微流控芯片注射成型及模内键合研究
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摘要
摘要：随着微流控芯片研究的不断深入,对低成本、大批量、一次性使用芯片的需求日益迫切,聚合物微流控芯片已成为微型便携分析仪器产业化和商业化的主要方向。目前,用于实验室研究的单件、小批量芯片制备已经能够实现,但如何实现聚合物微流控芯片高效、低成本制造才是该技术产业化所面临的关键难题。本文提出一种聚合物微流控芯片的注射成型及模内键合技术,实现了聚合物微流控芯片的注射成型和热键合工艺的有效集成,并利用数值模拟和实验研究的方式,研究了聚合物微流控芯片注射成型及模内键合工艺与相关理论,提高了微流控芯片的成型质量,为微流控芯片的批量化生产提供一个新思路。
分析传统聚合物微流控芯片制造工艺,基于注射成型工艺中模内装配技术,提出一种微流控芯片注射成型及模内键合的制造工艺方案,对浇注系统、抽芯油缸及温度控制系统的设计进行了对比分析。最终,实现聚合物微流控芯片的成型、对准和键合的有效集成。
在注射成型工艺中,首先针对微流控芯片宏观翘曲变形进行了实验研究,通过模流分析软件对芯片充填过程的压力分布进行了分析,揭示了注射成型工艺参数对制件的翘曲的影响规律,对成型工艺参数进行了初步优化。然后,利用单因素实验法,研究注射成型工艺参数对横向和纵向微观微通道复制度的影响。适当地增加模具温度、熔体温度可以减小不同位置微通道上宽的差距,使微通道形貌均匀一致；通过提高注射速度可有效降低微注射成型对高模具温度和熔体温度的要求。最后,优化了成型工艺参数,当模具温度90℃、熔体温度245℃、注射速度35cm3/s、保压压力140MPa,保压时间3s时,所成型微流控芯片的翘曲量较小、微通道形貌一致性良好。
基于聚合物力学基础理论,分析模内键合过程中微流控芯片微通道的变形机理。进行了PMMA材料的高温力学性能实验,获得其相关力学性能参数,在玻璃转化温度附近时,PMMA表现出明显的粘弹性性能。利用有限元分析软件仿真分析了PMMA微流控芯片模内键合过程中微通道变形情况,与实验结果进行对比分析,揭示了键合工艺参数对微通道变形的影响规律。研究结果表明,采用广义Maxwell材料模型能较好的模拟聚合物微流控芯片键合过程中微通道的变形。随着键合温度、键合压力和键合时间的提升,芯片的微通道变形增加；键合温度和键合压力是影响微通道变形的主要因素。在键合过程中微通道顶部会与两侧壁发生粘合,对微通道变形影响很大,主要体现在上宽和高度方向上。
基于吸附理论和扩散理论分析了微流控芯片模内键合过程中键合强度的形成机理。利用分子动力学软件对PMMA芯片模内键合过程进行模拟,同时进行了芯片模内键合实验及强度测试实验,对微流控芯片键合强度的形成机理进行了验证,研究了键合环境对芯片键合强度形成的影响规律。研究结果表明,芯片键合强度的形成是界面分子扩散和吸附共同作用的结果。适当的增加键合压力,可以显著的提升键合强度,并缩短键合时间。而键合温度和键合时间的提升,增加键合界面间分子的相互扩散,提高界面分子间的作用力,从而提高键合强度。
综合考虑模内键合过程中微通道变形及键合强度,论文选取键合温度102℃,键合压力1.8MPa和键合时间240s作为优化工艺参数。采用模内实验对优化工艺参数进行验证,所制备微流控芯片的键合强度达到了350KPa,且微通道网络密封性良好,芯片微通道高度为36μm,上宽为85μm,下宽为38μm,最大变形不超过10%,变形较小,满足要求。
Abstract:With the deepening of research on microfluidic chip, demand on low-cost, high-volume, single-use chips is increasingly urgent.polymer microfluidic chips have become a main research direction of industrialization and commercialization in mini portable analytical instruments. Currently, one-piece or small quantities manufacturing of chips for laboratory studies have been able to achieve, but how to achieve a polymer microfluidic chips efficient, low-cost manufacturing is a critical challenges for industrialization. This paper presents a new technology on injection molding and bonding polymer microfluidic chip,to achieve effective integration of injection molding and thermal bonding. With numerical simulation and experimental study, the key technologies were studied on the process of injection molding and in-mold bonding polymer microfluidic chip to improve molding quality, which can provide a new idea for industrialization of microfluidic chip.
Basing on analysis of the traditional polymer microfluidic chip manufacturing process and in-mold assembly technology, the processes of molding, alignment and bonding of the substrate and cover sheet were integrated in an injection mold. It was compared and analyzed on the design of gating system, core pulling cylinders and temperature control system to achieve effective integration molding, aligning, in-mold bonding polymer microfluidic chip ultimately.
In the injection molding process, the microfluidic chip warpage was investigated experimentally. The pressure distribution in the substrate and the cover sheet filling process was analyzed by mold flow analysis software. The influence of process parameters on the warpage was revealed, and a preliminary process optimization for the injection molding molding was achieved. Based on preliminary optimization, the single factor injection molding experiments were carried out to research the influence of process parameters on the degree of replication of transverse and longitudinal micro-channel. The uniform micro-channel morphology can be got by increasing mold temperature and melt temperature appropriately. The requirements for high mold temperature and melt temperature can be reduced by increasing injection speed in micro-injection molding. And the optimal combination of process parameters was obtained. Mold temperature of90℃, melt temperature of245℃, injection speed of 35cm3/s, holding pressure of140MPa, dwell time of3s, ensure warpage small and micro-channel morphology uniform.
Based on polymer mechanics theory, deformation mechanism of microfluidic chip microchannel was analyzed in in-mold bonding process. The mechanical performance test of PMMA at high temperature was carried out to obtain its parameters of mechanical properties. At the vicinity of the glass transition temperature, PMMA materials exhibit significant viscoelastic properties. Simulation was carried out by finite element analysis software to analyze the microchannel deformation of PMMA microfluidic chip in in-mold bonding process. Combined with experimental results, the influence of bonding temperature, bonding pressure and bonding time on the micro-channel deformation was obtained. With bonding temperature, bonding pressure and bonding time increasing, the deformation of chip microchannel increases, and bonding temperature and bonding pressure are the main influence on microchannel deformation. In the process of in-mold bonding, the top and side walls of microchannel could be adhered, which had a great influence on the micro-channel deformation, mainly reflected in the top width and height direction. Generalized Maxwell material model could be used to simulate the microchannel deformation of polymer microfluidic chip in the process of in-mold bonding.
The formation mechanism of bonding strength was analyzed in the process of in-mold bonding basing on adsorption theory and diffusion theory. A molecular dynamics software was used to simulate for bonding process of PMMA chip. In-mold bonding experiments and bonding strength test experiments were also carried out to study and verify the influence of process parameters on the formation of the bonding strength. The results show that the formation of bonding strength is results of diffusion and adsorption of interface moleculars. An appropriate increase in pressure can significantly improve the bonding strength and shorten the bonding time. With the bonding temperature and bonding time increasing, the mutual diffusion of interface molecules is increased to improve the interface force, thereby to increase the bonding strength.
Considering the microchannel deformation and bonding strength in in-mold bonding process, the bonding temperature of102℃, pressure of1.8MPa bonding and bonding time of240s were selected as the optimal process parameters. Under the optimal process parameters, the experiments of in-mold bonding was carried out. The bonding strength of microfluidic chip was350KPa, its micro-channel networks was sealed well, and the deformation of chip micro-channel is small, the height of36μm, the top width of85μm, width at the bottom of38μm. The maximum deformation was not more than10%, meeting the requirements of application.
分析传统聚合物微流控芯片制造工艺,基于注射成型工艺中模内装配技术,提出一种微流控芯片注射成型及模内键合的制造工艺方案,对浇注系统、抽芯油缸及温度控制系统的设计进行了对比分析。最终,实现聚合物微流控芯片的成型、对准和键合的有效集成。
在注射成型工艺中,首先针对微流控芯片宏观翘曲变形进行了实验研究,通过模流分析软件对芯片充填过程的压力分布进行了分析,揭示了注射成型工艺参数对制件的翘曲的影响规律,对成型工艺参数进行了初步优化。然后,利用单因素实验法,研究注射成型工艺参数对横向和纵向微观微通道复制度的影响。适当地增加模具温度、熔体温度可以减小不同位置微通道上宽的差距,使微通道形貌均匀一致；通过提高注射速度可有效降低微注射成型对高模具温度和熔体温度的要求。最后,优化了成型工艺参数,当模具温度90℃、熔体温度245℃、注射速度35cm3/s、保压压力140MPa,保压时间3s时,所成型微流控芯片的翘曲量较小、微通道形貌一致性良好。
基于聚合物力学基础理论,分析模内键合过程中微流控芯片微通道的变形机理。进行了PMMA材料的高温力学性能实验,获得其相关力学性能参数,在玻璃转化温度附近时,PMMA表现出明显的粘弹性性能。利用有限元分析软件仿真分析了PMMA微流控芯片模内键合过程中微通道变形情况,与实验结果进行对比分析,揭示了键合工艺参数对微通道变形的影响规律。研究结果表明,采用广义Maxwell材料模型能较好的模拟聚合物微流控芯片键合过程中微通道的变形。随着键合温度、键合压力和键合时间的提升,芯片的微通道变形增加；键合温度和键合压力是影响微通道变形的主要因素。在键合过程中微通道顶部会与两侧壁发生粘合,对微通道变形影响很大,主要体现在上宽和高度方向上。
基于吸附理论和扩散理论分析了微流控芯片模内键合过程中键合强度的形成机理。利用分子动力学软件对PMMA芯片模内键合过程进行模拟,同时进行了芯片模内键合实验及强度测试实验,对微流控芯片键合强度的形成机理进行了验证,研究了键合环境对芯片键合强度形成的影响规律。研究结果表明,芯片键合强度的形成是界面分子扩散和吸附共同作用的结果。适当的增加键合压力,可以显著的提升键合强度,并缩短键合时间。而键合温度和键合时间的提升,增加键合界面间分子的相互扩散,提高界面分子间的作用力,从而提高键合强度。
综合考虑模内键合过程中微通道变形及键合强度,论文选取键合温度102℃,键合压力1.8MPa和键合时间240s作为优化工艺参数。采用模内实验对优化工艺参数进行验证,所制备微流控芯片的键合强度达到了350KPa,且微通道网络密封性良好,芯片微通道高度为36μm,上宽为85μm,下宽为38μm,最大变形不超过10%,变形较小,满足要求。
Abstract:With the deepening of research on microfluidic chip, demand on low-cost, high-volume, single-use chips is increasingly urgent.polymer microfluidic chips have become a main research direction of industrialization and commercialization in mini portable analytical instruments. Currently, one-piece or small quantities manufacturing of chips for laboratory studies have been able to achieve, but how to achieve a polymer microfluidic chips efficient, low-cost manufacturing is a critical challenges for industrialization. This paper presents a new technology on injection molding and bonding polymer microfluidic chip,to achieve effective integration of injection molding and thermal bonding. With numerical simulation and experimental study, the key technologies were studied on the process of injection molding and in-mold bonding polymer microfluidic chip to improve molding quality, which can provide a new idea for industrialization of microfluidic chip.
Basing on analysis of the traditional polymer microfluidic chip manufacturing process and in-mold assembly technology, the processes of molding, alignment and bonding of the substrate and cover sheet were integrated in an injection mold. It was compared and analyzed on the design of gating system, core pulling cylinders and temperature control system to achieve effective integration molding, aligning, in-mold bonding polymer microfluidic chip ultimately.
In the injection molding process, the microfluidic chip warpage was investigated experimentally. The pressure distribution in the substrate and the cover sheet filling process was analyzed by mold flow analysis software. The influence of process parameters on the warpage was revealed, and a preliminary process optimization for the injection molding molding was achieved. Based on preliminary optimization, the single factor injection molding experiments were carried out to research the influence of process parameters on the degree of replication of transverse and longitudinal micro-channel. The uniform micro-channel morphology can be got by increasing mold temperature and melt temperature appropriately. The requirements for high mold temperature and melt temperature can be reduced by increasing injection speed in micro-injection molding. And the optimal combination of process parameters was obtained. Mold temperature of90℃, melt temperature of245℃, injection speed of 35cm3/s, holding pressure of140MPa, dwell time of3s, ensure warpage small and micro-channel morphology uniform.
Based on polymer mechanics theory, deformation mechanism of microfluidic chip microchannel was analyzed in in-mold bonding process. The mechanical performance test of PMMA at high temperature was carried out to obtain its parameters of mechanical properties. At the vicinity of the glass transition temperature, PMMA materials exhibit significant viscoelastic properties. Simulation was carried out by finite element analysis software to analyze the microchannel deformation of PMMA microfluidic chip in in-mold bonding process. Combined with experimental results, the influence of bonding temperature, bonding pressure and bonding time on the micro-channel deformation was obtained. With bonding temperature, bonding pressure and bonding time increasing, the deformation of chip microchannel increases, and bonding temperature and bonding pressure are the main influence on microchannel deformation. In the process of in-mold bonding, the top and side walls of microchannel could be adhered, which had a great influence on the micro-channel deformation, mainly reflected in the top width and height direction. Generalized Maxwell material model could be used to simulate the microchannel deformation of polymer microfluidic chip in the process of in-mold bonding.
The formation mechanism of bonding strength was analyzed in the process of in-mold bonding basing on adsorption theory and diffusion theory. A molecular dynamics software was used to simulate for bonding process of PMMA chip. In-mold bonding experiments and bonding strength test experiments were also carried out to study and verify the influence of process parameters on the formation of the bonding strength. The results show that the formation of bonding strength is results of diffusion and adsorption of interface moleculars. An appropriate increase in pressure can significantly improve the bonding strength and shorten the bonding time. With the bonding temperature and bonding time increasing, the mutual diffusion of interface molecules is increased to improve the interface force, thereby to increase the bonding strength.
Considering the microchannel deformation and bonding strength in in-mold bonding process, the bonding temperature of102℃, pressure of1.8MPa bonding and bonding time of240s were selected as the optimal process parameters. Under the optimal process parameters, the experiments of in-mold bonding was carried out. The bonding strength of microfluidic chip was350KPa, its micro-channel networks was sealed well, and the deformation of chip micro-channel is small, the height of36μm, the top width of85μm, width at the bottom of38μm. The maximum deformation was not more than10%, meeting the requirements of application.
引文
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