Effects of BEOL on self-heating and thermal coupling in SiGe multi-finger HBTs under real operating condition
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- 作者：A.D.D. Dwivedia ; arun-dev-dhar.dwivedi@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author ; adddwivedi@gmail.com" class="auth_mail" title="E-mail the corresponding author ; Anjan Chakravortyb ; anjan@ee.iitm.ac.in" class="auth_mail" title="E-mail the corresponding author ; Rosario D&rsquo ; Espositoa ; rosario.desposito@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author ; Amit Kumar Sahooa ; amit7phy@gmail.com" class="auth_mail" title="E-mail the corresponding author ; Sebastien Fregonesea ; sebastien.fregonese@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author ; Thomas Zimmera ; thomas.zimmer@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author
- 关键词：SiGe ; Multi-finger HBT ; TCAD ; Self-heating ; Thermal coupling ; Compact model
- 刊名：Solid State Electronics
- 出版年：2016
- 出版时间：January 2016
- 年：2016
- 卷：115
- 期：part_PA
- 页码：1-6
- 全文大小：615 K
文摘
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Effects of back-end-of-line on the self-heating and thermal coupling are estimated.
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A method to estimate the coupling under a real operating condition is proposed.
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Coupling factors are found to slightly increase with dissipated power.
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A closed-form formulation is proposed for the coupling factors in a multi-finger HBT.