阵列波导器件耦合封装机理及其关键技术研究
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摘要
阵列波导器件是下一代光纤通信技术发展的基础支撑,具有广阔应用前景。它采用半导体制造工艺制作波导芯片,将常规分立光学元件的各种功能集成到同一光学衬底表面,完成常规由多个分立光学元件所构成的庞大光学系统的光信息处理能力,实现光信号分配、开关、滤波等功能,具有结构紧凑、抗干扰、性能一致性好、便于自动化批量生产等突出优势,是目前光电子器件发展的前沿。阵列波导器件的种类、结构形式十分丰富,随着光纤通信对器件质量要求的迅速提高,目前普遍使用的制造技术、装备和工艺都难以适应,迫切需求更深层次的认识阵列波导器件封装制造过程中的机理性、规律性科学问题,以期在制造技术上取得突破。
本文以下一代阵列波导器件封装制造过程中的对准耦合与固接为核心展开研究,通过理论分析、试验测试以及有限元仿真等方法,对阵列波导器件对准耦合、耦合界面光波传输与畸变规律、自动化对准工艺与算法、固接强度生成与微位移控制、装备集成进行了研究,建立了光波传输原理与器件结构参数、制造精度与工艺参数的融合模型并找到了其中的量值规律,实现了阵列波导器件自动化封装装备集成,从而提升我国阵列波导器件自动化封装制造水平。论文的主要研究内容及研究结果如下：
(1)针对阵列波导器件对准耦合及耦合界面光波传输特性,以平面光波导分路器为例,基于波导光学建立波导芯片与光纤对准耦合模型,分析讨论模场空间分布对耦合损耗的影响规律,并进行试验验证。基于Fresnel反射原理,建立波导芯片与阵列光纤固接界面光波传输模型,分析讨论光波在固接界面上的传输行为,并进行试验验证。
(2)提出了阵列波导器件对准耦合优化工艺；针对爬山法因采样点较多且对准时间较长的缺点,综合考虑阵列波导芯片和光纤的模场空间分布、对准耦合平台的运动特性以及对准误差与耦合损耗的关系,提出基于多项式拟合的阵列波导器件自动精密对准耦合算法,对准速度、精度以及可靠性均大大提高；针对多通道对准,提出基于虚拟旋转轴法与多项式拟合的复合对准算法,对准速度快、精度高；最后分析讨论光功率通道均衡原理和方法,并进行试验验证。
(3)针对阵列波导器件固接微位移生成与控制技术,基于表面物理化学理论,分析讨论固化胶液在阵列波导器件耦合界面的润湿规律；基于有限元法分析讨论阵列波导器件固接界面残余应力与微位移生成机制；针对微位移,分析讨论胶液固化收缩与热作用生成微位移机制,及其对器件光学性能的影响规律；建立固结强度与刚度分布的理论模型与设计方法,提出胶液固化等技术的固结强度与刚度调控方法。
(4)针对阵列波导器件自动化封装装备集成,基于多体系统动力学理论,构建对准耦合平台的精度传递模型,对敏感误差源、误差补偿的基本原理以及误差补偿量计算方法进行分析与讨论。根据波导芯片与阵列光纤自动化对准要求,构建波导芯片与阵列光纤相对位置检测与调整的机器视觉系统,提出图像预处理和分级快速Hough变换的直线检测技术。构建点胶与紫外光固化系统。综合上述各单元技术,实现了阵列波导器件自动化封装装备的集成,并开发了自动化的封装工艺软件。
(5)综合利用前面的研究成果,以1×8、1×16和1×32的平面光波导分路器为例,进行了批量封装试验,并对器件性能进行了测试,结果表明,可实现单点耦合光功率损耗<0.1dB,波长相关损耗<0.2dB,均匀性<0.2dB,偏振相关损耗<0.15dB,温度相关损耗<0.22dB,表明基于本课题开发的阵列波导器件自动化封装装备与工艺制造的阵列波导器件明显优于目前国内外商用器件的水平,体现本课题具有很好的技术优势和实际工程适应性。
Arrayed waveguide devices are the foundations of the next generation optical fiber communication technology development, which have bright and wide application prospects. These arrayed waveguide chips, similar in many ways to their electronic counterparts, are fabricated using wafer-level processing techniques and use optical waveguides to route photons, the same way that metal traces are used to route electrons in an electronic chip. These devices include optical beam splitters/combiners for branching/combining optical signals, optical switchers for changing optical paths, optical filtering for introducing multiple optical channels into a single optical fiber, and so on. These devices have many features, such as compact structure, strong noise immunity, excellent property, and easy automation production, which are the developing frontiers of optoelectronic devices at present. Arrayed waveguide devices are rich in theirs categories and structures. With the rapid increasing demands for the quality devices of optical fiber communication system, many problems about mechanisms and rules of manufacturing process for arrayed waveguide devices packaging must be investigated more profoundly, in order to make a breakthrough in the manufacturing technologies, processes and equipment of arrayed waveguide devices.
