P-96: Heat Transferable Thin Film Encapsulation Inserted Ag Thin Film to Improve Reliability of Flexible Displays

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• 作者：Jeong Hyun Kwon ; Hyeon-Gyun Im ; Byeong-Soo Bae ; Ki Soo Chang ; Sang-Hee Ko Park and Kyung Cheol Choi
• 刊名：SID Symposium Digest of Technical Papers
• 出版年：2016
• 出版时间：May 2016
• 年：2016
• 卷：47
• 期：1
• 页码：1491-1494
• 全文大小：1278K
• ISSN：2168-0159

文摘

In this study, thin film encapsulation (TFE) with an Ag thin film is proposed to improve the long-term reliability of flexible displays in terms of the barrier property, flexibility, and heat dissipation. By applying thin film encapsulation to bottom-emission organic light-emitting diodes (BEOLEDs) fabricated on glass, the lifetimes of OLED devices were improved, showing differences among TFE layers. The maximum temperatures measured from the backside of the glass substrate were 66.73, 64.15, 59.21 and 39.63 °C after the OLED was operated at a luminance of 10000 cd/m², and an operational lifetime test results were remarkably consistent with the measurement results of infrared images. Efficient heat dissipation through thermally conductive TFE layers improved the OLED reliability in terms of lifetime.