Influence of extreme thermal cycling on metal-polymer interfaces
详细信息 查看全文
- 作者：Barbara Putz<sup>asup><sup> ; sup><sup>barbara.putz@stud.unileoben.ac.atsup> ; Bernhard Vö ; lker<sup>bsup> ; Christopher Semprimoschnig<sup>csup> ; Megan J. Cordill<sup>asup><sup> ; sup><sup>bsup>
- 关键词：Thin film ; Polymer ; Adhesion ; Buckling ; Thermal cycling
- 刊名：Microelectronic Engineering
- 出版年：2017
- 出版时间：5 January 2017
- 年：2017
- 卷：167
- 期：Complete
- 页码：17-22
- 全文大小：834 K
- 卷排序：167
文摘
Thermal cycling deteriorates the electro-mechanical behaviour of Al films on polyimide. Buckling of a thin Al film on compliant polyimide occurs at 40% tensile strain. The adhesion energy of a thin Al film on compliant polyimide was measured as 70 J/m2. The adhesion energy remains constant up to 200 thermal cycles of ± 150 °C.