一种基于热分析的FPGA时序分析方法
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摘要
FPGA的实际工作温度是决定FPGA时序分析可靠性的决定因素。为了克服FPGA结温难以获取的问题,充分保证FPGA时序分析的可靠性,文章提出了一种基于热分析的FPGA时序分析方法。该方法通过对整机设备内热环境分析和建模来获取FPGA的实际工作温度,在此基础上进行FPGA时序分析和温度余量分析,准确获取FPGA时序信息。该方法包含热分析和建模、FPGA时序温度参数获取、FPGA时序分析、温度余量调整等4个过程。文章还结合具体应用,对该方法进行了过程说明和应用结果分析。通过该文提出的基于热分析的FPGA时序分析方法,可以准确计算获取FPGA器件的实际结温,并在此基础上开展时序分析,从而有效保证了FPGA时序分析的准确性和可靠性。
The actual working temperature of FPGA is the decisive factor to determine the reliability of the FPGA timing analysis. In order to overcome the difficulty of obtaining the junction temperature of FPGA and fully assure the reliability of FPGA timing analysis,one method of FPGA timing analysis based on thermal analysis is proposed. The method acquires FPGA working temperature by thermal environment analysis and modeling for the whole equipment. On this basis,FPGA timing and temperature allowance analysis can be executed for the accurate FPGA timing results. There are four phases in the workflow of the method: thermal analysis and modeling,temperature parameters of FPGA timing acquiring,FPGA timing analysis and temperature allowance adjustments. In combination with the specific application,the paper also illustrates process and results analysis for the application. Using the method for FPGA timing analysis based on thermal analysis which presented by the paper,FPGA timing analysis can be carried on which is based on the accurate acquiring for FPGA working temperature and the accuracy and reliability of FPGA timing analysis can be effectively assured.
The actual working temperature of FPGA is the decisive factor to determine the reliability of the FPGA timing analysis. In order to overcome the difficulty of obtaining the junction temperature of FPGA and fully assure the reliability of FPGA timing analysis,one method of FPGA timing analysis based on thermal analysis is proposed. The method acquires FPGA working temperature by thermal environment analysis and modeling for the whole equipment. On this basis,FPGA timing and temperature allowance analysis can be executed for the accurate FPGA timing results. There are four phases in the workflow of the method: thermal analysis and modeling,temperature parameters of FPGA timing acquiring,FPGA timing analysis and temperature allowance adjustments. In combination with the specific application,the paper also illustrates process and results analysis for the application. Using the method for FPGA timing analysis based on thermal analysis which presented by the paper,FPGA timing analysis can be carried on which is based on the accurate acquiring for FPGA working temperature and the accuracy and reliability of FPGA timing analysis can be effectively assured.
引文
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[9]陈锐,门永平,杨文强,等.基于UVM的FPGA软硬件联合仿真验证技术研究[J].空间电子技术,2017,14(1):38-42.
[2]宋芳芳,何小琦,恩云飞.电子元器件热设计及分析方法研究[C].中国电子学会第十七届电子元件学术年会,2014.
[3]王毅.纳米尺度集成电路统计时序分析与成品率优化算法研究[D].上海:复旦大学,2008:17-18.
[4]龙旱.功率器件热设计及散热器优化设计技术研究[D].北京:北京航空航天大学,2003.
[5]GJB/Z 27-1992,电子设备可靠性热设计手册[S].1992.
[6]宋芳芳,何小琦,恩云飞.电子元器件热设计及分析方法研究.
[7]许天一,FPGA静态时序分析的研究与实现[D].哈尔滨:哈尔滨工业大学,2014:14.
[8]Maxfield C.The design warriors guide to FPGAs[M].Burlington:Newnes,2004.206-208.
[9]陈锐,门永平,杨文强,等.基于UVM的FPGA软硬件联合仿真验证技术研究[J].空间电子技术,2017,14(1):38-42.
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