Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

详细信息    查看全文

• 作者：Peng Peng ; Anming Hu ; Adrian P. Gerlich ; Guisheng Zou ; Lei Liu ; Y. Norman Zhou
• 刊名：ACS Applied Materials & Interfaces
• 出版年：2015
• 出版时间：June 17, 2015
• 年：2015
• 卷：7
• 期：23
• 页码：12597-12618
• 全文大小：1026K
• ISSN：1944-8252

文摘

A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated. The mechanical and electrical properties of sintered silver nanomaterial joints at low temperatures are discussed in terms of the key influencing factors, such as porosity and coverage of substrates, parameters for the sintering processes, and the size and shape of nanomaterials. Further, the use of sintered silver nanomaterials for printable electronics and as robust surface-enhanced Raman spectroscopy substrates by exploiting their optical properties is also considered. Other low-temperature nanojoining strategies such as optical welding of silver nanowires (NWs) through a plasmonic heating effect by visible light irradiation, ultrafast laser nanojoining, and ion-activated joining of silver NPs using ionic solvents are also summarized. In addition, pressure-driven joining of silver NWs with large plastic deformation and self-joining of gold or silver NWs via oriented attachment of clean and activated surfaces are summarized. Finally, at the end of this review, the future outlook for joining applications with silver nanomaterials is explored.