粉末冶金法制备β-SiCp/Al电子封装材料工艺与性能研究
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摘要
β-SiCP/Al复合材料具有高导热、低膨胀、高模量、高化学稳定性、低密度等优异的性能,在电子封装领域具有广阔的应用前景。粉末冶金方法具有两相混合均匀、成分控制和材料成形均比较容易实现、可以获得高致密度的复合材料等多方面的优点,是制备金属基复合材料,特别是颗粒增强金属基复合材料的常用方法,因此本文采用粉末冶金方法制备体积分数为50%的β-SiC/Al电子封装材料。
论文实验中根据振实密度、松装密度、空隙率测试结果,首次采用工业炉生产的平均粒度为17.94μm的β-SiC微粉作为增强体制备铝基电子封装材料。实验中对β-SiC微粉进行1100℃的高温氧化、HF酸洗和200℃烘干的表面处理方法,除去SiC表面的吸附气体和水分并使其棱角钝化,提高了β-SiC粉体的分散性,制备出了增强体分布均匀、致密度高、孔隙少的β-SiC/Al电子封装材料。论文研究了成型压力、烧结温度、热压压力对材料热导率和热膨胀系数的影响,采用金相显微镜、扫面电镜和X-衍射等方法研究了材料的物相,组织形貌及致密度的变化。利用动态热机械分析仪测试了复合材料的热膨胀系数,利用激光导热仪测试了复合材料的热导率,确定的比较理想的制备工艺参数为成型压力320MPa、烧结温度1000℃、热压压力3 MPa。
本文实验条件下制备的β-SiC/A1电子封装材料具有比较好的综合热物理性能,在20℃～150℃平均线膨胀系数为8.86×10-6K-1;在室温下其热导率为124 W·m-1·K-1,可满足大功率电子器件对封装材料的使用性能要求。
With excellent high quality of high thermal conductivity, low expansion, high module, high chemical stability and low density,β-SiCP/Al composite enjoys great potential of application in the realm of electronic packaging.
Powder Metallurgy Method has the following advantages:mixing uniformity,component easily controlled,forming more easily,geting high density composite materials,etc.it is a commonly used methods to manufacture Metal Matrix Composites,especially particle reinforced metal matrix composites.So we adopt Powder Metallurgy Method to manufactureβ-SiC/Al Electronic packaging materials with volume fraction to 50%.
Testing the tap density , bulk densityand porosity ofβ-SiC powder, the average size D = 17.94μm ofβ-SiC particles is good at reinforcement phase. Surface treatment methods for the sic micro powder include the following three steps:the high temperature oxidation 1,100 degrees,HF acid pickling,200degrees drying,these methods eliminated adsorption of gases and moisture,made edges passivation and improved the dispersion of SiC micropowder,manufacturedβ- SiC/Al electronic packaging materials with enhance body distributed evenly,high density,pore less.In the process,the specific preparation processes of forming pressure,sintering temperature,hot-pressure have an effects on the material morphology ,relative density. Determining the forming pressure 320MPa,the sintering temperature1000℃,hot- pressure 3MPa as the optimal parameters in the preparation of 50%β-SiCp/Al .
To sum up, The 50%β-SiCp/Al composites fabricated by powder-metallurgy with 17.94μm spherical SiC particles enjoy perfect comprehensive thermal and physical properties.: its its coefficient of thermal expansion is 8.86×10-6·K-1 under20℃～150℃; the thermal conductivity is 124W·m-1·K-1 .Owing to the high temperature applied, the network composites produced are sound. The results indicate that the composites sintered in liquid phase always satisfy the electronic packaging application.
论文实验中根据振实密度、松装密度、空隙率测试结果,首次采用工业炉生产的平均粒度为17.94μm的β-SiC微粉作为增强体制备铝基电子封装材料。实验中对β-SiC微粉进行1100℃的高温氧化、HF酸洗和200℃烘干的表面处理方法,除去SiC表面的吸附气体和水分并使其棱角钝化,提高了β-SiC粉体的分散性,制备出了增强体分布均匀、致密度高、孔隙少的β-SiC/Al电子封装材料。论文研究了成型压力、烧结温度、热压压力对材料热导率和热膨胀系数的影响,采用金相显微镜、扫面电镜和X-衍射等方法研究了材料的物相,组织形貌及致密度的变化。利用动态热机械分析仪测试了复合材料的热膨胀系数,利用激光导热仪测试了复合材料的热导率,确定的比较理想的制备工艺参数为成型压力320MPa、烧结温度1000℃、热压压力3 MPa。
本文实验条件下制备的β-SiC/A1电子封装材料具有比较好的综合热物理性能,在20℃～150℃平均线膨胀系数为8.86×10-6K-1;在室温下其热导率为124 W·m-1·K-1,可满足大功率电子器件对封装材料的使用性能要求。
With excellent high quality of high thermal conductivity, low expansion, high module, high chemical stability and low density,β-SiCP/Al composite enjoys great potential of application in the realm of electronic packaging.
Powder Metallurgy Method has the following advantages:mixing uniformity,component easily controlled,forming more easily,geting high density composite materials,etc.it is a commonly used methods to manufacture Metal Matrix Composites,especially particle reinforced metal matrix composites.So we adopt Powder Metallurgy Method to manufactureβ-SiC/Al Electronic packaging materials with volume fraction to 50%.
Testing the tap density , bulk densityand porosity ofβ-SiC powder, the average size D = 17.94μm ofβ-SiC particles is good at reinforcement phase. Surface treatment methods for the sic micro powder include the following three steps:the high temperature oxidation 1,100 degrees,HF acid pickling,200degrees drying,these methods eliminated adsorption of gases and moisture,made edges passivation and improved the dispersion of SiC micropowder,manufacturedβ- SiC/Al electronic packaging materials with enhance body distributed evenly,high density,pore less.In the process,the specific preparation processes of forming pressure,sintering temperature,hot-pressure have an effects on the material morphology ,relative density. Determining the forming pressure 320MPa,the sintering temperature1000℃,hot- pressure 3MPa as the optimal parameters in the preparation of 50%β-SiCp/Al .
To sum up, The 50%β-SiCp/Al composites fabricated by powder-metallurgy with 17.94μm spherical SiC particles enjoy perfect comprehensive thermal and physical properties.: its its coefficient of thermal expansion is 8.86×10-6·K-1 under20℃～150℃; the thermal conductivity is 124W·m-1·K-1 .Owing to the high temperature applied, the network composites produced are sound. The results indicate that the composites sintered in liquid phase always satisfy the electronic packaging application.
引文
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