Experimental considerations for using electrochemical impedance spectroscopy to study chemical mechanical planarization systems

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• 作者：M.C. Turk^a ; M.J. Walters^b ; D. Roy^a ; ^{samoy@clarkson.edu}
• 关键词：CMP ; EIS ; open circuit potential ; tribo-corrosion ; voltammetry
• 刊名：Electrochimica Acta
• 出版年：2017
• 出版时间：10 January 2017
• 年：2017
• 卷：224
• 期：Complete
• 页码：355-368
• 全文大小：3165 K
• 卷排序：224

文摘

Electrochemical reactions dictate the complex chemical component of copper CMP. EIS is an efficient probe of CMP specific surface modifications of metals. Validation of EIS for CMP systems should account for the tribology of polishing. An experimental method is demonstrated to check the EIS criteria for CMP systems. EIS is combined with voltammetry to determine reaction mechanisms of Cu-CMP.