多温区无铅回流焊炉控制系统的设计与实现
摘要
基于多温区无铅回流焊炉的烧结曲线和工艺参数等特点,本文提出应用可编程逻辑控制器(PLC)和计算机结合的控制系统对多温区无铅回流焊炉进行控制,使多温区无铅回流焊炉适应当前无铅回流焊接的工艺需要。该控制系统主要由温度控制系统、运动控制系统和计算机监控系统组成。主要研究内容如下：
1、温度控制系统的研究。重点分析了多温区回流焊炉温度控制的数学模型,并在此基础上提出了多温区无铅回流焊炉的温度控制方案。本温度控制系统分为若干个闭环控制回路,分别控制每个温区的温度,由热电偶把温度转变成毫伏电压信号传送给温控单元,温控单元根据设定的二自由度PID算法,输出信号控制固态继电器,根据固态继电器输出端电流的通断不断调整加热器件的功率,达到控制温度的目的。
2、导轨宽度控制系统的研究。系统以PLC为控制核心,根据生产工艺要求,结合低压电器,控制电机的运行和电磁阀闭合,达到控制导轨调宽动作的要求。
3、计算机监控系统设计与实现。监控系统的上位机和下位机通过串口进行通讯,上位机采用工业控制计算机；下位机包括PLC、变频器和一些控制模块。上位计算机控制软件采用VB语言编写,可以设置控制参数,显示和存储测控数据。
4、实验调试结果与分析。提出了回流焊炉实验及调试的主要内容,通过现场试验结果,验证二自由度PID控制方式的结果,以及电气系统的正常。
该控制系统结合工艺,集控制功能、管理功能和数据处理功能于一体。现场运行表明该系统稳定可靠,达到设计要求。
Based on the sinter curves, process parameters and other characteristics of the multi-temperature-zone lead-free reflow-soldering, this paper puts forward to control the multi-temperature-zone lead-free reflow-soldering stove using a control system consisted of programmable logic controller(PLC) and computer, so that it can meet the current technique need of the lead-free reflow-soldering. The system consists mainly of the temperature control system, the motion control system and the computer monitoring system. The study mainly focuses on the following items:
Research on the temperature control system. The mathematical model of the temperature control of the multi-temperature-zone lead-free reflow-soldering is analyzed emphatically. And based on this a temperature control method for the multi-temperature-zone lead-free reflow-soldering stove is brought forward. It consists of several close-looped control circuits which control the temperature of each zone respectively. The thermocouple converts the temperature into millivolt voltage signals which are transferred to the PLC temperature units. Then the temperature units output a signal according to the set 2DOF PID algorithm to control the Solid-State Relay (SSR). SSR adjusts constantly the load current of the heating components according to its output current signals so as to realize the temperature control.
Research on the track width control system. With PLC being the control center, according to the process needs, combining the low-voltage electrical equipments, the needs of the track width adjusting motion control can be achieved by controlling the motor operation and the switch of the electromagnetic valve.
Design and implementation of the computer monitoring system. The upper computer and downer computer of the monitoring system communicate via serial ports. Industrial control computer is used as upper computer and downer computer includes PLC, frequency converter and some controlling modules. Control software for host computer is compiled in VB language, which can configure control parameters, display and save measuring and controlling data.
Experiment result and analysis. The main experimental and debugging items are shown. The locale experiment results are used to validate the 2DOF PID control effectiveness and the normality of the control system.
This control system is a combination of controlling, managing and data processing functions. Field operations show that the system is stable and reliable and meets the design requirements.
1、温度控制系统的研究。重点分析了多温区回流焊炉温度控制的数学模型,并在此基础上提出了多温区无铅回流焊炉的温度控制方案。本温度控制系统分为若干个闭环控制回路,分别控制每个温区的温度,由热电偶把温度转变成毫伏电压信号传送给温控单元,温控单元根据设定的二自由度PID算法,输出信号控制固态继电器,根据固态继电器输出端电流的通断不断调整加热器件的功率,达到控制温度的目的。
2、导轨宽度控制系统的研究。系统以PLC为控制核心,根据生产工艺要求,结合低压电器,控制电机的运行和电磁阀闭合,达到控制导轨调宽动作的要求。
3、计算机监控系统设计与实现。监控系统的上位机和下位机通过串口进行通讯,上位机采用工业控制计算机；下位机包括PLC、变频器和一些控制模块。上位计算机控制软件采用VB语言编写,可以设置控制参数,显示和存储测控数据。
4、实验调试结果与分析。提出了回流焊炉实验及调试的主要内容,通过现场试验结果,验证二自由度PID控制方式的结果,以及电气系统的正常。
该控制系统结合工艺,集控制功能、管理功能和数据处理功能于一体。现场运行表明该系统稳定可靠,达到设计要求。
Based on the sinter curves, process parameters and other characteristics of the multi-temperature-zone lead-free reflow-soldering, this paper puts forward to control the multi-temperature-zone lead-free reflow-soldering stove using a control system consisted of programmable logic controller(PLC) and computer, so that it can meet the current technique need of the lead-free reflow-soldering. The system consists mainly of the temperature control system, the motion control system and the computer monitoring system. The study mainly focuses on the following items:
Research on the temperature control system. The mathematical model of the temperature control of the multi-temperature-zone lead-free reflow-soldering is analyzed emphatically. And based on this a temperature control method for the multi-temperature-zone lead-free reflow-soldering stove is brought forward. It consists of several close-looped control circuits which control the temperature of each zone respectively. The thermocouple converts the temperature into millivolt voltage signals which are transferred to the PLC temperature units. Then the temperature units output a signal according to the set 2DOF PID algorithm to control the Solid-State Relay (SSR). SSR adjusts constantly the load current of the heating components according to its output current signals so as to realize the temperature control.
