Relative sputtering rates of oxides and fluorides of aluminum and yttrium

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• 作者：Dae-Min Kim^a ; Mi-Ran Jang^a ; Yoon-Suk Oh^a ; Seongwon Kim^a ; Sung-Min Lee^a ; ^{smlee@kicet.re.kr} ; Sang-Ho Lee^b
• 关键词：Sputtering yield ; Oxide ; Fluoride ; Plasma etching
• 刊名：Surface and Coatings Technology
• 出版年：2017
• 出版时间：15 January 2017
• 年：2017
• 卷：309
• 期：Complete
• 页码：694-697
• 全文大小：642 K
• 卷排序：309

文摘

Relative sputtering rates of fluoride and oxide of Al and Y were measured. The sputtering rate of fluorides depended strongly on the chemistry, contrary to similar rates of oxides. Oxide cearmics was confirmed to erode by a physical process under fluorine-based plasma.