Thermal analysis of a diffusion bonded Er3+,Yb3+:glass/Co2+: MgAl2O4 microchip lasers
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- 作者：Nabil Belghachem ; nabil.belghachem@wat.edu.pl" class="auth_mail" title="E-mail the corresponding author ; Jaroslaw Mlynczak ; krzysztof Kopczynski ; Zygmunt Mierczyk ; Michal Gawron
- 关键词：Microchip laser ; Q-switched laser ; Heat sink effect ; Thermal expansion ; Von mises stress ; Diffusion bonding ; Thermal focal length
- 刊名：Optical Materials
- 出版年：2016
- 出版时间：October 2016
- 年：2016
- 卷：60
- 期：Complete
- 页码：546-551
- 全文大小：1495 K
文摘
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Thermal analysis of a diffusion bonded Er3+,Yb3+:glass/Co2+:MgAl2O4 microchip laser.
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Heat equation was numerically solved taking into account the effect of both glass and spinel.
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The stresses and deformations were estimated.
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The stress on the bonding interface was particularly analyzed for both wavelengths.
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A solution of reducing the maximum heat and thermal lensing was proposed.