Highly mechanical strength and thermally conductive bismaleimide-triazine composites reinforced by Al₂O₃@polyimide hybrid fiber

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• 作者：Jianwen Xia^a ; ^c ; Jinhui Li^a ; Guoping Zhang^a ; ^{gp.zhang@siat.ac.cn" class="auth_mail" title="E-mail the corresponding author} ; Xiaoliang Zeng^a ; Fangfang Niu^b ; ^{ffn@szu.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Haipeng Yang^c ; Rong Sun^a ; ChingPing Wong^d
• 关键词：A. Hybrid ; Fibers ; B. Mechanical properties ; B. Thermal properties
• 刊名：Composites Part A: Applied Science and Manufacturing
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：80
• 期：Complete
• 页码：21-27
• 全文大小：1987 K

文摘

Bismaleimide–triazine (BT) resins have received a great deal of attention in microelectronics due to its excellent thermal stability and good retention of mechanical properties. Thereafter, developing BT based composites with high mechanical strength, thermal conductivity and dielectric property simultaneously are highly desirable. In this study, one hybrid fiber of Al₂O₃ nanoparticle (200 nm) supported on polyimide fiber (Al₂O₃@PI) with core–shell structure was introduced into BT resin to prepare promising Al₂O₃@PI–BT composite. The results indicated that the resultant composites possessed high Young’s modulus of 4.06 GPa, low dielectric constant (3.38–3.50, 100 kHz) and dielectric loss (0.0102–0.0107, 100 kHz). The Al₂O₃@PI hybrid film was also conductive to improve thermal stability (T_d5% up to 371 °C), in-plane thermal conductivity (increased by 295% compared to that of the pure BT resin). Furthermore, the Al₂O₃@PI–BT composite were employed to fabricate a printed circuit substrate, on which a frequency “flasher” circuit and electrical components worked well.