].济南大学学报(自然科学版),2008,22(2):178-181.
[29]赵福令,冯冬菊,史俊才等.陶瓷材料超声旋转加工技术[J],电加工与磨具,2001(1),1-5.
[30] Drir D F Dauw. Electricity Conductive Ceramics[J].Annals of the CIRP,2002,5(6):234-239.
[31]霍孟友.导电性工程陶瓷材料的放电加工[J].新技术新工艺,2000(6):12-14.
[32]张珊,康少英.激光加工结构陶瓷的实验研究[J].中国激光,1995,22(10):797-800.
[33]关振中主编,激光加工工艺手册[M]。北京:中国计量出版社,1992.
[34]张永康.激光加工技术[M].北京:化学工业出版社.2004,14-15.
[35]昊希让.陶瓷磨削的新方法[J].汽车工艺与材料.1995,5(9):12-16.
[36]王军,郑焕文等.工程陶瓷超声波磨削加工技术[J].金刚石与磨料磨具工程,2000,3(117):32-34.
[37]A G Evans, E Charles. EDM Technical Manual[M].USA: Texas Technology,1994.
[38]唐元冀.激光切割在工业上应用的现状[J].激光与光电子学进展,2002,39(1):53-56.
[39]张珊,康少英.激光加工结构陶瓷的实验研究[J].中国激光,1995,22(10):797-800.
[40]K.Li, P.Sheng. Plane stress model for fracture of ceramics during laser cutting.[J].Int. J.Mach. Tools Manufact,1995,35(11):1493～1506
[41] R.Akarapu, A.E.Segall. Numerical simulations of an active-stressing technique for delaying fracture during cutting of alumina[J].J. Manufacturing Science and Engineering , 2006 , 128 :921～927.
[42]YuZan Wang, Lehnming Lin. Characterization of laser cleaving on glass sheets with a line shape beam[J].Optics & Laser Technology,2007,39:892～899
[43]Chwan-Huei Tsai,Bor-Chang Lin. Laser cutting with controlled fracture and pre-bending applied to LCD glass separation[J]. IntJ.Adv. Manuf. Technol.2005.Original article
[44]Chwan-Huei Tsai, Chuen-Heng Ou. Machining a smooth surface of ceramic material by laser fracture machining technique [J].J.Materials Processing Technology ,2004,155～156:1797～1804
[45]Chwan-Huei Tsai, Hong-Wen Chen. Laser cutting of thick ceramic substrates by controlled fracture technique[J].J.Materials Processing Technology,2003,136:166～173
[46]V.Pereles-Santiago, M.Washington , P.Brugan et al.., Fasterand damage reduced laser cutting of thick ceramics using a simultaneous prescore approach[J].J.Laser Applications,2005 ,17(4): 219～224
[47]毕华丽.激光切割技术中工艺技术的试验研究[D].大连理工大学,2006.
[48]陈俊彦.最新精细陶瓷技术[M].北京:中国建筑工业出版社,1988.
[49]张辽远.现代加工技术[M].北京:机械工业出版社,2002,(8):146.
[50]朱企业.激光精密加工[M].北京:机械工业出版社,1990,22-26.
[51]陆建,倪晓武,贺安之.激光与材料相互作用物理学[M].北京:机械工业出版社,1996,13-15.
[52]陆建,倪晓武,贺安之.激光与材料相互作用物理学[M].北京:机械工业出版社,1996,16-17
[53]刘金环.高斯光束的光学变换[J].光学精密工程,1994,2(3): 15-21.
[2]李家驹.陶瓷工艺学[M].北京:中国轻工业出版社,2001.1-3.
[3]李嘉,尹衍生,张金升,等.纳米陶瓷研究进展[N].济南大学学报(自然科学版),2002(1):96-99.
[4] J R Davis.ASM Materials Engineering Dictionary[J].ASM International,1992(14):54-58.
[5]周玉.陶瓷材料学[M].黑龙江:哈尔滨工业大学出版社,1995.
[6]邢世凯,吕世君,闻德生等.应用于汽车工业的特种陶瓷材料及其研究发展[J].中国陶瓷,2003,39(4):35-38.
[7]李素平,封鉴秋,包华等.氧化错陶瓷机械密封环的研制[J].河南建材,2005,14(5):14-15.
[8]潘际銮.我国机械工程学科的发展与未来展望[N].机械工程学报,1993,9(5):3-11.
[9]曲远方.功能陶瓷材料[M].北京:化学工业出版社,2003.3-4.
[10]曲远方.功能陶瓷材料[M].北京:化学工业出版社,2003.1-2.
[11]曲远方.功能陶瓷材料[M].北京:化学工业出版社,2003.296-297.
[12]蔡作乾,王琏.陶瓷材料辞典[M].北京:化学工业出版社,319-326.
[13]江东亮.精细陶瓷材料[M].北京:中国物资出版社,2000,62-64.
[14]石功奇.王健.丁培道.陶瓷基片材料的研究现状[J].功能材料,1993,24(2):176-180.
[15]黎春阳,任瑞铭,董洪亮.Al2O3基陶瓷基片的制备及其性能[N].大连交通大学学报,29(3),54-57.
