Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

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• 作者：P. Rajaguru^a ; ^{p.rajaguru@gre.ac.uk} ; H. Lu^a ; C. Bailey^a ; J. Ortiz-Gonzalez^b ; O. Alatise^b
• 关键词：Surrogate models ; Power electronic module ; Sensitivity analysis ; Finite element analysis
• 刊名：Microelectronics Reliability
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：68
• 期：Complete
• 页码：77-85
• 全文大小：1036 K
• 卷排序：68

文摘

This paper undertook a study on the impact of the chip on the reliability of Sn3.5Ag solder Chip physical dimension and material properties are the variants. For the both (Si and SiC) chip, there was a negative correlation between die thickness and the solder layer lifetime. Additionally a parametric was undertaken for solder geometry Wetting angle and solder layer thickness influence positively on the lifetime of solder layer