Surface failure analysis of a field-exposed copper-clad plate in a marine environment with industrial pollution

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• 作者：Pan Yi^a ; Chaofang Dong^a ; Kui Xiao^a ; ^{xiaokui@sina.com} ; Xiaogang Li^a ; ^b
• 关键词：PCB-Cu ; Exposure experiment ; Electrochemical migration ; Cu dendrite
• 刊名：Applied Surface Science
• 出版年：2017
• 出版时间：31 March 2017
• 年：2017
• 卷：399
• 期：Complete
• 页码：608-616
• 全文大小：4560 K
• 卷排序：399

文摘

Surface failure analysis of PCB-Cu is conducted by a field exposure experiment. Pitting corrosion occurs at the initial stage and then shifts to general corrosion. The corrosion products exhibited double layer structure. When applied 12 V bias voltage, an anomalous ECM phenomenon was observed.