Research on the track width control system. With PLC being the control center, according to the process needs, combining the low-voltage electrical equipments, the needs of the track width adjusting motion control can be achieved by controlling the motor operation and the switch of the electromagnetic valve.
Design and implementation of the computer monitoring system. The upper computer and downer computer of the monitoring system communicate via serial ports. Industrial control computer is used as upper computer and downer computer includes PLC, frequency converter and some controlling modules. Control software for host computer is compiled in VB language, which can configure control parameters, display and save measuring and controlling data.
Experiment result and analysis. The main experimental and debugging items are shown. The locale experiment results are used to validate the 2DOF PID control effectiveness and the normality of the control system.
This control system is a combination of controlling, managing and data processing functions. Field operations show that the system is stable and reliable and meets the design requirements.
引文
[1]何丽梅.SMT—表面组装技术[M].北京：机械工业出版社,2006
[2]殷大澎.SMT回流焊设备电控系统的设计开发[D].安徽：合肥工业大学,2007
[3]谢健浩.无铅工艺对回流焊设备的新要求[J/OL].http://www.emasia-china.com/article.asp?articleid=5306,2008年5月1日
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[5]马明建,周长城.数据采集与处理技术[M].西安：西安交通大学出版社,2001
[6]高敏.多温区回流焊计算机控制系统的研究[D].南京：河海大学,2004
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[8]郝应征,王彩云.再流焊接的一般要求及温度测试方法[J].电子工艺技术,1999,20(4)：151-153
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[11]Lee Y G, Duh J G. Phase analysis in the solder joint of Sn-Cu solder/IMC/ Cu substrate [J]. Materials characterization,1999,42:143-160
[12]汪学军.多温区自动测控系统控制模型的建立与研究[D].长沙：中南大学,2007
[13]张宏亮.多温区控制系统算法研究及鲁棒性能分析[D].长沙：中南大学,2007
[14]CQMlH系列可编程序控制器使用手册[M]
[15]曹辉,霍罡.可编程序控制器系统原理及应用[M].北京：电子工业出版社,2003
[16]Gorez R. New design relations for 2-DOF PID like control systems [J] Automatica,2003,39:901-908
[17]王维杰,李东海,高琪瑞,王传峰.一种二自由度P ID控制器参数整定方法[J].清华大学学报(自然科学版).2008,48(11)：1787-1790
[18]马雁,王杰,王非.一种改进的单神经元二自由度PID控制[J].微计算机信息(测控自动化).2008,24(7-1)：26-28
[19]陶永华,尹怡欣,葛卢生编著.新型PID控制及其应用[M]·北京：机械工业出版社,1998
[20]刘宝廷,程树康等编著.步进电动机及其驱动控制系统[M].哈尔滨：哈尔滨工业大学出版社,1997
[21]霍罡,曹辉,王暄.基于PLC的二自由度PID控制算法研究及应用[J].计算机测量与控制..2005,13(4)：344-345
[22]赵奉先.提高步进电机运行速度的研究[J].仪表技术与传感器.2000,2： 45-46
[23]王卫红,张井岗,刘晓星.基于模糊逻辑的二自由度PID调节器参数整定[J].系统工程与电子技术.2003,25(7)：647-649
[24]刘金锟著.先进PID控制Matlab仿真[M].北京：电子工业出版社,2004
[25]刘娟.PLC控制步进电机设计研究[J].开发研究与设计技术,2007,10
[26]骆彬,刘震霆.利用PLC实现对步进电机的控制[J].军民两用技术与产品,2007,6
[27]弭洪涛,曲萍萍,张秀菊.步进电机在高精度位置控制系统中的应用[J].北华大学学报(自然科学版),2003,4(3)：351-353
[28]段英宏,杨硕.步进电动机的模糊PID控制[J].计算机仿真,2006,23(2)：290-293
[29]陶吉利.热风回流焊机温控系统的研制与开发[D].长沙：中南大学,2004
[30]宋安军,曹捷,张国琦.用模糊PID算法实现热风回流焊机PID控制[J].电子工艺技术,2000,21(3)：110-112
[31]Lutz GrOll, ralf Mikut, Hartmut Sauermann. A ConcePt for the Fuzzy-adaptive Temperature Control of MIMO Systems[J]. SAMA,1998,13:50～58
[32]向涛.基于热平衡机理的多温区动态建模及控制研究[D].长沙：中南大学,2006
[33]诸静.模糊控制原理与应用[M].北京：机械工业出版社,1995
[34]李士勇.模糊控制、神经网络和智能控制论[M].哈尔滨：哈尔滨工业大学出版社,1998
[35]章卫国、杨向忠.模糊控制理论与应用[M].西安：西北工业大学出版社,2000
[2]殷大澎.SMT回流焊设备电控系统的设计开发[D].安徽：合肥工业大学,2007
[3]谢健浩.无铅工艺对回流焊设备的新要求[J/OL].http://www.emasia-china.com/article.asp?articleid=5306,2008年5月1日
[4]盛菊仪,徐冠捷.无铅回流焊工艺及设备[J].电子工艺技术.2004,25(2)：60-63
[4]邓朝霞.无铅回流焊模糊控制器的研究[C].桂林：广西大学,2006
[5]马明建,周长城.数据采集与处理技术[M].西安：西安交通大学出版社,2001
[6]高敏.多温区回流焊计算机控制系统的研究[D].南京：河海大学,2004
[7]朱庆保.微型计算机系统及接口应用技术[M].南京：南京大学出版社,1997.
