Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures
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- 作者：Wei-Lan Chiu ; Chien-Min Liu ; Yi-Sa Haung ; Chih Chen ; chih@mail.nctu.edu.tw" class="auth_mail" title="E-mail the corresponding author
- 关键词：Intermetallic alloys and compounds ; Metallurgy ; Diffusion
- 刊名：Materials Letters
- 出版年：2016
- 出版时间：1 February 2016
- 年：2016
- 卷：164
- 期：Complete
- 页码：5-8
- 全文大小：1044 K
文摘
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Formation of Sn channels in Cu6Sn5 IMCs were observed after Cu-Sn reactions.
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Cu6Sn5 channels formed in Cu3Sn IMCs in later stages of the reactions.
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These channels provide fast diffusion paths for Cu to react with the remaining Sn.