Cracking and thermal shock resistance of a Bi2Te3 based thermoelectric material
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- 作者：B.L. Wanga ; b ; wangbl2001@hotmail.com" class="auth_mail" title="E-mail the corresponding author ; Y.B. Guoa ; C.W. Zhangb ; c
- 关键词：Thermoelectric materials ; Thermal stress ; Stress intensity factor ; Thermal shock
- 刊名：Engineering Fracture Mechanics
- 出版年：2016
- 出版时间：February 2016
- 年：2016
- 卷：152
- 期：Complete
- 页码：1-9
- 全文大小：1114 K
文摘
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Thermal cracking of a Bi2Te3 based thermoelectric material plate is carried out.
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Thermal stress intensity factors and the thermal shock resistance of the material plate are obtained.
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We discovered that the transient stresses are much bigger than steady stresses.
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The value of thermal shock resistance is enhanced when the plate is thinner.
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An empirical formula for the thermal shock resistance of the thermoelectric material is explored.