[8]郝应征,王彩云.再流焊接的一般要求及温度测试方法[J].电子工艺技术,1999,20(4)：151-153
[9]赵俊伟,聂延平,赵志平.再流区工艺参数对焊接可靠性的影响[J].电子工艺技术,2001,22(2)：62-63
[11]Lee Y G, Duh J G. Phase analysis in the solder joint of Sn-Cu solder/IMC/ Cu substrate [J]. Materials characterization,1999,42:143-160
[12]汪学军.多温区自动测控系统控制模型的建立与研究[D].长沙：中南大学,2007
[13]张宏亮.多温区控制系统算法研究及鲁棒性能分析[D].长沙：中南大学,2007
[14]CQMlH系列可编程序控制器使用手册[M]
[15]曹辉,霍罡.可编程序控制器系统原理及应用[M].北京：电子工业出版社,2003
[16]Gorez R. New design relations for 2-DOF PID like control systems [J] Automatica,2003,39:901-908
[17]王维杰,李东海,高琪瑞,王传峰.一种二自由度P ID控制器参数整定方法[J].清华大学学报(自然科学版).2008,48(11)：1787-1790
[18]马雁,王杰,王非.一种改进的单神经元二自由度PID控制[J].微计算机信息(测控自动化).2008,24(7-1)：26-28
[19]陶永华,尹怡欣,葛卢生编著.新型PID控制及其应用[M]·北京：机械工业出版社,1998
[20]刘宝廷,程树康等编著.步进电动机及其驱动控制系统[M].哈尔滨：哈尔滨工业大学出版社,1997
[21]霍罡,曹辉,王暄.基于PLC的二自由度PID控制算法研究及应用[J].计算机测量与控制..2005,13(4)：344-345
[22]赵奉先.提高步进电机运行速度的研究[J].仪表技术与传感器.2000,2： 45-46
[23]王卫红,张井岗,刘晓星.基于模糊逻辑的二自由度PID调节器参数整定[J].系统工程与电子技术.2003,25(7)：647-649
[24]刘金锟著.先进PID控制Matlab仿真[M].北京：电子工业出版社,2004
[25]刘娟.PLC控制步进电机设计研究[J].开发研究与设计技术,2007,10
[26]骆彬,刘震霆.利用PLC实现对步进电机的控制[J].军民两用技术与产品,2007,6
[27]弭洪涛,曲萍萍,张秀菊.步进电机在高精度位置控制系统中的应用[J].北华大学学报(自然科学版),2003,4(3)：351-353
[28]段英宏,杨硕.步进电动机的模糊PID控制[J].计算机仿真,2006,23(2)：290-293
[29]陶吉利.热风回流焊机温控系统的研制与开发[D].长沙：中南大学,2004
[30]宋安军,曹捷,张国琦.用模糊PID算法实现热风回流焊机PID控制[J].电子工艺技术,2000,21(3)：110-112
[31]Lutz GrOll, ralf Mikut, Hartmut Sauermann. A ConcePt for the Fuzzy-adaptive Temperature Control of MIMO Systems[J]. SAMA,1998,13:50～58
[32]向涛.基于热平衡机理的多温区动态建模及控制研究[D].长沙：中南大学,2006
[33]诸静.模糊控制原理与应用[M].北京：机械工业出版社,1995
[34]李士勇.模糊控制、神经网络和智能控制论[M].哈尔滨：哈尔滨工业大学出版社,1998
[35]章卫国、杨向忠.模糊控制理论与应用[M].西安：西北工业大学出版社,2000
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