Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection
详细信息 查看全文
- 作者：Hongqun Dong ; hongqun.dong@aalto.fi" class="auth_mail" title="E-mail the corresponding author ; Vesa Vuorinen ; Mikael Broas ; Mervi Paulasto-Krö ; ckel
- 关键词：Calphad ; Au-Pt-Sn thermodynamic description ; Au-20 wt%Sn|Pt interfacial reaction ; Microstructural characterization
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：15 December 2016
- 年：2016
- 卷：688
- 期：part_PB
- 页码：388-398
- 全文大小：3347 K
文摘
- em" id="list_ulist0010">
- el">•
The thermodynamic parameters of AuPtSn system were reassessed.
- el">•
The Pt|Au-20 wt%Sn diffusion couples bonded at 320 °C were studied.
- el">•
Microstructure of samples annealed at 150 °C were characterized.
- el">•
Diffusion path of Pt|Au-20 wt%Sn at 150 °C was proposed.