Organic and organic-inorganic hybrid polymer thin films deposited by PECVD using TEOS and cyclohexene for ULSI interlayer-dielectric application

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• 作者：Hyeon Jin Seo^a ; Sang-Hun Nam^b ; Sungsoo Kim^c ; Jin-Hyo Boo^a ; ^b ; ^{jhboo@skku.edu" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Ultra low-k ; PECVD ; Chemical states ; XP spectra ; Electronic properties
• 刊名：Applied Surface Science
• 出版年：2015
• 出版时间：1 November 2015
• 年：2015
• 卷：354
• 期：part_PA
• 页码：134-138
• 全文大小：1462 K

文摘

Organic and organic–inorganic hybrid polymer thin films were deposited on Si(1 0 0) substrates at various ratios of TEOS (tetraethoxysilane) to cyclohexene by the plasma enhanced chemical vapor deposition (PECVD) method. The as-grown polymerized thin films were first analyzed by FT-IR and XPS. The results of FT-IR showed that the hybrid polymer thin films were polymerized with each fragmented precursor. The XPS results showed the chemical species and binding energies of each species. The Si 2p core-level spectra from the hybrid polymer thin film showed the status of the Si oxidation number. Impedance analysis was utilized for the measurement of the capacitance values and I–V curves, and an ultra low-k value and leakage current density of 1.75 and 10⁻⁹ A/cm² at 1 MV/cm were obtained, respectively.