基于虚拟样机技术LED键合机传送机构的设计与研究
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摘要
LED键合机是LED生产过程封装工序的重要设备之一,其作用是快速精确地从晶圆膜上拾取晶片并放置到引线框架杯中。目前先进的LED键合机基本上被国外大公司所垄断,这成为了我国半导体封装行业发展的一个瓶颈。因此,必须大力开展微电子制造与封装技术的研究和实用设备的研发,掌握核心技术,研发具有自主知识产权的产品。本课题来源于2005年广东省关键领域重点突破项目电子元器件专用设备关键技术一全自动半导体芯片键合机(TC058372-1)。
传送机构是LED键合机的核心工作机构之一,本文创新地设计了一种稳固、高效的传送机构,并通过对比分析研究对LED键合机传送机构的机械结构部分进行了详细的设计。本机构通过伺服电机的正转和反转带动精密的滚珠丝杆旋转,使丝杆螺母作往复直线运动从而带动夹持式勾爪完成X方向的进给动作;同时通过气缸驱动连杆机构驱动夹持式勾爪的“夹紧”和“松开”的动作。引线框架在被夹持式勾爪夹持稳定之后才开始前进,在到达工作位置稳定停下之后才被勾爪松开。这样,引线框架在整个进给过程中就不会发生Y方向的振动和X方向的惯性前冲。
使用三维CAD软件Pro/ENGINEER对LED键合机传送机构的零部件进行了三维实体建模,并将分散的零部件进行了虚拟装配,得到了整机的实体装配图。然后通过接口模块Mechanism/Pro把整个传送机构的装配模型导入到虚拟样机软件ADAMS中。在ADAMS中对装配模型施加各种约束和运动驱动,从而创建出一台有意义的虚拟样机。最后针对LED键合机传送机构各零部件工作的不同情况,对虚拟样机进行了运动学仿真分析,得出了部分关键零部件的运动数据曲线图,为产品的设计改进提供了依据。
本文以虚拟样机技术为主线,最终为高速高精度机械产品的结构设计提供了一套有效的理论方法,并试制出三台代号为DBS-0608的物理样机。
LED Die Bonder is one of the important equipment in encapsulation working procedure of LED manufacturing process, whose function is placing the chips on the leadframe from the wafer quickly and accurately. At present, the advanced LED Die Bonder is monopolized by the big foreign companies basically, which become a bottleneck of China semiconductor encapsulation industry development.So we have to develop the micro-electronics and encapsulation technology research and applied equipment R&D, master the core technology, R&D the product which is provided with independent knowledge property right. This thesis comes from 2005 Guangdong key domain project electronic element special equipment's key technologies-automatic semiconductor chip Die Bonder (TC05B372-1).
Feeder Mechanism is one of the most important mechanism in LED Die Bonder. This dissertation innovatively designed a steady and efficient feeder mechanism, and detailedly designed the structure of LED Die Bonder Feeder Mechanism through contrast and analysis. The mechanism used the positive and negative rotation of the servo motor to drive the ball bearing screw, which then makes the screw nut move reciprocating and makes the holding indexers done the feed motion in X direction; in the same time, it drives the holding indexers to "hold" and "loosen" the leadframe through the Air-Cylinder Mechanism. The leadframe start to go forward after it is held by the indexers steady, and it is loosened by indexers after it reach the working position and stop stably. Thus, the leadframe wouldn't show the vibration in Y direction and inertia in X direction in the whole feeding process.
This dissertation used 3D CAD software—Pro/ENGINEER to modeling the parts of the LED Die Bonder Feeder Mechanism, and virtual assembled the separated parts to generate the solid assembly model. Then we imported the assembly model of the whole feeder mechanism into the virtual prototyping software—ADAMS using the interface module—Mechanism/Pro. We added the constraints and motions on the assembly model in ADAMS to set up a significant virtual prototyping. In the end we carried through the simulation analysis of the virtual prototyping according to the different working situation of the parts in LED Die Bonder Feeder Mechanism, and generated the simulation graphs of the key parts. The simulation graphs provided the reasons for the product design improvement.
