金刚石/Al(或AlSi合金)复合材料性能衰退及抑制
|
摘要
采用气体压力浸渗法制备了金刚石/Al、金刚石/AlSi7和金刚石/AlSi9复合材料,对比研究了其暴露在空气中的性能衰退行为。研究表明,界面反应产物Al_4C_3会潮解生成Al(OH)3,增大界面热阻,导致金刚石/Al复合材料性能衰退。Al基体中添加Si元素可以显著降低其性能衰退速率,其机制为:金刚石中C元素在Al液中溶解度的降低和Si在金刚石颗粒表面的优先析出,抑制了Al_4C_3的生成量;此外,金刚石/AlSi复合材料致密度的提高,对Al_4C_3与水汽的接触起到阻碍作用。讨论了抑制金刚石/Al复合材料性能衰退的几种可行方法,有望进一步提高其在潮湿环境中的使用寿命。
Diamond/Al,diamond/AlSi7 and diamond/AlSi9 composites were fabricated by using gas pressure infiltration,and the decline behaviors for the thermal conductivity of the composites when exposed to the air were analyzed.The results show that the reaction product Al_4C_3 between the diamond and the molten Al can decompose into Al(OH)3 in the humid air,resulting in the decline for the thermal conductivity of diamond/Al composites.Adding element Si into Al is found to inhibit the decline rate effectively,the mechanism of which are as follows:decrease in the amount of Al_4C_3 because of the decrease in the solubility of C of diamond in molten Al and the preferential precipitation of eutectic Si on diamond;increase in the density of the diamond/AlSi composites to prevent the contact between Al_4C_3 and moisture.Some methods of inhibiting the decline of the thermal conductivity of diamond/Al composites were also discussed,which is hopeful to prolong the service time of the composites in humid environment.
Diamond/Al,diamond/AlSi7 and diamond/AlSi9 composites were fabricated by using gas pressure infiltration,and the decline behaviors for the thermal conductivity of the composites when exposed to the air were analyzed.The results show that the reaction product Al_4C_3 between the diamond and the molten Al can decompose into Al(OH)3 in the humid air,resulting in the decline for the thermal conductivity of diamond/Al composites.Adding element Si into Al is found to inhibit the decline rate effectively,the mechanism of which are as follows:decrease in the amount of Al_4C_3 because of the decrease in the solubility of C of diamond in molten Al and the preferential precipitation of eutectic Si on diamond;increase in the density of the diamond/AlSi composites to prevent the contact between Al_4C_3 and moisture.Some methods of inhibiting the decline of the thermal conductivity of diamond/Al composites were also discussed,which is hopeful to prolong the service time of the composites in humid environment.
引文
[1]XU Y J,LUO Z Y,LI X L,et al.Leakage current estimation of CMOS circuit with stack effect[J].Journal of Computer Science and Technology,2004,19(5):708-717.
[2]FU Y,TAN K,TIAN M.Recent development of electronic packaging technology[J].Semiconductor Technology,2009,34(2):113-118.
[3]李卫平,魏由洋,刘慧丛,等.埋砂复合电沉积法制备铜基金刚石复合材料[J].功能材料,2011,42(10):1864-1868.LI W P,WEI Y Y,LIU H C,et al.Preparation of Cudiamond composite using inter-sand co-deposition[J].Journal of Functional Materials,2011,42(10):1864-1868(in Chinese).
[4]HUI C,LI S.Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHTtechniques[J].Journal of Materials Science,2012,47(7):3367-3375.
[5]TAVANGAR R,MOLINA J M,WEBER L.Assessing predictive schemes for thermal conductivity against diamondreinforced silver matrix composites at intermediate phase contrast[J].Scripta Materialia,2007,56(5):357-360.
[6]梁雪冰,褚克,贾成厂.放电等离子烧结制备Diamond/Al复合材料[J].复合材料学报,2008,25(6):192-197.LIANG X B,CHU K,JIA C C.Diamond/Al composites fabricated by spark plasma sintering[J].Acta Materiae Composite Sinica,2008,25(6):192-197(in Chinese).
[7]王青云,沈卫平,马明亮.镀钛金刚石/铜复合材料的热导率[J].复合材料学报,2011,28(6):184-188.WANG Q Y,SHEN W P,MA M L.Thermal conductivity of Ti-coated diamond/Cu composites[J].Acta Materiae Composite Sinica,2011,28(6):184-188(in Chinese).
[8]冯号,于家康,薛晨,等.电子封装用金刚石/铝复合材料的显微组织与热膨胀性能[J].热加工工艺,2010,39(14):59-62.FENG H,YU J K,XUE C,et al.Microstructure and thermal expansion of diamond/Al composites used for electronic packaging[J].Hot Working Technology,2010,39(14):59-62(in Chinese).
[9]MONJE I E,LOUIS E,MOLINA J M.Optimizing thermal conductivity in gas-pressure infiltrated aluminum/diamond composites by precise processing control[J].Composites Part A:Applied Science&Manufacturing,2013,48(1):9-14.