This dissertation focused on the aligning coupling and bonding of arrayed waveguide devices packaging. To address the problems about aligning coupling, the light-wave transmission and aberrance rules on the coupling interface, automatic aligning process and aligning algorithms, residual stress and micro displacement, and equipment integration are studied systematically by theoretical analysis, experimental study and finite element analysis, the syncretic models and numerical-value rules between light-wave transmission and structure parameters, aligning precision and technologic parameters of arrayed waveguide device are established. The automated packaging equipment for arrayed waveguide devices is realized. It can raise the level of the arrayed waveguide devices automation manufacturing. The main research contents and results are listed as follows:
(1) The aligning coupling and light-wave transmission on the coupling interface of arrayed waveguide device are researched. The aligning coupling model between waveguide chip and single mode fiber is established based on the waveguide optics theory. The influence rule of the mode field distribution and coupling loss has been analyzed and discussed; meanwhile the experimental verification has been adopted. Base on the Fresnel principle, the light-wave transmission model of waveguide chip and single mode fiber is established. The theoretical analyses of light-wave transmission behavior and test results are given.
(2) Aiming at the aligning coupling process, the5RS techniques for arrayed waveguide devices packaging are put forward, which are real6freedom controllability, real parallelism controllability, real seamless coupling, real gap controllability and real performance controllability. Aiming at the disadvantages of climbing algorithm, such as much more sampling points and time consuming are used in aligning. The mode field distribution of waveguide chip and single mode fiber, the motion characteristics and the relation between aligning error and optical power coupling loss are comprehensively considered. The aligning algorithm base on polynomial fitting is put forward. The experimental results verify the rapidness, precision and highly reliability of the proposed approach. The complex algorithm of virtual pivot, polynomial fitting is adopted to align multi-channels; the experimental results indicate that the complex algorithm can align rapidly and effectively. The principle and method of optical channel balance are discussed, and the experimental results are given.
(3) Aiming at the generation and controlling technology of arrayed waveguide devices micro-displacement, base on the surface physical chemistry theory, the wetting rule of curing adhesive in the alignment of arrayed waveguide devices is analyzed and discussed. Base on the finite element method, the micro-displacement mechanism and residual stress of arrayed waveguide devices in curing layer is analyzed and discussed. Aiming at micro-displacement, the mechanism by curing adhesive contraction and thermal effect is analyzed and discussed, and the impact towards optical performance. The theoretical model and designing method of consolidation of strength and stiffness distribution is established, and the method of consolidation of strength and stiffness is developed for the technology of curing adhesive.
(4) Aiming at the automated packaging equipment for arrayed waveguide devices, base on the theory of multi-body system dynamics, the accuracy transfer model of aligning and coupling is established. The basic principles of sensitive error source, error compensation and computation of the value of error compensation are analyzed and discussed. According to the automated alignment requirements of waveguide chip and fiber array, the machine visual system of measurement and adjustment of waveguide chip and fiber array is established, the linear measurement technology of image preprocessing and grading rapid Hough Transform is proposed, and the curing system of adhesive and UV is established. Summarization above the technologies of each unit mentioned, the arrayed waveguide devices automated packaging equipment is realized, and the automated packaging process software is developed.