This dissertation took virtual prototyping technology as a tool, provided a set of effective theoretic method for the structure design of High speed and High precision Mechanical Product. Finally we trial-produced three sets of physical prototyping whose name is DBS-0608.
传送机构是LED键合机的核心工作机构之一,本文创新地设计了一种稳固、高效的传送机构,并通过对比分析研究对LED键合机传送机构的机械结构部分进行了详细的设计。本机构通过伺服电机的正转和反转带动精密的滚珠丝杆旋转,使丝杆螺母作往复直线运动从而带动夹持式勾爪完成X方向的进给动作;同时通过气缸驱动连杆机构驱动夹持式勾爪的“夹紧”和“松开”的动作。引线框架在被夹持式勾爪夹持稳定之后才开始前进,在到达工作位置稳定停下之后才被勾爪松开。这样,引线框架在整个进给过程中就不会发生Y方向的振动和X方向的惯性前冲。
使用三维CAD软件Pro/ENGINEER对LED键合机传送机构的零部件进行了三维实体建模,并将分散的零部件进行了虚拟装配,得到了整机的实体装配图。然后通过接口模块Mechanism/Pro把整个传送机构的装配模型导入到虚拟样机软件ADAMS中。在ADAMS中对装配模型施加各种约束和运动驱动,从而创建出一台有意义的虚拟样机。最后针对LED键合机传送机构各零部件工作的不同情况,对虚拟样机进行了运动学仿真分析,得出了部分关键零部件的运动数据曲线图,为产品的设计改进提供了依据。
本文以虚拟样机技术为主线,最终为高速高精度机械产品的结构设计提供了一套有效的理论方法,并试制出三台代号为DBS-0608的物理样机。
LED Die Bonder is one of the important equipment in encapsulation working procedure of LED manufacturing process, whose function is placing the chips on the leadframe from the wafer quickly and accurately. At present, the advanced LED Die Bonder is monopolized by the big foreign companies basically, which become a bottleneck of China semiconductor encapsulation industry development.So we have to develop the micro-electronics and encapsulation technology research and applied equipment R&D, master the core technology, R&D the product which is provided with independent knowledge property right. This thesis comes from 2005 Guangdong key domain project electronic element special equipment's key technologies-automatic semiconductor chip Die Bonder (TC05B372-1).
Feeder Mechanism is one of the most important mechanism in LED Die Bonder. This dissertation innovatively designed a steady and efficient feeder mechanism, and detailedly designed the structure of LED Die Bonder Feeder Mechanism through contrast and analysis. The mechanism used the positive and negative rotation of the servo motor to drive the ball bearing screw, which then makes the screw nut move reciprocating and makes the holding indexers done the feed motion in X direction; in the same time, it drives the holding indexers to "hold" and "loosen" the leadframe through the Air-Cylinder Mechanism. The leadframe start to go forward after it is held by the indexers steady, and it is loosened by indexers after it reach the working position and stop stably. Thus, the leadframe wouldn't show the vibration in Y direction and inertia in X direction in the whole feeding process.
This dissertation used 3D CAD software—Pro/ENGINEER to modeling the parts of the LED Die Bonder Feeder Mechanism, and virtual assembled the separated parts to generate the solid assembly model. Then we imported the assembly model of the whole feeder mechanism into the virtual prototyping software—ADAMS using the interface module—Mechanism/Pro. We added the constraints and motions on the assembly model in ADAMS to set up a significant virtual prototyping. In the end we carried through the simulation analysis of the virtual prototyping according to the different working situation of the parts in LED Die Bonder Feeder Mechanism, and generated the simulation graphs of the key parts. The simulation graphs provided the reasons for the product design improvement.
This dissertation took virtual prototyping technology as a tool, provided a set of effective theoretic method for the structure design of High speed and High precision Mechanical Product. Finally we trial-produced three sets of physical prototyping whose name is DBS-0608.
引文
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[2]徐建华.LED生产过程中的质量控制.电子工艺技术,2003,24(4):172-174.
[3]王石刚,梁庆华.先进封装工艺设备及关键技术.集成电路应用,2003.
[4]刘德明.LED产业大发展需要国产设备的配合.中国电子报,2004.
