刊名:Journal of Industrial and Engineering Chemistry
出版年:2017
出版时间:25 February 2017
年:2017
卷:46
期:Complete
页码:199-202
全文大小:1087 K
卷排序:46
文摘
We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1 μm.