Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders
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- 作者：Z.L. Ma ; z.ma13@imperial.ac.uk" class="auth_mail" title="E-mail the corresponding author ; S.A. Belyakov ; C.M. Gourlay
- 关键词：Intermetallics ; EBSD ; Orientation relationship ; Pb-free soldering ; Solidification
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：15 October 2016
- 年：2016
- 卷：682
- 期：Complete
- 页码：326-337
- 全文大小：4440 K
文摘
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αCoSn3 is shown to be a grain refiner in large volumes of Sn-3Ag-0.5Cu solder.
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Heterogeneous nucleation occurs with a reproducible orientation relationship and good lattice match.
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αCoSn3 can be used to change the tin nucleation location in solder joints.