Effect of antimony on vigorous interfacial reaction of Sn–Sb/Te couples

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• 作者：Ching-Hua Lee^a ; Wen-Tai Chen^a ; Chien-Neng Liao ; ^a ; ^{cnliao@mx.nthu.edu.tw}
• 关键词：Thermoelectric ; Interfacial reaction ; Intermetallic compounds
• 刊名：Journal of Alloys and Compounds
• 出版年：2011
• 出版时间：21 April 2011
• 年：2011
• 卷：509
• 期：16
• 页码：5142-5146
• 全文大小：1482 K

文摘

A vigorous reaction between molten Sn–Sb solder and Te substrate leads to a thick SnTe–Sn mixture layer at the soldered junction. The effect of Sb addition in Sn on the kinetics of Sn–Sb/Te interfacial reaction and formation of SnTe–Sn reaction layer is reported. Sb element was found to expedite the growth of SnTe–Sn reaction layer in the Sn–Sb/Te couples dramatically. With increasing Sb content in Sn–Sb solder, the growth rate of SnTe–Sn reaction layer increases while both the size of SnTe grains and the fraction of Sn in SnTe–Sn decrease. The thickness of SnTe–Sn layer follows a parabolic law with reaction time for Sn–Sb/Te couples, unlike the linear dependence with time for Sn/Te couples. An apparent diffusivity of 2 × 10⁻⁷ cm²/s was determined for Sn transport through the SnTe–Sn layer in the Sn–Sb/Te couples reacting at 250 °C.