(5) Comprehensive utilization of the research results mentioned above,1×8,1×16and1×32planar optical waveguide splitter are taken as examples, a lot of packaging experiments are taken, and the performance of device is measured. The results indicate that the optical power loss of single point lower than0.1dB, the wavelength dependent loss lower than0.2dB, the uniformity lower than0.2dB, the polarization dependent loss lower than0.15dB, and the temperature dependent loss lower than0.22dB, which indicates that the arrayed waveguide devices base on automated packaging equipment and processing mechanism of the subject are better than other commercial devices apparently, and reflects that the subject has many technical advantages and practical engineering adaptability.
本文以下一代阵列波导器件封装制造过程中的对准耦合与固接为核心展开研究,通过理论分析、试验测试以及有限元仿真等方法,对阵列波导器件对准耦合、耦合界面光波传输与畸变规律、自动化对准工艺与算法、固接强度生成与微位移控制、装备集成进行了研究,建立了光波传输原理与器件结构参数、制造精度与工艺参数的融合模型并找到了其中的量值规律,实现了阵列波导器件自动化封装装备集成,从而提升我国阵列波导器件自动化封装制造水平。论文的主要研究内容及研究结果如下：
(1)针对阵列波导器件对准耦合及耦合界面光波传输特性,以平面光波导分路器为例,基于波导光学建立波导芯片与光纤对准耦合模型,分析讨论模场空间分布对耦合损耗的影响规律,并进行试验验证。基于Fresnel反射原理,建立波导芯片与阵列光纤固接界面光波传输模型,分析讨论光波在固接界面上的传输行为,并进行试验验证。
(2)提出了阵列波导器件对准耦合优化工艺；针对爬山法因采样点较多且对准时间较长的缺点,综合考虑阵列波导芯片和光纤的模场空间分布、对准耦合平台的运动特性以及对准误差与耦合损耗的关系,提出基于多项式拟合的阵列波导器件自动精密对准耦合算法,对准速度、精度以及可靠性均大大提高；针对多通道对准,提出基于虚拟旋转轴法与多项式拟合的复合对准算法,对准速度快、精度高；最后分析讨论光功率通道均衡原理和方法,并进行试验验证。
(3)针对阵列波导器件固接微位移生成与控制技术,基于表面物理化学理论,分析讨论固化胶液在阵列波导器件耦合界面的润湿规律；基于有限元法分析讨论阵列波导器件固接界面残余应力与微位移生成机制；针对微位移,分析讨论胶液固化收缩与热作用生成微位移机制,及其对器件光学性能的影响规律；建立固结强度与刚度分布的理论模型与设计方法,提出胶液固化等技术的固结强度与刚度调控方法。
(4)针对阵列波导器件自动化封装装备集成,基于多体系统动力学理论,构建对准耦合平台的精度传递模型,对敏感误差源、误差补偿的基本原理以及误差补偿量计算方法进行分析与讨论。根据波导芯片与阵列光纤自动化对准要求,构建波导芯片与阵列光纤相对位置检测与调整的机器视觉系统,提出图像预处理和分级快速Hough变换的直线检测技术。构建点胶与紫外光固化系统。综合上述各单元技术,实现了阵列波导器件自动化封装装备的集成,并开发了自动化的封装工艺软件。
(5)综合利用前面的研究成果,以1×8、1×16和1×32的平面光波导分路器为例,进行了批量封装试验,并对器件性能进行了测试,结果表明,可实现单点耦合光功率损耗<0.1dB,波长相关损耗<0.2dB,均匀性<0.2dB,偏振相关损耗<0.15dB,温度相关损耗<0.22dB,表明基于本课题开发的阵列波导器件自动化封装装备与工艺制造的阵列波导器件明显优于目前国内外商用器件的水平,体现本课题具有很好的技术优势和实际工程适应性。
Arrayed waveguide devices are the foundations of the next generation optical fiber communication technology development, which have bright and wide application prospects. These arrayed waveguide chips, similar in many ways to their electronic counterparts, are fabricated using wafer-level processing techniques and use optical waveguides to route photons, the same way that metal traces are used to route electrons in an electronic chip. These devices include optical beam splitters/combiners for branching/combining optical signals, optical switchers for changing optical paths, optical filtering for introducing multiple optical channels into a single optical fiber, and so on. These devices have many features, such as compact structure, strong noise immunity, excellent property, and easy automation production, which are the developing frontiers of optoelectronic devices at present. Arrayed waveguide devices are rich in theirs categories and structures. With the rapid increasing demands for the quality devices of optical fiber communication system, many problems about mechanisms and rules of manufacturing process for arrayed waveguide devices packaging must be investigated more profoundly, in order to make a breakthrough in the manufacturing technologies, processes and equipment of arrayed waveguide devices.