[5]SEMI.World Semiconductor Equipment Markets[J].Solid State Technology,2003,43(10):22.
[6]王垚浩.LED封装必需重视设备和工艺研究.中国电子报,2005.
[7]胡宝平.发展国产设备正当时.中国电子报,2005.
[8]诸玲珍.国产设备如何立足半导体市场.中国电子报,2005.
[9]Tanabe,H.,Shibata,I.,Nihei,K.,Miyaki,K..High-Accuracy Die-Bonding Technology for LED Array.IEEE Transactions on Components,Hybrids,and Manufacturing Technology,1985,8(4):500-504.
[10]Chylak,B.Packaging challenges and solutions for multi-stack die applications.Semiconductor Technology,v 28,n 6,2003,p11-20.
[11]Michael S.W.T.,Norbert C.C.,A High Speed,High Precision Linear Drive System for Manufacturing Automation,IEEE,2001:440-444.
[12]Zhang W.J.,Li Q.,Guo L.S.,Integrated Design of Mechanical Structure and Control Algorithm for a Programmable Four-Bar Linkage,IEEE/ASME Trans.On Mectatronics,1999,4(4):354-362.
[13]http://www.eguilin.org/doctor/ljxx/product/boda_pmduct_05.htm.
[14]崔荣章,滑道分钵轮式栽植器的理论与试验研究,山东理工大学硕士学位论,2003.5,p40
[15]郑建荣.ADAMS虚拟样机技术入门与提高.北京:机械工业出版社,2001.11
[16]宋大虎.积极发展适合我国国情的虚拟制造技术.中国机械工程,1998.11
[17]黄洪钟,丁国富等.基于虚拟现实技术的原型设计机理研究.机械工程学报,1999.5
[18]王刚,杨莺,刘少军.虚拟样机技术在工程机械领域的应用工程机械,2003,34(8):11-14
[19]李瑞涛,方泥,张文明.虚拟样机技术的概念及应用.机电一体化,2000.5
[20]C.Sekimoto,Mashisa Yano.Development of Conceptual Design CAD System Proceedings of International ADAMS Users' Conference,1998
[21]Haug E J.Computer Aided Kinematics and Dynamics of Mechanical Systems.Vol.1 Basic Methods.Needham Heights;Allyn and Bacon,1989.199-237.
[22]袁士杰,吕哲勤.多刚体系统动力学.北京:北京理工大学出版社,1992
[23]贾书惠.刚体动力学.北京:高等教育出版社,1987
[24]休斯顿,刘又午.多体系统动力学(上册).大津:大津大学出版社,1988
[25]金启华,郑建荣.虚拟样机及其在特种设备安全保障领域中的应用.上海劳动保护,2001.12
[26]陈长生.基于UG参数化技术完成实体零件库的建立机械设计与制造,2003.4
[27]万久团,黄翔.基于UG的三维参数化标准件库的建立.机械制造与自动化,2002.6
[28]王明强,王宁生等.UG二次开发中建库接口技术研究.现代制造工程,2004.1
[29]莫蓉,周惠群.Ugigraphics18版CAD应用基础,北京:清华大学出版fl:,2002.
[30]李浩,谢庆生.基于特征的参数化造型的思想.贵州工业大学学报,1999,28(6):5-9
[31]洪如瑾.UG CAD快速入门指导.北京:清华大学出版社,2002
[32]沈梅,何小朝等.基于装配特征的装配建模.中国机械工程,2001,12
[33]杨馄,刘继红.面向虚拟装配的装配建模技术.机械科学与技术,2001
[34]王国强,张进平,马若丁.虚拟样机技术及其在ADAMS上的实践.西北业大学出版社,2002.3
[35]Mechanical Dynamics Inc.ADAMS/Solver Documentation,2000
[36]Mechanical Dynamics Inc.ADAMS/View Documentation,2000
[37]马玉坤等.ADAMS软件及其在汽车动力学仿真分析中的应用.重庆交通学院学报,2004.
[38]Daniel A.Steigerwald,Jerome C.Bhat,Dave Collins et al.Illumination with Solid State Lighting Technology.IEEE Journal on Selected Topics in Quantum Electronics,2002,8(2):310-320.
