Observation of ceramic cracking during quenching

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• 作者：Yingfeng Shao ; Fan Song ; Boyang Liu ; Wei Li ; Long Li and Chiping Jiang
• 刊名：Journal of the American Ceramic Society
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：100
• 期：2
• 页码：520-523
• 全文大小：619K
• ISSN：1551-2916

文摘

It is difficult to observe the thermal shock cracking in real time, so the measurement of the crack after thermal shock is considered as an alternative method. This paper proposes a new experimental method which can exhibit the thermal shock cracking in real time by water quenching of translucent ceramic and high-speed imaging. The crack propagation is captured, and the crack growth rate is calculated. The results confirm the previous theoretical predictions of crack propagation under thermal shock. This paper expands the research on understanding the failure mechanisms of ceramic materials in thermal shock.