Dielectric properties under high electric field for silicon doped alumina thin film with glass-like structure derived from sol-gel process
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Dielectric Si-doped alumina thin films were prepared by sol-gel method.

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Alsingle bondclass="glyphImg imgLazyJSB">Osingle bondclass="glyphImg imgLazyJSB">Si bonds and cation vacancies class="mathmlsrc">title="View the MathML source" class="mathImg" data-mathURL="/science?_ob=MathURL&_method=retrieve&_eid=1-s2.0-S0925838816321594&_mathId=si1.gif&_user=111111111&_pii=S0925838816321594&_rdoc=1&_issn=09258388&md5=ef85eda8458e8270ac077fafd3aa6410">class="imgLazyJSB inlineImage" height="18" width="22" alt="View the MathML source" title="View the MathML source" src="/sd/grey_pxl.gif" data-inlimgeid="1-s2.0-S0925838816321594-si1.gif">class="mathContainer hidden">class="mathCode">VAl''' are produced by substitutive behavior.

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Excellent dielectric properties of Si-doping alumina thin films were achieved.

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The leakage current reduces two orders of magnitude when Si concentration is 2mol%.

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Breakdown strength increased by 93%, comparing with undoped alumina film.

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