Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by AuAu flip-chip bonding and capillary-driven filling process
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- 作者：S. Yamadaa ; C.-H. Shimb ; T. Edurac ; A. Okadaa ; C. Adachib ; c ; S. Shojia ; J. Mizunod ; mizuno@waseda.jp" class="auth_mail" title="E-mail the corresponding author
- 关键词：Active-matrix organic-light-emitting diode (AMOLED) ; Flip-chip assembly ; Wafer bonding ; Low temperature AuAu bonding ; Capillary-driven filling ; Encapsulation
- 刊名：Microelectronic Engineering
- 出版年：2016
- 出版时间：1 August 2016
- 年：2016
- 卷：161
- 期：Complete
- 页码：94-97
- 全文大小：712 K
文摘
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OLED panel assembled by flip-chip bonding and capillary-driven filling is proposed.
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Assembly was successfully carried out at 100 °C with Au
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Stable current flow and electro-luminescence was obtained from assembled OLED panel.
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Flip-chip assembly is effective for fabricating OLED panel with large device area.