Texture evolution and microstructural changes during solid-state dewetting: A correlative study by complementary in situ TEM techniques

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• 作者：Florian Niekiel ; Simon M. Kraschewski ; Peter Schweizer ; Benjamin Butz ; Erdmann Spiecker ; ^{Erdmann.Spiecker@fau.de" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Solid-state dewetting ; Thin films ; Texture ; Grain growth ; Grain rotation
• 刊名：Acta Materialia
• 出版年：2016
• 出版时间：15 August 2016
• 年：2016
• 卷：115
• 期：Complete
• 页码：230-241
• 全文大小：6344 K

文摘

The transition of a thin film into an energetically favorable set of particles at temperatures below the melting point of the bulk material is known as solid-state dewetting. In this work the dewetting behavior of 16 nm thick discontinuous Au thin films on amorphous silicon nitride membranes is quantitatively studied by complementary in situ transmission electron microscopy techniques taking advantage of the unique capabilities of a chip-based heating system. The combination of dedicated imaging and diffraction techniques is used to investigate the interplay of grain growth and texture evolution with the process of dewetting. The results show an initial coarsening of the microstructure preceding the other processes. Texture evolution is highly correlated to material retraction and agglomeration during the following dewetting process. In-plane grain rotation has been observed, acting as an additional mechanism for orientation changes. From a methodological perspective this work demonstrates the capabilities of today’s transmission electron microscopy in combination with state-of-the-art in situ instrumentation. In particular the combination of complementary information from different dedicated techniques in one and the same setup is demonstrated to be highly beneficial.