[39]郭强生.LED粘片机芯片拾取机构运动控制技术研究.电子工业专业设备,2005,6:27-32.
[40]谢恩桓.新世纪IC封装的回顾和发展趋势展望.电子与封装,2003,4(3)
[41]雷源忠,雏建斌,丁汉等.先进电子制造中的重要科学问题.中国科学基金,2002,16(4):204-209
[42]丁汉,朱利民,林忠钦.面向芯片封装的高加速度运动系统的精确定位和操作.自然科学进展,2003,13(6):568-574
[43]李克天,陈新等.粘片机斜面四连杆焊头运动机构设计.机械科学与技术,2005,24(s):570-571,608
[44]Aler D M et al.Control of linear motors for machine tool feed drives:design and implementation of H optimal feedback control.Trans of ASME,Journal of Dynamic Systems,Measurement and Control.1996,118(2):649
[45]申永胜.机械原理教程(第二版).北京:清华大学出版社,2005
[46]袁剑锋.粘片机温控系统的设计与实验研究.广东工业大学硕士论文,2004
[47]张绍裘,王晓初,陈新.芯片焊接机焊头部件的设计.机械与电子.2003.3.p:3-4
[48]李克天,陈新等.粘片机引线框架的空间凸轮供送机构设计.中国机械工程.2005.1.p:54-5
[49]彭卫东.IC芯片粘片机并联焊头机构的运动学分析[J].机械设计,2005,(12):19-20.
[50]AD-809A-03型LED粘片机使用手册[M].香港:ASM公司.2004.
[51]高秀华,李炎亮,邓洪超等.机械三维动态设计仿真技术.化学工业出版社,2003.230-250
[52]李增刚.ADAMS入门详解与实例.国防工业出版社,2006.1-276
[53]范成建,熊光明,周明飞.虚拟样机软件MSC.ADAMS应用与提高.机械工业出版社,2006.1-307
[54]王国强,张进平,马若丁.虚拟样机技术及其在ADAMS上的实践.西北工业大学出版社,2002.1-170
[55]Medding,J.Thin die bonding techniques,IEEE/CPMT/SEM129~(th)Inter national Electronics Manufacturing Technology Symposium,2004,p 68-73.
[2]徐建华.LED生产过程中的质量控制.电子工艺技术,2003,24(4):172-174.
[3]王石刚,梁庆华.先进封装工艺设备及关键技术.集成电路应用,2003.
[4]刘德明.LED产业大发展需要国产设备的配合.中国电子报,2004.
[5]SEMI.World Semiconductor Equipment Markets[J].Solid State Technology,2003,43(10):22.
[6]王垚浩.LED封装必需重视设备和工艺研究.中国电子报,2005.
[7]胡宝平.发展国产设备正当时.中国电子报,2005.
[8]诸玲珍.国产设备如何立足半导体市场.中国电子报,2005.
[9]Tanabe,H.,Shibata,I.,Nihei,K.,Miyaki,K..High-Accuracy Die-Bonding Technology for LED Array.IEEE Transactions on Components,Hybrids,and Manufacturing Technology,1985,8(4):500-504.
[10]Chylak,B.Packaging challenges and solutions for multi-stack die applications.Semiconductor Technology,v 28,n 6,2003,p11-20.
[11]Michael S.W.T.,Norbert C.C.,A High Speed,High Precision Linear Drive System for Manufacturing Automation,IEEE,2001:440-444.
[12]Zhang W.J.,Li Q.,Guo L.S.,Integrated Design of Mechanical Structure and Control Algorithm for a Programmable Four-Bar Linkage,IEEE/ASME Trans.On Mectatronics,1999,4(4):354-362.
[13]http://www.eguilin.org/doctor/ljxx/product/boda_pmduct_05.htm.
