Mechanisms and solutions to the brittle solder joint in electroless Ni plating
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- 作者：Xuan Wanga ; xwang12@calpoly.edu" class="auth_mail" title="E-mail the corresponding author ; C. Key Chungb ; keychung@spil.com.tw" class="auth_mail" title="E-mail the corresponding author
- 关键词：Brittle solder joint ; Electroless Ni plating ; Nano voids ; Solder reflow
- 刊名：Microelectronics Reliability
- 出版年：2016
- 出版时间：October 2016
- 年：2016
- 卷：65
- 期：Complete
- 页码：173-177
- 全文大小：1145 K
文摘
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Post electroless Ni water cleaning is the key process to monitor.
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Water conductivity in post Ni cleaning tank should be monitored to alleviate nano voids formation during reflow.
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Higher nano void density causes the solder joint strength to degrade