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紫外光固化金刚石线锯制造技术研究
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摘要
现代半导体材料向着大规格、高精度、高效率和低成本发展,对传统半导体硬脆材料加工工具提出了新的技术挑战。本文在光固化磨具研究基础上,以光固化树脂作为金刚石线锯结合剂为技术实现目标,在材料性能、结合强度、涂覆固化工艺及加工性能等方面,对紫外光固化金刚石线锯制造技术进行了研究。
     (1)研究了光固化线锯树脂结合剂的机械物理性能。根据线锯加工工况对结合剂性能的技术要求,提出了光固化线锯树脂结合剂材料性能的选择原则。据此原则,通过对光固化树脂进行机械物理性能测试实验及综合评价,确定了符合光固化线锯制造技术要求的光固化树脂品种类型。
     (2)研究了芯线材料及其界面结合性能。分析了线锯实际工作对材料强度性能的技术要求,确定了光固化线锯芯线的材料及种类。根据金属芯线与非金属芯线不同材料特性,分别实验研究了提高光固化树脂与芯线界面结合强度的表面处理措施及工艺条件。
     (3)研究了金刚石在结合剂中的固位机理。建立了光固化树脂对金刚石机械包镶的力学模型及表征树脂包镶金刚石能力的拉伸法实验评价模型。依据粘接理论,实验研究了提高光固化线锯金刚石包镶固位能力的措施。
     (4)研究了线锯涂覆与光固化工艺。根据光固化线锯的制造工艺特点,制订了光固化线锯的制造工艺流程,研制了线锯涂覆固化机,并对光固化线锯涂覆与固化工艺的质量控制进行了研究。
     (5)研究了光固化线锯磨损失效机理及加工性能。在分析光固化线锯磨损与失效形式的基础上,研究了影响其磨损失效的因素及机理,并确立了光固化线锯加工性能的评价方法。对光固化树脂单体改性及非金属芯线预张拉技术改善线锯性能的工艺进行了实验研究,并对光固化线锯与商品化的电镀线锯进行了加工性能的对比与评价。
New technical challenges have been posed to the traditional machining tools applied to semiconductor hard brittle materials with the development of the modern semiconductor material towards the big specification, the high accuracy, the high efficiency and the low cost. Based on the research on ultraviolet-curing grinding tool, the thesis studied manufacturing technology of ultraviolet-curing diamond wire saw in respect of material performance, bond strength, coating curing technology and processing properties etc., aiming at the technology target use of ultraviolet- curing resin as a bond for fixed-abrasive diamond wire saw.
     (1) Mechanical physical performances of ultraviolet-curing resins were studied. According to technical requirement of the wire saw work condition, the selection principles of material performances have been brought forward. By these principles, ultraviolet-curing resin types conforming to manufacturing technical requirement of the wire saw have been determined after the mechanical physical performance experiments and overall evaluation.
     (2) Core wire materials and properties of boundary surface were studied. The materials and varieties of core wires of ultraviolet-curing wire saw have been selected by technical requirement of the wire saw work condition for material strength. According to characteristics of metal and non-metal core wire, the respective experimental studies about surface treatment and technological conditions have been carried out to improve the interfacial bond strength between ultraviolet-curing and core wire.
     (3) Retention mechanism of diamond in agent was studied. The mechanical model of diamond embedded in ultraviolet-curing resin and evaluative experiment model of tensile test have been established. According to main bond theory, the methods were devised to improve the retention ability of embedded diamond in ultraviolet-curing wire saw.
     (4) The coating and curing technologies of wire saw were studied. The manufacturing technological process of wire saw was formulated in terms of technology of ultraviolet-curing wire saw. A wire saw coating curing machine has been developed. Furthermore, the quality control of coating and curing technologies were studied.
     (5) Wear failure mechanism and machining performance of ultraviolet-curing wire saw were studied. Based on the analysis of wear failure forms of ultraviolet-curing wire saw, the factors and mechanism that affected wear failure were studied. An evaluation method was established. Many experimental researches were carried out to study the improvement of performance of wire saw achieved by modifying resin using monomer and pretension technology for not-metal core wire. The comparison and evaluation of machining performance were conducted between ultraviolet-curing wire saw and commercial electroplated wire saw.
引文
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