This dissertation focused on the aligning coupling and bonding of arrayed waveguide devices packaging. To address the problems about aligning coupling, the light-wave transmission and aberrance rules on the coupling interface, automatic aligning process and aligning algorithms, residual stress and micro displacement, and equipment integration are studied systematically by theoretical analysis, experimental study and finite element analysis, the syncretic models and numerical-value rules between light-wave transmission and structure parameters, aligning precision and technologic parameters of arrayed waveguide device are established. The automated packaging equipment for arrayed waveguide devices is realized. It can raise the level of the arrayed waveguide devices automation manufacturing. The main research contents and results are listed as follows:
(1) The aligning coupling and light-wave transmission on the coupling interface of arrayed waveguide device are researched. The aligning coupling model between waveguide chip and single mode fiber is established based on the waveguide optics theory. The influence rule of the mode field distribution and coupling loss has been analyzed and discussed; meanwhile the experimental verification has been adopted. Base on the Fresnel principle, the light-wave transmission model of waveguide chip and single mode fiber is established. The theoretical analyses of light-wave transmission behavior and test results are given.
(2) Aiming at the aligning coupling process, the5RS techniques for arrayed waveguide devices packaging are put forward, which are real6freedom controllability, real parallelism controllability, real seamless coupling, real gap controllability and real performance controllability. Aiming at the disadvantages of climbing algorithm, such as much more sampling points and time consuming are used in aligning. The mode field distribution of waveguide chip and single mode fiber, the motion characteristics and the relation between aligning error and optical power coupling loss are comprehensively considered. The aligning algorithm base on polynomial fitting is put forward. The experimental results verify the rapidness, precision and highly reliability of the proposed approach. The complex algorithm of virtual pivot, polynomial fitting is adopted to align multi-channels; the experimental results indicate that the complex algorithm can align rapidly and effectively. The principle and method of optical channel balance are discussed, and the experimental results are given.
(3) Aiming at the generation and controlling technology of arrayed waveguide devices micro-displacement, base on the surface physical chemistry theory, the wetting rule of curing adhesive in the alignment of arrayed waveguide devices is analyzed and discussed. Base on the finite element method, the micro-displacement mechanism and residual stress of arrayed waveguide devices in curing layer is analyzed and discussed. Aiming at micro-displacement, the mechanism by curing adhesive contraction and thermal effect is analyzed and discussed, and the impact towards optical performance. The theoretical model and designing method of consolidation of strength and stiffness distribution is established, and the method of consolidation of strength and stiffness is developed for the technology of curing adhesive.
(4) Aiming at the automated packaging equipment for arrayed waveguide devices, base on the theory of multi-body system dynamics, the accuracy transfer model of aligning and coupling is established. The basic principles of sensitive error source, error compensation and computation of the value of error compensation are analyzed and discussed. According to the automated alignment requirements of waveguide chip and fiber array, the machine visual system of measurement and adjustment of waveguide chip and fiber array is established, the linear measurement technology of image preprocessing and grading rapid Hough Transform is proposed, and the curing system of adhesive and UV is established. Summarization above the technologies of each unit mentioned, the arrayed waveguide devices automated packaging equipment is realized, and the automated packaging process software is developed.
(5) Comprehensive utilization of the research results mentioned above,1×8,1×16and1×32planar optical waveguide splitter are taken as examples, a lot of packaging experiments are taken, and the performance of device is measured. The results indicate that the optical power loss of single point lower than0.1dB, the wavelength dependent loss lower than0.2dB, the uniformity lower than0.2dB, the polarization dependent loss lower than0.15dB, and the temperature dependent loss lower than0.22dB, which indicates that the arrayed waveguide devices base on automated packaging equipment and processing mechanism of the subject are better than other commercial devices apparently, and reflects that the subject has many technical advantages and practical engineering adaptability.
引文
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