Printed interconnects for photovoltaic modules

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• 作者：J.D. Fields^a ; G. Pach^a ; ^b ; K.A.W. Horowitz^a ; T.R. Stockert^a ; ^c ; M. Woodhouse^a ; M.F.A.M. van Hest^a ; ^{maikel.van.hest@nrel.gov" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Thin-film photovoltaics ; Module construction ; Monolithic interconnects ; Printing
• 刊名：Solar Energy Materials and Solar Cells
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：159
• 期：Complete
• 页码：536-545
• 全文大小：1703 K

文摘

Film-based photovoltaic modules employ monolithic interconnects to minimize resistance loss and enhance module voltage via series connection. Conventional interconnect construction occurs sequentially, with a scribing step following deposition of the bottom electrode, a second scribe after deposition of absorber and intermediate layers, and a third following deposition of the top electrode. This method produces interconnect widths of about 300 µm, and the area comprised by interconnects within a module (generally about 3%) does not contribute to power generation. The present work reports on an increasingly popular strategy capable of reducing the interconnect width to less than 100 µm: printing interconnects. Cost modeling projects a savings of about $0.02/watt for CdTe module production through the use of printed interconnects, with savings coming from both reduced capital expense and increased module power output. Printed interconnect demonstrations with copper-indium-gallium-diselenide and cadmium-telluride solar cells show successful voltage addition and miniaturization down to 250 µm. Material selection guidelines and considerations for commercialization are discussed.