Dielectric Si-doped alumina thin films were prepared by sol-gel method.
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class="glyphImg imgLazyJSB">Si bonds and cation vacancies class="mathmlsrc">title="View the MathML source" class="mathImg" data-mathURL="/science?_ob=MathURL&_method=retrieve&_eid=1-s2.0-S0925838816321594&_mathId=si1.gif&_user=111111111&_pii=S0925838816321594&_rdoc=1&_issn=09258388&md5=ef85eda8458e8270ac077fafd3aa6410">
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Excellent dielectric properties of Si-doping alumina thin films were achieved.
The leakage current reduces two orders of magnitude when Si concentration is 2mol%.
Breakdown strength increased by 93%, comparing with undoped alumina film.