Ageing mechanisms in Deep Trench Termination (DT<sup>2sup>) Diode
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- 作者：F. Baccar<sup>asup><sup> ; sup><sup>fedia.baccar@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding authorsup> ; H. Arbess<sup>asup> ; L. Theolier<sup>asup> ; S. Azzopardi<sup>bsup> ; E. Woirgard<sup>asup>
- 关键词：Deep Trench Termination ; Fixed charges ; Thermal ageing ; Failure analysis ; TCAD Senaturus
- 刊名：Microelectronics Reliability
- 出版年：2015
- 出版时间：August-September 2015
- 年：2015
- 卷：55
- 期：9-10
- 页码：1981-1987
- 全文大小：1607 K
文摘
Thermal cycling induces delamination and causes cyclic strains in a similar way to natural usage and weakens the normal functioning by thermal fatigue. Therefore, such approach can be conveniently used in accelerated testing of components to assess their reliability. The purpose of this work is to evaluate the reliability of DT<sup>2sup> diode, by accelerated ageing process. Two major modes of failure were observed: the first one is the delamination of the chip and the second one concerns the breakdown voltage variation. Optical observations as well as Scanning Electron Microscopy (SEM) analysis have shown a delamination around the trench termination. Finite element simulations are carried out to explain the experimental results and justify the breakdown voltage variation.