Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector

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• 作者：N. Alipour Tehrani^a ; S. Arfaoui^a ; M. Benoit^a ; ^b ; D. Dannheim^a ; K. Dette^a ; ^c ; D. Hynds^a ; ^{daniel.hynds@cern.ch" class="auth_mail" title="E-mail the corresponding author} ; S. Kulis^a ; I. Perić^d ; M. Petrič^a ; S. Redford^a ; E. Sicking^a ; P. Valerio^a
• 关键词：CLIC ; Vertex detectors ; HV-CMOS ; Capacitively coupled pixel detectors ; Silicon detectors
• 刊名：Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
• 出版年：2016
• 出版时间：1 July 2016
• 年：2016
• 卷：823
• 期：Complete
• 页码：1-8
• 全文大小：994 K

文摘

The vertex detector at the proposed CLIC multi-TeV linear e⁺e⁻ collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120 GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor, where efficiencies of greater than 99% have been achieved at −60 V substrate bias, with a single hit resolution of $6.1\mathrm{\mu }\mathrm{m}$. Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.