Flux effect on void quantity and size in soldered joints
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- 作者：D. Bu&scaron ; eka ; K. Du&scaron ; eka ; karel.dusek@fel.cvut.cz" class="auth_mail" title="E-mail the corresponding author ; D. Růžičkaa ; M. Plačeka ; P. Macha ; J. Urbá ; neka ; J. Starý ; b
- 关键词：Assembly manufacturing ; Reliability ; Soldering ; Voids ; Flux
- 刊名：Microelectronics Reliability
- 出版年：2016
- 出版时间：May 2016
- 年：2016
- 卷：60
- 期：Complete
- 页码：135-140
- 全文大小：841 K
文摘
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Complex comparison of flux influence on voids formation inside the solder joints
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Five different flux types, two flux quantities
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One common reflow profile for lead and lead-free paste
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Proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence