Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
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- 作者：K. Du&scaron ; ek dusekk1@fel.cvut.cz" class="auth_mail" title="E-mail the corresponding author ; D. Bu&scaron ; ek busekd1@fel.cvut.cz" class="auth_mail" title="E-mail the corresponding author
- 关键词：Assembly manufacturing ; Flux spattering ; In-circuit test ; Reliability ; Scanning electron microscopy ; Soldering
- 刊名：Microelectronics Reliability
- 出版年：2016
- 出版时间：January 2016
- 年：2016
- 卷：56
- 期：Complete
- 页码：162-169
- 全文大小：2267 K
文摘
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Solving issue in real manufacturing process
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Diagnostic of non-conductive spots on testing pads causing wrong result of in-circuit test
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Determination that the non-conductive spot was a flux residue
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Suggestion of possible solutions for flux spattering reduction: use of suitable solder mask