先进电子器件封装中键合引线的电磁特性

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英文篇名：Electromagnetic Characteristics of Bonding Wires in Advanced Electronic Devices Packaging 作者：左盼盼 ; 王蒙军 ; 郑宏兴 ; 李尔平 英文作者：Zuo Panpan;Wang Mengjun;Zheng Hongxing;Li Erping;School of Electronic and Information Engineering, Hebei University of Technology;Tianjin Key Laboratory of Electronic Materials and Devices;Key Laboratory of Advanced Micro/Nano Electronic Devices & Smart Systems and Applications,Zhejiang University; 关键词：键合引线 ; 全波仿真 ; 回波损耗 ; 电磁干扰 ; 堆叠结构 英文关键词：bonding wire;;full-wave simulation;;return loss;;electromagnetic interference;;stacked structure 中文刊名：BDTJ 英文刊名：Semiconductor Technology 机构：河北工业大学电子信息工程学院;天津市电子材料与器件重点实验室;浙江大学先进微纳电子器件智能系统及应用重点实验室; 出版日期：2019-05-03 出版单位：半导体技术 年：2019 期：v.44;No.369 基金：国家自然科学基金资助项目(61371031,61371043,61571395,61671200);; 河北省自然科学基金重点项目(F2017202283) 语种：中文; 页：BDTJ201905013 页数：5 CN：05 ISSN：13-1109/TN 分类号：78-82

摘要

通过仿真键合引线不同拱高、直径和数量对回波损耗的影响,探究了高频下先进封装结构中典型键合引线的电磁特性,以指导其优化设计。结合其电磁全波仿真模型建模,提出了改进的"T"型等效电路并解释了相关现象和结论。仿真结果表明,相比直径为25μm的键合引线,75μm的同类引线在6.8 GHz处可将回波损耗改善近10 dB;拱高为0.15 mm的键合引线比0.35 mm的键合引线在7.4 GHz处可将回波损耗改善约12.3 dB;采用三根线并联的连接方式相比单根的成本较高,但在全频段回波损耗均可得到改善。最后研究了芯片堆叠结构中键合引线不同连接方式的电磁特性,结果表明,转接式相比直连式具有更好的传输特性和较低的电磁干扰。
        By simulating the effects of various arch rise, diameters and quantities of bonding wires on return loss, the electromagnetic properties of typical bonding wires in advanced package structures at high frequency were explored to guide the optimization design. Combined with its electromagnetic full-wave simulation model, an improved "T"-shaped equivalent circuit was proposed to explain the related phenomena and conclusions. The simulation results show that compared with the bonding wire with a diameter of 25 μm, the similar wire with a diameter of 75 μm can improve the return loss by nearly 10 dB at 6.8 GHz. Bonding wires with an arch rise of 0.15 mm can improve the return loss by 12.3 dB at 7.4 GHz compared with the bonding wire with an arch rise of 0.35 mm. The connection with three bon-ding wires in parallel is more expensive than a single bonding wire, but the return loss can be improved within the whole frequency range. Finally, the electromagnetic characteristics of different connection modes of bonding wires in die stacked structures were studied. The results show that the transfer type has better transmission characteristics and lower electromagnetic interference than the direct connection type.

引文

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