文摘
Hydrogenated amorphous silicon carbon (a-SiC:H) films were deposited by hot wire chemical vapor deposition. The evolution of microscopic properties like network bonding, disorder, density and chemical composition are studied as a function of H2 dilution. The sp2 and sp3 carbon clusters, hydrogen content and the density of the material has significant effect on the dielectric properties like the leakage current of M/a-SiC:H/Si MIS structures made with both Cu and Al metal electrode. A higher leakage current is observed in the case of Cu electrode. These changes are important for its applicability as a low dielectric constant barrier material in microelectronic devices.