[14]崔荣章,滑道分钵轮式栽植器的理论与试验研究,山东理工大学硕士学位论,2003.5,p40
[15]郑建荣.ADAMS虚拟样机技术入门与提高.北京:机械工业出版社,2001.11
[16]宋大虎.积极发展适合我国国情的虚拟制造技术.中国机械工程,1998.11
[17]黄洪钟,丁国富等.基于虚拟现实技术的原型设计机理研究.机械工程学报,1999.5
[18]王刚,杨莺,刘少军.虚拟样机技术在工程机械领域的应用工程机械,2003,34(8):11-14
[19]李瑞涛,方泥,张文明.虚拟样机技术的概念及应用.机电一体化,2000.5
[20]C.Sekimoto,Mashisa Yano.Development of Conceptual Design CAD System Proceedings of International ADAMS Users' Conference,1998
[21]Haug E J.Computer Aided Kinematics and Dynamics of Mechanical Systems.Vol.1 Basic Methods.Needham Heights;Allyn and Bacon,1989.199-237.
[22]袁士杰,吕哲勤.多刚体系统动力学.北京:北京理工大学出版社,1992
[23]贾书惠.刚体动力学.北京:高等教育出版社,1987
[24]休斯顿,刘又午.多体系统动力学(上册).大津:大津大学出版社,1988
[25]金启华,郑建荣.虚拟样机及其在特种设备安全保障领域中的应用.上海劳动保护,2001.12
[26]陈长生.基于UG参数化技术完成实体零件库的建立机械设计与制造,2003.4
[27]万久团,黄翔.基于UG的三维参数化标准件库的建立.机械制造与自动化,2002.6
[28]王明强,王宁生等.UG二次开发中建库接口技术研究.现代制造工程,2004.1
[29]莫蓉,周惠群.Ugigraphics18版CAD应用基础,北京:清华大学出版fl:,2002.
[30]李浩,谢庆生.基于特征的参数化造型的思想.贵州工业大学学报,1999,28(6):5-9
[31]洪如瑾.UG CAD快速入门指导.北京:清华大学出版社,2002
[32]沈梅,何小朝等.基于装配特征的装配建模.中国机械工程,2001,12
[33]杨馄,刘继红.面向虚拟装配的装配建模技术.机械科学与技术,2001
[34]王国强,张进平,马若丁.虚拟样机技术及其在ADAMS上的实践.西北业大学出版社,2002.3
[35]Mechanical Dynamics Inc.ADAMS/Solver Documentation,2000
[36]Mechanical Dynamics Inc.ADAMS/View Documentation,2000
[37]马玉坤等.ADAMS软件及其在汽车动力学仿真分析中的应用.重庆交通学院学报,2004.
[38]Daniel A.Steigerwald,Jerome C.Bhat,Dave Collins et al.Illumination with Solid State Lighting Technology.IEEE Journal on Selected Topics in Quantum Electronics,2002,8(2):310-320.
[39]郭强生.LED粘片机芯片拾取机构运动控制技术研究.电子工业专业设备,2005,6:27-32.
[40]谢恩桓.新世纪IC封装的回顾和发展趋势展望.电子与封装,2003,4(3)
[41]雷源忠,雏建斌,丁汉等.先进电子制造中的重要科学问题.中国科学基金,2002,16(4):204-209
[42]丁汉,朱利民,林忠钦.面向芯片封装的高加速度运动系统的精确定位和操作.自然科学进展,2003,13(6):568-574
[43]李克天,陈新等.粘片机斜面四连杆焊头运动机构设计.机械科学与技术,2005,24(s):570-571,608
[44]Aler D M et al.Control of linear motors for machine tool feed drives:design and implementation of H optimal feedback control.Trans of ASME,Journal of Dynamic Systems,Measurement and Control.1996,118(2):649
[45]申永胜.机械原理教程(第二版).北京:清华大学出版社,2005
[46]袁剑锋.粘片机温控系统的设计与实验研究.广东工业大学硕士论文,2004
[47]张绍裘,王晓初,陈新.芯片焊接机焊头部件的设计.机械与电子.2003.3.p:3-4
[48]李克天,陈新等.粘片机引线框架的空间凸轮供送机构设计.中国机械工程.2005.1.p:54-5
[49]彭卫东.IC芯片粘片机并联焊头机构的运动学分析[J].机械设计,2005,(12):19-20.
[50]AD-809A-03型LED粘片机使用手册[M].香港:ASM公司.2004.
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