Evaluation of multilayer graphene for advanced interconnects

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• 作者：Maria Politou^a ; ^b ; ^{Maria.Politou@imec.be} ; Xiangyu Wu^a ; ^b ; Inge Asselberghs^b ; Antonino Contino^a ; ^b ; Bart Soree^a ; ^b ; Iuliana Radu^b ; Cedric Huyghebaert^b ; Zsolt Tokei^b ; Stefan De Gendt^a ; ^b ; Marc Heyns^a ; ^b
• 关键词：Interconnects ; Multilayer graphene ; Few-layer graphene ; Contact resistance ; Top contacts ; Edge contacts ; Sheet resistance ; Mean free path
• 刊名：Microelectronic Engineering
• 出版年：2017
• 出版时间：5 January 2017
• 年：2017
• 卷：167
• 期：Complete
• 页码：1-5
• 全文大小：701 K
• 卷排序：167

文摘

In this work we are electrically characterizing multilayer graphene ribbons as potential Cu replacement towards future interconnect applications. We are comparing their performance with single-layer ribbons and we are reporting on sheet resistance, mobility and mean free path. We are additionally characterizing the contact properties for Pd contacts in top and edge configuration. Our results show high current carrying capacity for the multilayer ribbons and lower sheet resistance. Edge contacts to multilayer ribbons seem a promising approach for the decrease of the contact resistivity. Values of sheet resistance Rs ~ 280 Ω and contact resistivity Rc*W ~ 325 Ω·μm are measured for multilayer samples and edge contacts. Although the calculated ribbon mean free path is high for single-layer graphene (MFPSLG ~ 60 nm), it is comparable with the MFP of Cu for the multilayer samples (MFPFLG ~ 30 nm). Intercalation is a potential approach for improvement of the multilayer wire properties.