[10]李信.电子封装用Diamond/Al基复合材料的制备及其性能研究[D].成都:成都理工大学,2013.LI X.Study on fabrication and properties of diamond/Al matrix composites used in electronic packaging[D].Chengdu:Chengdu University of Technology,2013(in Chinese).
[11]张洋,车子璠,李建伟,等.气体压力熔渗制备电子封装用金刚石/铝复合材料的研究[J].人工晶体学报,2014,43(9):2241-2250.ZHANG Y,CHE Z P,LI J W,et al.Study on diamond/Al composites prepared by gas pressure infiltration method for thermal management application[J].Journal of Synthetic Crystals,2014,43(9):2241-2250(in Chinese).
[12]陈培架,曾从远,陈锋,等.热压烧结和压力浸渗所制备金刚石/Al复合材料的导热性能分析[J].功能材料,2016,47(10):10184-10188.CHEN P J,ZENG C Y,CHEN F,et al.Analysis on heat transfer mechanism of diamond/Al composites fabricated via hot pressing sintering and pressure infiltration[J].Journal of Functional Materials,2016,47(10):10184-10188(in Chinese).
[13]喻蒙,车仁超.金刚石/铝复合材料的界面结构[J].复旦学报(自然科学版),2014,53(6):790-793.YU M,CHE R C.Interfacial structures of diamond/Al composite material[J].Journal of Fudan University(Natural Science),2014,53(6):790-793(in Chinese).
[14]CHE Z,ZHANG Y,LI J,et al.Nucleation and growth mechanisms of interfacial Al4C3in Al/diamond composites[J].Journal of Alloys&Compounds,2016,657:81-89.
[15]RUCH P W,BEFFORT O,KLEINER S,et al.Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity[J].Composites Science&Technology,2006,66(15):2677-2685.
[16]YANG W,PENG K,ZHU J,et al.Enhanced thermal conductivity and stability of diamond/aluminum composite by introduction of carbide interface layer[J].Diamond&Related Materials,2014,46(24):35-41.
[17]JOHNSON W B,SONUPARLAK B.Diamond/Al metal matrix composites formed by the pressureless metal infiltration process[J].Journal of Materials Research,1993,8(5):1169-1173.
[18]REVZIN B,FUKS D,PELLEG J.Influence of alloying on the solubility of carbon fibers in aluminium-based composites:Non-empirical approach[J].Composites Science&Technology,1996,56(1):3-10.
[19]DINSDALE A T,QUESTED P N.The viscosity of aluminium and its alloys:A review of data and models[J].Journal of Materials Science,2004,39(24):7221-7228.
[20]赵恒先.铸造铝硅合金熔炼与铸锭[M].沈阳:东北大学出版社,2006.ZHAO H X.Cast aluminum silicon alloy smelting and casting[M].Shenyang:Northeastern University Press,2006(in Chinese).
[21]ZHANG,WANG X,WU J.The influence of silicon content on the thermal conductivity of Al-Si/diamond composites[C]//2009International Conference on Electronic Packaging Technology&High Density Packaging.Beijing:IEEE,2009:708-712.
[22]GUO C,HE X,REN S,et al.Effect of(0-40)wt%Si addition to Al on the thermal conductivity and thermal expansion of diamond/Al composites by pressure infiltration[J].Journal of Alloys&Compounds,2016,664:777-783.
[23]CHE Z,WANG Q,WANG L,et al.Interfacial structure evolution of Ti-coated diamond particle reinforced Al matrix composite produced by gas pressure infiltration[J].Composites Part B:Engineering,2017,113:285-290.
[24]BOLLINA R,LANDGRAF J,KNIPPSCHEER S,et al.Thermal management and packaging with diamond composites[C]//ATW Advanced Substrates and Next Generation Semiconductors,2008.
[2]FU Y,TAN K,TIAN M.Recent development of electronic packaging technology[J].Semiconductor Technology,2009,34(2):113-118.
[3]李卫平,魏由洋,刘慧丛,等.埋砂复合电沉积法制备铜基金刚石复合材料[J].功能材料,2011,42(10):1864-1868.LI W P,WEI Y Y,LIU H C,et al.Preparation of Cudiamond composite using inter-sand co-deposition[J].Journal of Functional Materials,2011,42(10):1864-1868(in Chinese).
[4]HUI C,LI S.Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHTtechniques[J].Journal of Materials Science,2012,47(7):3367-3375.
[5]TAVANGAR R,MOLINA J M,WEBER L.Assessing predictive schemes for thermal conductivity against diamondreinforced silver matrix composites at intermediate phase contrast[J].Scripta Materialia,2007,56(5):357-360.
[6]梁雪冰,褚克,贾成厂.放电等离子烧结制备Diamond/Al复合材料[J].复合材料学报,2008,25(6):192-197.LIANG X B,CHU K,JIA C C.Diamond/Al composites fabricated by spark plasma sintering[J].Acta Materiae Composite Sinica,2008,25(6):192-197(in Chinese).