[16]倪文.矿物材料导论[M].北京:科学出版社,1999.
[17]刘永红.非导电超硬材料电加工新技术及其机理探索研究[D].哈尔滨工业大学学院, 2000.
[18]李企芳.难加工材料的加工技术[M].北京:北京科学技术出版社,1992,9-10.
[19] Cao fengguo.A Study of Polishing conductive - Ceramics with A Complex Technology of Spark Ultrasonic[J]. Proceeding of International Symposium for Electro-Machining ( ISEM),1989(9): 742-751.
[20]汲丛平.Al_2O_3陶瓷的激光铣削试验研究[D].大连理工大学,2006.
[21]I Puertas, C J Luis. A revision of the app lication of the electrical discharge machining process to the manufacture of conductive ceramics[J].RevMetMadrid,2002,38(5):358-372.
[22]胡传炘,夏志东.特种加工手册[M].北京:北京工业大学出版社,2001,224-230.
[23]胡传炘,夏志东.特种加工手册[M].北京:北京工业大学出版社,2001,121-136.
[24]童幸生,袁耀华.工程陶瓷零件的磨削加工[N].三峡大学学报,2001,23(2):165-168.
[25]铁瑛,赵波,张波等.工程陶瓷材料精密磨削加工技术的新发展[N].焦作工学院学报,2003,22(3):217-220.
[26]张永康.激光加工技术[M].北京:化学工业出版社.2004,14-15.
[27]唐元冀.激光切割在工业上应用的现状[J],激光与光电子学进展,2002,39(1):53-56.
[28]李洪峰,李嘉,温雨.陶瓷材料电火花加工技术及研究进展[N].济南大学学报(自然科学版),2008,22(2):178-181.
[29]赵福令,冯冬菊,史俊才等.陶瓷材料超声旋转加工技术[J],电加工与磨具,2001(1),1-5.
[30] Drir D F Dauw. Electricity Conductive Ceramics[J].Annals of the CIRP,2002,5(6):234-239.
[31]霍孟友.导电性工程陶瓷材料的放电加工[J].新技术新工艺,2000(6):12-14.
[32]张珊,康少英.激光加工结构陶瓷的实验研究[J].中国激光,1995,22(10):797-800.
[33]关振中主编,激光加工工艺手册[M]。北京:中国计量出版社,1992.
[34]张永康.激光加工技术[M].北京:化学工业出版社.2004,14-15.
[35]昊希让.陶瓷磨削的新方法[J].汽车工艺与材料.1995,5(9):12-16.
[36]王军,郑焕文等.工程陶瓷超声波磨削加工技术[J].金刚石与磨料磨具工程,2000,3(117):32-34.
[37]A G Evans, E Charles. EDM Technical Manual[M].USA: Texas Technology,1994.
[38]唐元冀.激光切割在工业上应用的现状[J].激光与光电子学进展,2002,39(1):53-56.
[39]张珊,康少英.激光加工结构陶瓷的实验研究[J].中国激光,1995,22(10):797-800.
[40]K.Li, P.Sheng. Plane stress model for fracture of ceramics during laser cutting.[J].Int. J.Mach. Tools Manufact,1995,35(11):1493～1506
[41] R.Akarapu, A.E.Segall. Numerical simulations of an active-stressing technique for delaying fracture during cutting of alumina[J].J. Manufacturing Science and Engineering , 2006 , 128 :921～927.
[42]YuZan Wang, Lehnming Lin. Characterization of laser cleaving on glass sheets with a line shape beam[J].Optics & Laser Technology,2007,39:892～899
[43]Chwan-Huei Tsai,Bor-Chang Lin. Laser cutting with controlled fracture and pre-bending applied to LCD glass separation[J]. IntJ.Adv. Manuf. Technol.2005.Original article
[44]Chwan-Huei Tsai, Chuen-Heng Ou. Machining a smooth surface of ceramic material by laser fracture machining technique [J].J.Materials Processing Technology ,2004,155～156:1797～1804
[45]Chwan-Huei Tsai, Hong-Wen Chen. Laser cutting of thick ceramic substrates by controlled fracture technique[J].J.Materials Processing Technology,2003,136:166～173
[46]V.Pereles-Santiago, M.Washington , P.Brugan et al.., Fasterand damage reduced laser cutting of thick ceramics using a simultaneous prescore approach[J].J.Laser Applications,2005 ,17(4): 219～224
[47]毕华丽.激光切割技术中工艺技术的试验研究[D].大连理工大学,2006.
[48]陈俊彦.最新精细陶瓷技术[M].北京:中国建筑工业出版社,1988.
[49]张辽远.现代加工技术[M].北京:机械工业出版社,2002,(8):146.
[50]朱企业.激光精密加工[M].北京:机械工业出版社,1990,22-26.
[51]陆建,倪晓武,贺安之.激光与材料相互作用物理学[M].北京:机械工业出版社,1996,13-15.
[52]陆建,倪晓武,贺安之.激光与材料相互作用物理学[M].北京:机械工业出版社,1996,16-17
[53]刘金环.高斯光束的光学变换[J].光学精密工程,1994,2(3): 15-21.