Chemical etching of Tungsten thin films for high-temperature surface acoustic wave-based sensor devices
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- 作者：M. Spindlera ; m.spindler@ifw-dresden.de" class="auth_mail" title="E-mail the corresponding author ; S. Heroldb ; J. Ackerb ; E. Brachmanna ; S. Oswalda ; S. Menzela ; G. Ranea
- 关键词：SAW devices ; Tungsten electrodes ; Magnetron sputtering ; Wet-chemical etching ; Lift-off structuring
- 刊名：Thin Solid Films
- 出版年：2016
- 出版时间：1 August 2016
- 年：2016
- 卷：612
- 期：Complete
- 页码：322-326
- 全文大小：1091 K
文摘
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We fabricated Tungsten SAW Electrodes by magnetron sputtering technology.
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An etching process removes sidewall covering of photoresist, which allows lift-off.
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Tungsten etching rates based on a hydrogen peroxide solutions were determined.