[7]王青云,沈卫平,马明亮.镀钛金刚石/铜复合材料的热导率[J].复合材料学报,2011,28(6):184-188.WANG Q Y,SHEN W P,MA M L.Thermal conductivity of Ti-coated diamond/Cu composites[J].Acta Materiae Composite Sinica,2011,28(6):184-188(in Chinese).
[8]冯号,于家康,薛晨,等.电子封装用金刚石/铝复合材料的显微组织与热膨胀性能[J].热加工工艺,2010,39(14):59-62.FENG H,YU J K,XUE C,et al.Microstructure and thermal expansion of diamond/Al composites used for electronic packaging[J].Hot Working Technology,2010,39(14):59-62(in Chinese).
[9]MONJE I E,LOUIS E,MOLINA J M.Optimizing thermal conductivity in gas-pressure infiltrated aluminum/diamond composites by precise processing control[J].Composites Part A:Applied Science&Manufacturing,2013,48(1):9-14.
[10]李信.电子封装用Diamond/Al基复合材料的制备及其性能研究[D].成都:成都理工大学,2013.LI X.Study on fabrication and properties of diamond/Al matrix composites used in electronic packaging[D].Chengdu:Chengdu University of Technology,2013(in Chinese).
[11]张洋,车子璠,李建伟,等.气体压力熔渗制备电子封装用金刚石/铝复合材料的研究[J].人工晶体学报,2014,43(9):2241-2250.ZHANG Y,CHE Z P,LI J W,et al.Study on diamond/Al composites prepared by gas pressure infiltration method for thermal management application[J].Journal of Synthetic Crystals,2014,43(9):2241-2250(in Chinese).
[12]陈培架,曾从远,陈锋,等.热压烧结和压力浸渗所制备金刚石/Al复合材料的导热性能分析[J].功能材料,2016,47(10):10184-10188.CHEN P J,ZENG C Y,CHEN F,et al.Analysis on heat transfer mechanism of diamond/Al composites fabricated via hot pressing sintering and pressure infiltration[J].Journal of Functional Materials,2016,47(10):10184-10188(in Chinese).
[13]喻蒙,车仁超.金刚石/铝复合材料的界面结构[J].复旦学报(自然科学版),2014,53(6):790-793.YU M,CHE R C.Interfacial structures of diamond/Al composite material[J].Journal of Fudan University(Natural Science),2014,53(6):790-793(in Chinese).
[14]CHE Z,ZHANG Y,LI J,et al.Nucleation and growth mechanisms of interfacial Al4C3in Al/diamond composites[J].Journal of Alloys&Compounds,2016,657:81-89.
[15]RUCH P W,BEFFORT O,KLEINER S,et al.Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity[J].Composites Science&Technology,2006,66(15):2677-2685.
[16]YANG W,PENG K,ZHU J,et al.Enhanced thermal conductivity and stability of diamond/aluminum composite by introduction of carbide interface layer[J].Diamond&Related Materials,2014,46(24):35-41.
[17]JOHNSON W B,SONUPARLAK B.Diamond/Al metal matrix composites formed by the pressureless metal infiltration process[J].Journal of Materials Research,1993,8(5):1169-1173.
[18]REVZIN B,FUKS D,PELLEG J.Influence of alloying on the solubility of carbon fibers in aluminium-based composites:Non-empirical approach[J].Composites Science&Technology,1996,56(1):3-10.
[19]DINSDALE A T,QUESTED P N.The viscosity of aluminium and its alloys:A review of data and models[J].Journal of Materials Science,2004,39(24):7221-7228.
[20]赵恒先.铸造铝硅合金熔炼与铸锭[M].沈阳:东北大学出版社,2006.ZHAO H X.Cast aluminum silicon alloy smelting and casting[M].Shenyang:Northeastern University Press,2006(in Chinese).
[21]ZHANG,WANG X,WU J.The influence of silicon content on the thermal conductivity of Al-Si/diamond composites[C]//2009International Conference on Electronic Packaging Technology&High Density Packaging.Beijing:IEEE,2009:708-712.
[22]GUO C,HE X,REN S,et al.Effect of(0-40)wt%Si addition to Al on the thermal conductivity and thermal expansion of diamond/Al composites by pressure infiltration[J].Journal of Alloys&Compounds,2016,664:777-783.
[23]CHE Z,WANG Q,WANG L,et al.Interfacial structure evolution of Ti-coated diamond particle reinforced Al matrix composite produced by gas pressure infiltration[J].Composites Part B:Engineering,2017,113:285-290.
[24]BOLLINA R,LANDGRAF J,KNIPPSCHEER S,et al.Thermal management and packaging with diamond composites[C]//ATW Advanced Substrates and Next Generation Semiconductors,2008.
© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号 地址：北京市海淀区学院路29号 邮编：100083 电话：办公室：(+86 10)66554848；文献借阅、咨询服务、科技查新：66554700 |