Large scale Molecular Dynamics simulation of microstructure formation during thermal spraying of pure copper
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- 作者：Tao Wanga ; Tao.Wang@rub.de" class="auth_mail" title="E-mail the corresponding author ; Christoph Begaua ; Christoph.Begau@rub.de" class="auth_mail" title="E-mail the corresponding author ; Godehard Sutmanna ; b ; g.sutmann@fz-juelich.de" class="auth_mail" title="E-mail the corresponding author ; Alexander Hartmaiera ; Alexander.Hartmaier@rub.de" class="auth_mail" title="E-mail the corresponding author
- 关键词：Thermal spray ; Coating ; Solidification ; Structural zone ; Molecular Dynamics
- 刊名：Surface and Coatings Technology
- 出版年：2015
- 出版时间：25 October 2015
- 年：2015
- 卷：280
- 期：Complete
- 页码：72-80
- 全文大小：1374 K
文摘
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Thermal spray process is simulated by large-scale Molecular Dynamics method.
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Single and multiple nano-particle spraying processes are simulated.
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Processing parameters that influence the coating structures are investigated.
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Structures are formed by deformation or melting/solidification mechanisms.
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Thermodynamic modeling confirms the similar results as MD predictions.