Microstructure and thermal expansion behavior of Al-50Si synthesized by selective laser melting

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• 作者：Y.D. Jia^a ; ^b ; P. Ma^c ; K.G. Prashanth^b ; G. Wang^a ; J. Yi^a ; S. Scudino^d ; F.Y. Cao^e ; J.F. Sun^e ; J. Eckert^b ; ^f ; ^{juergen.eckert@unileoben.ac.at}
• 关键词：Selective laser melting (SLM) ; Al-50Si alloy ; Microstructure ; Solid solution ; Thermal expansion
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：30 March 2017
• 年：2017
• 卷：699
• 期：Complete
• 页码：548-553
• 全文大小：1378 K
• 卷排序：699

文摘

A new electronic packaging material of Al-50Si alloy is prepared by SLM technique. The correlation between microstructure and CTE of SLM Al-50Si alloy is investigated. The precipitation of Si particles from the Al matrix leads to a CTE peak. The experimental CTE lies between the SL and the Turner model after heat treatment.