Improvement of water wetting capability of copper wire braids by surface modification approaches

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• 作者：Chin-Chi Hsu^a ; Chun-Hui Wu^b ; Wei-Kong Sheng^b ; Michael Chen^c ; Long-Sheng Kuo^b ; Ping-Hei Chen^b ; ^{phchen@ntu.edu.tw" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Wettability ; Surface modification ; Capillary rise measurements ; Laplace-Young equation
• 刊名：International Communications in Heat and Mass Transfer
• 出版年：2016
• 出版时间：October 2016
• 年：2016
• 卷：77
• 期：Complete
• 页码：155-158
• 全文大小：794 K

文摘

This study investigated the wettability enchancement of copper wire braids and copper plates by surface modification methods. Two different surface modification methods are applied to form nano structures on surfaces, resulting in superhydrophilic wettability. To examine the wetting capability of the modified samples, the capillary rise measurement for copper plates and copper wire braids was chosen as the performance index in this study. The experimental data of the capillary rise measurements between two parallel plain-copper plates show a good agreement with the Laplace-Young equation. As for the braided copper wires with superhydrophilic wettability, the experimental results have stronger capillarity than that of the plain ones.