一种新型等离子体磁控溅射镀膜电源设计
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摘要
磁控溅射镀膜电源是磁控溅射系统中的关键设备之一。根据铌靶和锡靶溅射处理装置的技术要求,研制了一套输出电压0～800V可调、脉冲宽度5～200μs可调、频率0～60Hz可调、在脉冲电流最大幅值约150A的磁控溅射镀膜电源,分别给出了该电源在铌靶负载和锡靶负载下的实验结果。设计上采用高压短脉冲预电离一体化高功率双极性脉冲形成电路方法,解决了高功率磁控溅射在重复频率工作下有时不能成功溅射粒子、电离时刻不一致、溅射起弧打火靶面中毒、溅射效率低等问题,降低了磁控溅射装置内气体的工作气压,实现低气压溅射镀膜,提高了靶材的溅射效率,减小薄膜表面粗糙度。通过大量实验论证,该电源达到了理想的溅射效果,满足了指标要求。
Power source of magnetron sputtering coating is one of the key equipment in magnetron sputtering system.A power supply of magnetron sputtering with adjustable output voltage of 0-800 V,pulse width of 5-200μs,frequency of 0-60 Hz and maximum pulse current of 150 Ais developed according to the technical parameters of the sputtering treatment equipment for niobium and tin targets.The experimental results of the prepared power supply with the niobium target load and tin target load are given respectively.To solve the problems of unsuccessful sputtering of particles,inconsistent ionization time,poisoning of target surface and low sputtering efficiency in high power magnetron sputtering under repetitive frequency operation,a high power bipolar pulse forming circuit integrated with high voltage short pulse preionization is adopted.The gas pressure can realize sputtering coating with low pressure.This design has improved the sputtering efficiency of the target and reduced the surface roughness of the film.The results of experiments show that the prepared power supply achieves the ideal sputtering effect and meets the requirements of the index.
Power source of magnetron sputtering coating is one of the key equipment in magnetron sputtering system.A power supply of magnetron sputtering with adjustable output voltage of 0-800 V,pulse width of 5-200μs,frequency of 0-60 Hz and maximum pulse current of 150 Ais developed according to the technical parameters of the sputtering treatment equipment for niobium and tin targets.The experimental results of the prepared power supply with the niobium target load and tin target load are given respectively.To solve the problems of unsuccessful sputtering of particles,inconsistent ionization time,poisoning of target surface and low sputtering efficiency in high power magnetron sputtering under repetitive frequency operation,a high power bipolar pulse forming circuit integrated with high voltage short pulse preionization is adopted.The gas pressure can realize sputtering coating with low pressure.This design has improved the sputtering efficiency of the target and reduced the surface roughness of the film.The results of experiments show that the prepared power supply achieves the ideal sputtering effect and meets the requirements of the index.
引文
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[11]戴茂飞.脉冲调制射频磁控溅射电源的研制[D].武汉:中南民族大学,2012.(Dai Maofei.The research on pulse modulation RF power supply for magnetron sputtering.Wuhan:South-central University for Nationalities,2012)
[12]李波,李博婷,黄斌,等.高可靠性脉冲氙灯电源设计[J].强激光与粒子束,2017,29(6):065004.(Li Bo,Li Boting,Huang Bin,et al.Design of high reliability pulse xenon lamp power supply.High Power Laser and Particle Beams,2017,29(6):065004)
[13]赵娟,曹科峰,曹宁翔,等.脉冲氙灯放电闪光仪[J].仪器仪表学报,2009,28(6):52-53,58.(Zhao Juan,Cao Kefeng,Cao Ningxiang,et al.A strobo of pulse xenon lamp discharge.Chinese Journal of Scientific Instrument,2009,28(6):52-53,58)
[14]李波,李博婷,叶超,等.双极性脉冲磁控溅射电源设计[J].强激光与粒子束,2018,30:045004.(Li Bo,Li Boting,Ye Chao,et al.Design of bipolar pulsed magnetron sputtering power supply.High Power Laser and Particle Beams,2018,30:045004)
[2]Kubinski I J A,Hurkmans T,Trinh T,et al.Perspective for replacement of hard chromium by PVD[J].Plat Surf Finish,1999,86:20-25.
[3]Konyashin I Y.PVD/CVD technology for coating cemented carbides[J].Surface and Coatings Technology,1995,71:277-283.
[4]Zhao Guojun,Lin Bin,Jiang Bailing,et al.Microstructure and mechanical properties of multilayer Ti(C,N)films by closed-field unbalanced magnetron sputtering ion plating[J].Journal of Materials Science &Technology,2010,26(2):119-124)
[5]张继成,吴卫东,许华,等.磁控溅射技术新进展及应用[J].材料导报,2004,18(4):56-59.(Zhang Jicheng,Wu Weidong,Xu Hua,et al.The recent developments and applications of magnetron sputtering.Material Review,2004,18(4):56-59)
[6]田民波.薄膜科学与技术手册[M].北京:机械工业出版社,1991,2-5.(Tian Minbo.Handbook of membrane science and technology.Beijing:China Machine Press,1991:2-5)
[7]Munz W D.Properties of niobium-based wear and corrosion resistant hard PVD coating deposition on various steels[J].Metal Ital,2002,94(11):25-27.
[8]田修波,吴忠振,石经纬,等.高脉冲功率密度复合磁控溅射电源研制及放电特性研究[J].真空,2010,47(3):44-47.(Tian Xiubo,Wu Zhongzhen,Shi Jingwei,et al.Development and discharge behavior of high power density pulse magnetron sputtering system.Vacuum,2010,47(3):44-47)
[9]Helmerssonl J,Lattemann M,Bohlmark J,et al.Ionized physical vapor deposition(IPVD):A review of technology and applications[J].Thin Solids Films,2006,513(1/2):1-24.
[10]Boo J M,Jung M J,Park H K.High-rate deposition of copper thin films using newly designed high-power magnetron sputtering source[J].Surface and Coatings Technology,2004,721-727.
[11]戴茂飞.脉冲调制射频磁控溅射电源的研制[D].武汉:中南民族大学,2012.(Dai Maofei.The research on pulse modulation RF power supply for magnetron sputtering.Wuhan:South-central University for Nationalities,2012)
[12]李波,李博婷,黄斌,等.高可靠性脉冲氙灯电源设计[J].强激光与粒子束,2017,29(6):065004.(Li Bo,Li Boting,Huang Bin,et al.Design of high reliability pulse xenon lamp power supply.High Power Laser and Particle Beams,2017,29(6):065004)
[13]赵娟,曹科峰,曹宁翔,等.脉冲氙灯放电闪光仪[J].仪器仪表学报,2009,28(6):52-53,58.(Zhao Juan,Cao Kefeng,Cao Ningxiang,et al.A strobo of pulse xenon lamp discharge.Chinese Journal of Scientific Instrument,2009,28(6):52-53,58)
[14]李波,李博婷,叶超,等.双极性脉冲磁控溅射电源设计[J].强激光与粒子束,2018,30:045004.(Li Bo,Li Boting,Ye Chao,et al.Design of bipolar pulsed magnetron sputtering power supply.High Power Laser and Particle Beams,2018,30:045004)