IMC厚度对倒装芯片组装微焊点热疲劳寿命的影响
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摘要
为研究微焊点中金属间化合物(IMC)比例不断增加对其热疲劳可靠性的影响,构建了细间距倒装芯片组装的有限元模型,探讨热循环条件下微焊点的累积损伤与疲劳寿命;采用Darveaux疲劳寿命预测模型建立损伤尺度与热循环次数间的关系,定量计算不同IMC厚度下微焊点的疲劳寿命。结果表明,在稳定热循环条件下,随着微焊点中IMC厚度的增加,微焊点的累积塑性应变能密度增量增大,疲劳寿命降低;当IMC在微焊点中所占比例达到80%时,微焊点的疲劳寿命降低约25%,但IMC厚度的增加对微焊点疲劳裂纹的萌生位置几乎没有影响。
To investigate the effect of increasing proportion of intermetallic compounds(IMC)in the micro-joint on its thermal fatigue reliability,the finite element model for a fine pitch flip chip assembly was constructed in this paper,which was used to discuss the cumulative damage and fatigue life of the micro-joint during thermal cycling conditions.Based on Darveaux fatigue life prediction model,the relationship between damage scale and thermal cycles was established,and the fatigue life of micro-joints with different IMC thickness was calculated.The results showed that with the increase of IMC thickness in the micro-solder,the cumulative plastic strain energy density increased and the fatigue life decreased.When the IMC reached 80% of the micro-joint,the fatigue life would be reduced by about 25%.However,the increase of IMC thickness had little effect on the initiation position of fatigue crack of micro-joint.
To investigate the effect of increasing proportion of intermetallic compounds(IMC)in the micro-joint on its thermal fatigue reliability,the finite element model for a fine pitch flip chip assembly was constructed in this paper,which was used to discuss the cumulative damage and fatigue life of the micro-joint during thermal cycling conditions.Based on Darveaux fatigue life prediction model,the relationship between damage scale and thermal cycles was established,and the fatigue life of micro-joints with different IMC thickness was calculated.The results showed that with the increase of IMC thickness in the micro-solder,the cumulative plastic strain energy density increased and the fatigue life decreased.When the IMC reached 80% of the micro-joint,the fatigue life would be reduced by about 25%.However,the increase of IMC thickness had little effect on the initiation position of fatigue crack of micro-joint.
引文
[1]ZHU Q S,GAO F,MA H C,et al.Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current[J].Journal of Materials Science Materials in Electronics,2017(1):1-9.
[2]Choudhury S F,Ladani L.Miniaturization of micro-solder bumps and effect of IMC on stress distribution[J].Journal of Electronic Materials,2016,45(7):1-12.
[3]Mukherjee S,Chauhan P,Osterman M,et al.Mechanistic prediction of the effect of microstructural coarsening on creep response of SnAgCu solder joints[J].Journal of Electronic Materials,2016,45(7):3 712-3 725.
[4]Marques V M F,Johnston C and Grant P S.Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing[J].Journal of Alloys&Compounds,2014,613(2):387-394.
[5]CHE F X,PANG J H L.Characterization of IMC layer and its effect on thermomechanical fa tigue life of Sn-3.8Ag-0.7Cu solder joints[J].Journal of Alloys&Compounds,2012,541(30):6-13.
[6]Choudhury S F,Ladani L.Effect of intermetallic compounds on the thermo-mechanical fatigue life of 3-Dimensional IC package micro solder bumps:finite element analysis&study[J].Journal of Electronic Packaging,2015,137(4):64-77.
[7]MU D K,Mcdonald S D,Read J,et al.Critical properties of Cu6Sn5 in electronic devices:recent progress and a review[J].Current Opinion in Solid State&Materials Science,2015,20(2):55-76.
[8]YANG T L,Aoki T,Matsumoto K,et al.Full intermetallic joints for chip stacking by using thermal gradient bonding[J].Acta Materialia,2016,113:90-97.
[9]YANG D,CAI J,WANG Q,et al.IMC growth and shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints under thermal cycling[J].Journal of Materials Science Materials in Electronics,2015,26(2):962-969.
[10]Sona M,Prabhu K N.Effect of Reflow time on wetting behavior,microstructure evolution,andjoint strength of Sn-2.5Ag-0.5Cu solder on bare and nickel-coated copper substrates[J].Journal of Electronic Materials,2016,45(7):3 744-3 758.
[11]XIAO H,LUO D J and ZOU Y B.Damage behavior and life prediction for lead-free solder joints in a CSP assembly under thermal cycling[C]//Proceedings of the International Conference on Reliability,2015:650-654.
[12]LI Z L,CHENG L X,LI G Y,et al.Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO 2 solder joints[J].Journal of Alloys&Compounds,2016,697:104-113.
[13]WANG W,Robbins D and Glancey C.Simulation model to predict failure cycles in board level drop test[C]//Proceedings of the Electronic Components and Technology Conference,2016:1 886-1 891.
[14]TIAN Y,LIU X,CHOW J,et al.Comparison of Sn-Ag-Cu solder alloy intermetallic cmpound Ggrowth under different thermal excursions for fine-pitch flip-chip assemblies[J].Journal of Electronic Materials,2013,42(8):2 724-2 731.
[15]田野,任宁.热冲击条件下倒装组装微焊点的可靠性---寿命预测[J].焊接学报,2016,37(2):67-70.
[16]Darveaux R.Effect of simulation methodology on solder joint crack growth correlation[C]//Proceedings of the Electronic Components&Technology Conference,2000.
[17]HAN C,HAN B.Board level reliability analysis of chip resistor assemblies under thermal cycling:Aa comparison study between SnPb and SnAgCu[J].Journal of Mechanical Science&Technology,2014,28(3):879-886.
[2]Choudhury S F,Ladani L.Miniaturization of micro-solder bumps and effect of IMC on stress distribution[J].Journal of Electronic Materials,2016,45(7):1-12.
[3]Mukherjee S,Chauhan P,Osterman M,et al.Mechanistic prediction of the effect of microstructural coarsening on creep response of SnAgCu solder joints[J].Journal of Electronic Materials,2016,45(7):3 712-3 725.
[4]Marques V M F,Johnston C and Grant P S.Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing[J].Journal of Alloys&Compounds,2014,613(2):387-394.
[5]CHE F X,PANG J H L.Characterization of IMC layer and its effect on thermomechanical fa tigue life of Sn-3.8Ag-0.7Cu solder joints[J].Journal of Alloys&Compounds,2012,541(30):6-13.
[6]Choudhury S F,Ladani L.Effect of intermetallic compounds on the thermo-mechanical fatigue life of 3-Dimensional IC package micro solder bumps:finite element analysis&study[J].Journal of Electronic Packaging,2015,137(4):64-77.
[7]MU D K,Mcdonald S D,Read J,et al.Critical properties of Cu6Sn5 in electronic devices:recent progress and a review[J].Current Opinion in Solid State&Materials Science,2015,20(2):55-76.
[8]YANG T L,Aoki T,Matsumoto K,et al.Full intermetallic joints for chip stacking by using thermal gradient bonding[J].Acta Materialia,2016,113:90-97.
[9]YANG D,CAI J,WANG Q,et al.IMC growth and shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints under thermal cycling[J].Journal of Materials Science Materials in Electronics,2015,26(2):962-969.
[10]Sona M,Prabhu K N.Effect of Reflow time on wetting behavior,microstructure evolution,andjoint strength of Sn-2.5Ag-0.5Cu solder on bare and nickel-coated copper substrates[J].Journal of Electronic Materials,2016,45(7):3 744-3 758.
[11]XIAO H,LUO D J and ZOU Y B.Damage behavior and life prediction for lead-free solder joints in a CSP assembly under thermal cycling[C]//Proceedings of the International Conference on Reliability,2015:650-654.
[12]LI Z L,CHENG L X,LI G Y,et al.Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO 2 solder joints[J].Journal of Alloys&Compounds,2016,697:104-113.
[13]WANG W,Robbins D and Glancey C.Simulation model to predict failure cycles in board level drop test[C]//Proceedings of the Electronic Components and Technology Conference,2016:1 886-1 891.
[14]TIAN Y,LIU X,CHOW J,et al.Comparison of Sn-Ag-Cu solder alloy intermetallic cmpound Ggrowth under different thermal excursions for fine-pitch flip-chip assemblies[J].Journal of Electronic Materials,2013,42(8):2 724-2 731.
[15]田野,任宁.热冲击条件下倒装组装微焊点的可靠性---寿命预测[J].焊接学报,2016,37(2):67-70.
[16]Darveaux R.Effect of simulation methodology on solder joint crack growth correlation[C]//Proceedings of the Electronic Components&Technology Conference,2000.
[17]HAN C,HAN B.Board level reliability analysis of chip resistor assemblies under thermal cycling:Aa comparison study between SnPb and SnAgCu[J].Journal of Mechanical Science&Technology,2014,28(3):879-886.
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